Product development teams achieve more with new
capabilities from Ansys
/ Key Highlights
- With the newly launched Ansys 2023 R1, engineers can simulate
more complex products faster than ever via new cloud options and
optimized use of multiple graphics processing units (GPUs)
- The new release amplifies the benefits of simulation by
supporting collaborative, model-based systems engineering (MBSE)
workflows
- Expanded integration of artificial intelligence/machine (AI/ML)
and other advanced technologies boost efficiency and improve the
user experience
PITTSBURGH, Jan. 26,
2023 /PRNewswire/ -- The software and service
improvements in Ansys (NASDAQ: ANSS) 2023 R1 concentrate
and amplify the incredible advantages that engineering simulation
provides to multidisciplinary engineering and R&D teams. Ansys
2023 R1 enables organizations to accelerate past complexity and
integration challenges to design the next generation of
world-changing products by taking advantage of performance
improvements, cross-discipline workflow integrations, and
innovative capabilities.
"Simulation enables design teams to advance in the right
direction by quickly and confidently making decisions that define
market leaders," said Shane
Emswiler, vice president of products at Ansys. "Our latest
advancements help engineers magnify their success through greater
precision, streamlined workflows, and cloud scalability."
Enhance Simulation Performance
The Structures product
collection delivers new features and capabilities that allow
users to perform more predictively accurate, efficient, and
customizable simulation analyses. For example, a new capability
within Ansys® Mechanical™ enables users to leverage
AI/ML to determine the computational spend and time required to run
a simulation.
Ansys 2023 R1 also empowers users to run large, high-fidelity
simulations more efficiently by overcoming hardware capacity
limitations with high-performance computing (HPC) and by employing
enhanced solver algorithms that take advantage of GPUs.
The full release of the multi-GPU solver in Ansys®
Fluent® computational fluid dynamics (CFD) software
unleashes the power of multiple GPUs for a broad spectrum of
applications — substantially reducing solve time and total
power consumption. This full release adds support for species
transport, non-stiff reacting flows, and enhanced numeric for large
eddy simulation (LES).
Ansys Gateway powered by AWS enables developers, designers,
and engineers to manage their complete Ansys simulation and
computer-aided design engineering (CAD/CAE) projects from anywhere
on virtually any device via a web browser. The new release allows
design teams to create or resize virtual machines and HPC clusters
quickly, while streamlining access for teams via AWS cloud
subscriptions and flexible single sign-on features for access to
company environments.
Integrate and Automate Workflows
Ansys 2023 R1 also
builds on the capabilities of materials, simulation process and
data management (SPDM), optimization, and MBSE to improve
engineering efficiency by supporting intelligent workflow
automation and collaboration. The Ansys Connect product collection
boasts user experience improvements, new integrations, and
ease-of-use features to connect the latest processes, tools, and
data more readily for different engineering teams.
"We believe that the integration of Ansys simulation tools and
MBSE gives us visibility into the entire design process, reducing
development costs, improving engineering efficiency, driving
innovation, and designing competitive products," said Takeo Hashimoto, general manager of the MBSE
Design Center at Hitachi Industry & Control Solutions. "With
Ansys tools and Hitachi Industry & Control Solutions'
MBSE-focused engineering, we will support autonomous development in
the automotive field and help customers solve their manufacturing
issues in a more connected society."
Engineers can boost efficiency faster with "one-click"
Ansys® optiSLang™ optimization of simulation toolchains
to perform design studies that enable engineers to quickly explore
optimal designs. Those same optimization algorithms run trade
studies for MBSE in Ansys ModelCenter. Fluent users can also use
optimizations from optiSLang along with smarter collaboration and
data management using Ansys Minerva's SPDM solution.
Innovate Across the Product Development Process
In
semiconductors, Ansys continues to deliver 3D-IC multiphysics
leadership with Ansys® RedHawk-SC™ and RedHawk-SC
Electrothermal included in TSMC's 3Dblox™ Reference Flow for power
integrity, signal integrity, and thermal reliability signoff. A new
thermal analysis methodology for RedHawk-SC Electrothermal uses
half as much memory so that complex designs can be handled more
efficiently. New performance and predictive accuracy improvements
are obtained with updated RTL power predictability in
Ansys® PowerArtist™. A 30% reduction in RedHawk-SC's
database size enables engineers to solve complex designs more
efficiently, and 2X faster transient simulations in RedHawk-SC
speed time to solution.
Ansys® Granta™ features material eco-data and tools
that are now available on the cloud, which help optimize material
selection for more cost-effective, sustainable products.
In the Ansys Electronics collection, users can accelerate
finite-sized antenna array simulations by adapting individual 3D
component cells in parallel. This remarkable technology is
unmatched in the industry and will empower organizations designing
antennas for satellite communications, automotive radar, and
aerospace applications.
"Kymeta develops exciting and innovative product offerings in
our pursuit of global satellite and cellular broadband
communications on the move, and Ansys plays a key role in enabling
technology introduction of new antenna and mechanical hardware
ranging from microelectronics to thermomechanical structures,"
said Paul Klassen, vice president of engineering at Kymeta.
"We use the extensive toolset in Mechanical, Fluent, and HFSS to
explore optimal designs, and are incorporating Granta and Sherlock
into our product development process while optimizing designs for
harsh vibration and thermal environments in industrial, commercial,
and consumer applications."
To learn more about Ansys 2023 R1, please visit:
ansys.com/products/release-highlights.
/ About Ansys
When visionary companies need to know how their world-changing
ideas will perform, they close the gap between design and reality
with Ansys simulation. For more than 50 years, Ansys software has
enabled innovators across industries to push boundaries by using
the predictive power of simulation. From sustainable transportation
to advanced semiconductors, from satellite systems to life-saving
medical devices, the next great leaps in human advancement will be
powered by Ansys.
Take a leap of certainty … with Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS-T
/ Contacts
Media
|
Mary Kate
Joyce
|
|
724.820.4368
|
|
marykate.joyce@ansys.com
|
|
|
Investors
|
Kelsey
DeBriyn
|
|
724.820.3927
|
|
kelsey.debriyn@ansys.com
|
View original content to download
multimedia:https://www.prnewswire.com/news-releases/new-ansys-2023-release-amplifies-product-design-and-engineering-success-for-customers-across-industries-301731495.html
SOURCE Ansys