Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and production
burn-in equipment, today announced it
has received the first order
for a new high-power configuration of
its FOX-XP™ system for production wafer level
burn-in of next generation silicon photonics
integrated circuits (ICs) from
a current major silicon photonics customer.
This FOX-XP multi-wafer test and burn-in system is
configured to enable cost-effective production test of
the next generation of silicon photonics ICs, which can
require up to two to four times as much power for full wafer
test, burn-in, and stabilization of the silicon photonics
devices. Shipment of this new higher-power configured FOX-XP
is scheduled for the first quarter of 2024.
Gayn Erickson, President and CEO of Aehr Test
Systems, commented, “We are excited to receive this first
order for this system configuration from one of the
world’s largest semiconductor manufacturers and expect them to
order additional production systems as they
ramp capacity for these devices. This new FOX production system
configuration expands the market opportunities of the
FOX-XP system, as it’s able to test, burn-in,
and stabilize up to nine 300mm wafers in
parallel with up to 3.5 kW of power per wafer, which is
beyond the wafer parallelism and power capacity of any system on
the market. The system is also configured to allow
direct docking to Aehr’s new fully automated FOX WaferPak Aligner
and material handling system.
“Multiple major semiconductor suppliers and foundries
have announced their plans to manufacture and integrate silicon
photonics into multi-chip packages, often now referred to as
co-packaged devices or heterogenous integration, such as
high-performance microprocessors, graphics processors, and
processor to peripheral device chipsets. These new
devices have been predicted to dramatically
improve the communication bandwidth between
semiconductor devices beyond the bottle neck of traditional
electrical interfaces used today. The challenge is
that the devices individually can require a long production
burn-in to weed out early failures or long stress
tests to stabilize them before they can be assembled
in the package with the other devices. This drives the need for
high volume, low cost, burn-in of these devices in wafer
form, which is exactly what Aehr’s FOX-XP family of
test and burn-in systems have been proven
to successfully achieve.
“Aehr’s FOX-XP system uses proprietary thermal
chucks with a very high thermally conductive heat
transfer fluid that allows direct thermal conduction
transfer to apply and/or remove the wafer
heat extremely efficiently and uniformly.
This enables the system to control each wafer
temperature very accurately at a
temperature that ensures that the maximum
stress conditions are applied without over stressing any devices in
the middle or at the edges of the wafer where
typical issues would occur on such high-power wafers.
“Our FOX systems use our proprietary and
patented WaferPak full wafer contactors that contact each
device under test using precision current and voltage
sources and independent measurement instruments
to detect and ensure 100%
traceability that every device was tested properly to the
test recipe for voltage, current, power, and temperature.
“The FOX-XP with the optional
fully integrated FOX WaferPak Aligner
uses these proprietary WaferPak full wafer
contactors and enables high volume, hands-free
operation using Front Opening Unified
Pods (FOUPs), factory integration
with SECs/GEM communication protocols, and is
capable of automated material movement of wafer FOUPs with mobile
robots or overhead material handling systems. The integrated
WaferPak Aligner supports 100mm, 150mm, 200mm, and 300mm wafer
sizes using industry standard wafer cassettes and FOUPs,
which allows customers to easily support multiple wafer
sizes and to move and align the wafers automatically
into our proprietary WaferPaks and place the WaferPaks into
and out of our multi-wafer FOX-XP systems that test and
burn-in up to 18 wafers at a time.
“Adding automation through our new Aligner gives our wafer-level
test and burn-in offering even greater value, as well as opens up
several large incremental markets to Aehr such as high-volume
processors and chipsets with integrated photonics transceivers,
flash and DRAM memories, and also higher-mix devices requiring
extremely high reliability and 100% burn-in such as automotive
microcontrollers and sensors.”
The FOX-XP system, available with multiple
WaferPak Contactors (full wafer test) or multiple
DiePak™ Carriers (singulated die/module test) configurations,
is capable of functional test and burn-in/cycling of integrated
devices such as silicon carbide (SiC) power devices, silicon
photonics as well as other optical devices, 2D and 3D sensors,
flash memories, Gallium Nitride (GaN), magnetic sensors,
microcontrollers, and other leading-edge ICs in either wafer form
factor, before they are assembled into single or multi-die stacked
packages, or in singulated die or module form factor.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in semiconductor devices in wafer level,
singulated die, and package part form, and has installed over 2,500
systems worldwide. Increased quality and reliability needs of the
Automotive and Mobility integrated circuit markets are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products in package, wafer level, and
singulated die/module level test. Aehr Test has developed and
introduced several innovative products, including the
ABTS™ and FOX-P™ families of test and burn-in systems and
FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak®
Carrier and FOX DiePak Loader. The ABTS system is used in
production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge silicon carbide-based power semiconductors, memories,
digital signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The FOX-CP
system is a new low-cost single-wafer compact test and reliability
verification solution for logic, memory and photonic devices and
the newest addition to the FOX-P product family. The WaferPak
Contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Safe Harbor StatementThis press release
contains certain forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934. Forward-looking statements
generally relate to future events or Aehr’s future financial or
operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
"may," "will," "should," "expects," "plans," "anticipates,” “going
to,” "could," "intends," "target," "projects," "contemplates,"
"believes," "estimates," "predicts," "potential," or "continue," or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. Forward-looking statements in this press release
include, but are not limited to, future requirements and orders of
Aehr’s new and existing customers; bookings forecasted for
proprietary WaferPak™ and DiePak consumables; and expectations
related to long-term demand for Aehr’s productions and the
attractiveness of key markets. The forward-looking statements
contained in this press release are also subject to other risks and
uncertainties, including those more fully described in Aehr’s
recent Form 10-K, 10-Q and other reports filed from time to time
with the Securities and Exchange Commission. Aehr disclaims any
obligation to update information contained in any forward-looking
statement to reflect events or circumstances occurring after the
date of this press release.
Contacts:
Aehr
Test SystemsVernon RogersEVP of Sales & Marketing(510)
623-9400 x215vrogers@aehr.com |
MKR
Investor Relations Inc.Todd Kehrli or Jim
ByersAnalyst/Investor Contact(213) 277-5550aehr@mkr-group.com |
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