BAE Systems Awarded a $60 Million Contract to Expand Domestic Supply of State-of-the-art Microelectronics Technology
20 January 2022 - 2:00AM
Business Wire
BAE Systems has been awarded a $60 million contract from the
Army Contracting Command – Rock Island under the Cornerstone Other
Transaction Authority to develop certain types of next-generation,
radiation hardened by design (RHBD) microelectronics leveraging
Intel Corporation’s commercial foundry, Intel Foundry Services. The
main goal of the program is to expand onshore access to
state-of-the-art microelectronics technology for the United States
government and aerospace community.
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BAE Systems to develop next-generation
radiation hardened by design (RHBD) microelectronics. (Photo: BAE
Systems)
Currently, this type of technology is available through limited
sources in the U.S. This leads to supply chain challenges and time
lags for the delivery of next-generation microelectronics designed
for environmentally rugged missions like those occurring in space.
With this contract, BAE Systems’ FAST LabsTM research and
development organization will harness Intel’s commercial foundry
process to build a new design library that can be used to develop
advanced, high-reliability microelectronics and expand the domestic
supply of this technology for the defense and aerospace
community.
“Radiation hardened electronics are highly specialized mission
critical technology,” said Chris Rappa, director at BAE Systems’
FAST Labs. “Leveraging Intel’s commercial foundry to manufacture
this technology can speed up the production of next-generation
technology and help resolve supply chain challenges so we can
maintain our country’s technological edge.”
This award opens a roadmap for the U.S. defense and aerospace
community to access more advanced process nodes for the development
of Application Specific Integrated Circuits (ASIC). Currently,
development of RHBD ASICs uses a 45nm process, but with this
contract there is potential to deploy more advanced technology
nodes and enable more functionality and faster processing in
smaller areas, at lower power.
In addition to working with Intel Foundry Services, BAE Systems
will execute on this program through collaboration with a team
composed of Cadence Design Systems, Carnegie Mellon University,
Movellus, Reliable MicroSystems, and Sandia National
Laboratories.
This work builds on the company’s longstanding heritage of
delivering electronics capable of successfully completing missions
in the most challenging environments. BAE Systems will perform work
on the program at its facilities in Merrimack, N.H. and Manassas,
Va.
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Paul Roberts, BAE Systems Mobile: 603-521-2381
paul.a.roberts@baesystems.com
www.baesystems.com/US @BAESystemsInc
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