NEW YORK, Jan. 27, 2015 /PRNewswire/ -- Flip chips are
appearing in a plethora of high-volume consumer products such as
mobile phones, digital cameras, MP3 players, and computer
peripherals. Wafer-level packaging (WLP), the fabrication of the
package directly on the wafer, is experiencing exceptional growth
and stands out as one of the bright growth areas in electronics
today. WLP offers lower cost, a smaller package, higher performance
and added functionality compared to older methods. This report
examines the market for flip chip ICs, and the lithography and wet
etch tools used in their manufacture.
Total flip chip sales represented 11% of worldwide IC production in
2010 but will grow to more than 18% in 2017 Flip chip comprised
only 5% of IC production in 2005.
Equipment vendors are taking advantage of the booming market.
Overall semiconductor front-end (before the flip chip packaging
steps) equipment sales will exhibited a growth rate 4% between 2010
and 2013. In contrast, sputtering and copper electrodeposition
equipment, main sectors of the flip chip equipment market,
exhibited a growth rate of 17%.
Why is flip chip projected to grow so strongly? It is widely
understood that flip chips offer a variety of benefits compared to
traditional wire-bond packaging, including superior thermal and
electrical performance.
In the world of high-speed/high-performance IC and package design,
flip chips are appearing in a plethora of high-volume consumer
products such as mobile phones, digital cameras, MP3 players, and
computing. In Apple Computer's (AAPL) iPad, 20% of the ICs on the
motherboard are made up of flip chip packages. The same percentage
holds for the Motorola (MOT) Android. For mobile devices, the
market is projected to grow at a CAGR of 30%, from a little more
than 500 million ICs in 2010 to 1.9 billion in 2015 – a huge growth
rate compared to less than a 10% growth rate for overall ICs.
A $500 million lithography market in
2017
Read the full report:
http://www.reportlinker.com/p02244721-summary/view-report.html
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visit:http://www.prnewswire.com/news-releases/lithography-deposition-and-etch-market-analysis-for-flip-chipwlp-manufacturing-300026327.html
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