SHANGHAI, March 24,
2025 /PRNewswire/ -- DuPont will showcase how we are
shaping the next generation of electronics at the International
Electronic Circuits (Shanghai)
Exhibition 2025. With a diverse portfolio of advanced circuit
materials and solutions designed to push the limits of fine-line
technology, signal integrity, and thermal management, DuPont will
be exhibiting in Booth #8A31 at National
Exhibition and Convention Center (NECC) from March 24-26.
"As artificial intelligence (AI), machine learning, and 5G
technologies continue to advance, the demand for high-performance
devices is propelling innovations in packaging substrates and
high-end PCBs," said Yuan Yuan Zhou, Global Business Director,
Advanced Circuit & Packaging, DuPont. "With our cutting-edge
materials and integrated solutions, we are helping PCB
manufacturers meet the increasing needs for miniaturization,
integration, and performance, paving the way for the next
generation of AI-driven substrates. Our advancement in interconnect
materials plays a critical role in enabling AI infrastructure to
optimize speed, efficiency, and reliability."
DuPont is leveraging decades of expertise in material science to
address the evolving demands of the rapidly expanding IC substrate
and high-end PCB market, fueled by the surge from AI servers and
data centers, networking, autonomous vehicles, and 5G. The IC
substrate offerings encompass a wide array of solutions, including
dielectrics, metallization chemistries for electroless copper seed
layer, redistribution layer, copper pillars, solder bumps, and dry
film imaging photoresists. This comprehensive portfolio tackles
critical challenges in performance, miniaturization, reliability,
and cost efficiency.
At the show, DuPont experts will be available at the company's
booth to share their in-depth knowledge on technological
innovations and industry trends. Attendees can explore DuPont's
comprehensive solutions for the PCB market, featuring the following
product offerings:
DuPont™ Circuposit™ SAP8000 electroless copper is an
innovative SAP metallization technology designed for AI server CPU
or GPU chip applications. This ionic-based catalyst electroless
copper process is optimized for advanced packaging. It meets the
demands for low-roughness dielectrics as well as low dielectric
constant (Dk) and low dissipation factor (Df) properties essential
for fine-line and high-frequency designs.
DuPont™ Microfill™ SFP-II-M acid
plating copper is a novel pattern
plating solution specifically designed to optimize pattern
distribution for large AI chips. It is engineered to deliver
consistent pattern distribution across large unit sizes, making it
ideal for high-performance computing applications.
DuPont™ Riston® DI1600 & DI1600M dry film
photoresist is an advanced fine line direct imaging
photoresist solution specifically designed for IC substrate
applications. It boasts exceptional fine line adhesion and
resolution, paired with high-yield performance.
DuPont™ Riston® DWB8100M dry
film photoresist is a high-performance direct imaging
solution tailored for fine copper pillar and thick copper mSAP
applications. It offers excellent fine line and via resolution,
with strong bottom adhesion to minimize underplating risks. It
ensures stable yield performance while providing a straight dry
film and copper trace profile with low trace voids, making it
optimal for advanced IC substrate applications.
About DuPont
DuPont (NYSE: DD) is a global innovation leader with
technology-based materials and solutions that help transform
industries and everyday life. Our employees apply diverse science
and expertise to help customers advance their best ideas and
deliver essential innovations in key markets including electronics,
transportation, construction, water, healthcare and worker safety.
More information about the company, its businesses and solutions
can be found at www.dupont.com. Investors can access information
included on the Investor Relations section of the website at
investors.dupont.com.
DuPont™, the DuPont Oval Logo, and all trademarks and service
marks denoted with ™, SM or ® are owned
by affiliates of DuPont de Nemours, Inc. unless otherwise
noted.
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SOURCE DuPont
