CyberOptics Receives New Orders for Memory Module and Micro LED Inspection and Metrology Systems
18 March 2020 - 7:00PM
Business Wire
CyberOptics Corporation® (Nasdaq: CYBE), a leading global
developer and manufacturer of high precision 3D sensing technology
solutions, today announced that it has received orders valued at
approximately $2.8 million for its 2D MX600™ system for
post-singulation inspection of memory modules. CyberOptics
presently anticipates that these orders will become revenue in the
third quarter of 2020.
In addition, CyberOptics has also received an order valued at
approximately $1.2 million for its Multi-Reflection Suppression™
(MRS™) enabled SQ3000™ Multi-Function systems for Automated Optical
Inspection (AOI), Solder Paste Inspection (SPI) and Coordinate
Measurements (CMM). The systems, which will be used in the scale up
for production of micro LED-based technology, are expected to
become revenue in the second quarter of 2020. CyberOptics
anticipates that it will receive additional orders for its SQ3000
Multi-Function systems for inspection and metrology related to
micro LED technology as 2020 progresses.
About CyberOptics CyberOptics Corporation
(www.cyberoptics.com) is a leading global developer and
manufacturer of high-precision 3D sensing technology solutions.
CyberOptics’ sensors are used for inspection and metrology in the
SMT and semiconductor markets to significantly improve yields and
productivity. By leveraging its leading edge technologies, the
Company has strategically established itself as a global leader in
high precision 3D sensors, allowing CyberOptics to further increase
its penetration of key vertical markets. Headquartered in
Minneapolis, Minnesota, CyberOptics conducts worldwide operations
through its facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: market conditions in the global SMT
and semiconductor capital equipment industries; trade relations
between the United States and other countries; the timing of orders
and shipments of our products, particularly our 3D MRS-enabled AOI
systems; increasing price competition and price pressure on our
product sales, particularly our SMT systems; the level of orders
from our OEM customers; the availability of parts required to meet
customer orders; unanticipated product development challenges; the
effect of world events on our sales, the majority of which are from
foreign customers; rapid changes in technology in the electronics
and semiconductor markets; product introductions and pricing by our
competitors; the success of our 3D technology initiatives; the
market acceptance of our SQ3000 Multi-Function inspection and
measurement systems and products for semiconductor advanced
packaging inspection and metrology; costly and time consuming
litigation with third parties related to intellectual property
infringement; the negative impact on our customers and suppliers
due to pandemics (including the current coronavirus outbreak) and
the corresponding negative effects on our revenue and operating
results; and other factors set forth in the Company’s filings with
the Securities and Exchange Commission.
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version on businesswire.com: https://www.businesswire.com/news/home/20200318005077/en/
Jeffrey A. Bertelsen, Chief Financial Officer 763-542-5000
Carla Furanna, Head of Global Marketing 952-820-5837
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