New GE COM Express Modules Provide New Levels of Performance to Rugged Applications Constrained by Power Consumption and Size
05 March 2015 - 2:00AM
Business Wire
- NVIDIA Tegra K1 GPU enables delivery of
326 GFLOPS, power consumption of <10 watts
- Latest R-Series System-on-Chip (SoC)
from AMD provides superior throughput
- Provides “GERugged” reliability in
harsh environments
GE’s Intelligent Platforms business (NYSE:GE) has announced two
additions to its growing family of COM Express modules: the mCOM
10K1 Type 10 Mini COM Express Module used in data intensive
environments, and the bCOM6-L1700 Type 6 COM Express Module for use
in applications with extensive graphics needs.
The mCOM10K1 Type 10 Mini COM Express Module is based on the
NVIDIA® Tegra® K1 system-on-chip (SOC) - enabling it to deliver 326
GFLOPS of performance, well beyond the performance typically
associated with Mini COM Express, and is ideal for applications
where very high performance in data-intensive applications, rugged
reliability in harsh environments and very compact size need to be
combined.
As well as extending GE’s COM Express offering still further,
the mCOM10K1 also brings GE’s powerful GPGPU (general purpose
processing on a graphics processor) capability within reach of the
significant number of applications where power consumption needs to
be 10 watts or less.
The fully rugged bCOM6-L1700 Type 6 COM Express Module features
the latest R-Series System-on-Chip (SoC) from AMD, providing it
with not only superior throughput but also extensive graphics
capabilities. It is differentiated from ‘commodity’ COM Express
modules by its high performance, extreme durability and low
lifetime cost of ownership.
The bCOM6-L1700 is available in two performance/watt variations,
and is the first of its type to offer up to 16 GBytes of soldered
memory.
Both the mCOM10K1 and bCOM6-L1700 feature on-board components
that are specifically selected for their reliability in demanding
conditions. Unlike solutions designed for benign environments, the
processor and memory are soldered to the board for maximum
resistance to shock and vibration. Extended mechanical construction
protects the module, which is designed for optional conformal
coating to provide additional resistance to moisture, dust,
chemicals, and temperature extremes.
Their inherently rugged design and construction make both
modules ideal for deployment in challenging harsh environments -
that are subject to extremes of temperature, vibration and shock -
in which maximum uptime is mission-critical such as heavy industry,
transportation, military/aerospace, energy exploration and so
on.
“GPGPU technology has been widely adopted in a broad range of
applications, spanning such diverse disciplines as healthcare,
astronomy, machine learning, and artificial intelligence,” said
Simon Collins, Product Manager at GE’s Intelligent Platforms
business. “Much of this work has taken place in the cloud or on big
server hardware; low-end hardware has previously required about 100
Watts supply. The Tegra K1 at the heart of the mCOM10K1 delivers a
significant opportunity to exploit GPGPU technology on a scale that
was previously unimaginable, creating a sophisticated processing
capability at the edge nodes of the network.”
“The COM Express architecture is rapidly gaining traction
because, by separating the carrier card from the processor, it
extends the useful life of the subsystem by allowing simple,
cost-effective upgrade of the processor alone,” said Tommy Swigart,
Product Manager at GE’s Intelligent Platforms business. “This
reduces long term cost of ownership while ensuring that performance
keeps pace with changing needs.”
“Historically, however, COM Express has not been considered for
deployment in the most physically challenging environments because
sufficiently rugged implementations were not available,” continued
Swigart. “The bCOM6-L1700 changes that, bringing not only high
performance but also the ability to operate successfully in almost
any location.”
See:
http://www.geautomation.com/products/mcom10-k1-mini-com-express
http://www.geautomation.com/products/bcom6-l1700-rugged-com-express-module
About GE’s Intelligent Platforms business
GE’s Intelligent Platforms business (NYSE:GE) is headquartered
in Charlottesville, VA and part of GE Energy Management. The
company’s work in the military/aerospace segment, headquartered in
Huntsville, AL, and Towcester, England, provides one of the
industry’s broadest ranges of high performance, rugged,
SWaP-optimized embedded computing platforms. Backed by programs
that provide responsive customer support and minimize long term
cost of ownership for multi-year programs, GE’s solutions are
designed to help customers minimize program risk and cost, and to
speed time-to-market. For more information, visit
geembedded.com.
NVIDIA, Tegra and CUDA are registered trademarks or trademarks
of NVIDIA Corporation. All other trademarks are the property of
their respective owners.
For more information, including hi res image, contact:GE
Intelligent PlatformsIan McMurray, +44 (0) 1327 322821Media
Relations Managerian.mcmurray@ge.com
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