CyberOptics Receives Additional Orders for MX600 Memory Module Inspection Systems
26 March 2020 - 8:00AM
Business Wire
CyberOptics Corporation® (Nasdaq: CYBE), a leading global
developer and manufacturer of high precision 3D sensing technology
solutions, today announced that it has received additional orders
valued at approximately $1.6 million for its 2D MX600™ system for
post-singulation inspection of memory modules. CyberOptics
presently anticipates that these orders will become revenue in the
second half of 2020.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading
global developer and manufacturer of high-precision 3D sensing
technology solutions. CyberOptics’ sensors are used for inspection
and metrology in the SMT and semiconductor markets to significantly
improve yields and productivity. By leveraging its leading edge
technologies, the Company has strategically established itself as a
global leader in high precision 3D sensors, allowing CyberOptics to
further increase its penetration of key vertical markets.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts
worldwide operations through its facilities in North America, Asia
and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: market conditions in the global SMT
and semiconductor capital equipment industries; trade relations
between the United States and other countries; the timing of orders
and shipments of our products, particularly our 3D MRS-enabled AOI
systems; increasing price competition and price pressure on our
product sales, particularly our SMT systems; the level of orders
from our OEM customers; the availability of parts required to meet
customer orders; unanticipated product development challenges; the
effect of world events on our sales, the majority of which are from
foreign customers; rapid changes in technology in the electronics
and semiconductor markets; product introductions and pricing by our
competitors; the success of our 3D technology initiatives; the
market acceptance of our SQ3000 Multi-Function inspection and
measurement systems and products for semiconductor advanced
packaging inspection and metrology; costly and time consuming
litigation with third parties related to intellectual property
infringement; the negative impact on our customers and suppliers
due to pandemics (including the current coronavirus outbreak) and
the corresponding negative effects on our revenue and operating
results; and other factors set forth in the Company’s filings with
the Securities and Exchange Commission.
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version on businesswire.com: https://www.businesswire.com/news/home/20200325005582/en/
Jeffrey A. Bertelsen, Chief Financial Officer 763-542-5000
Carla Furanna, Head of Global Marketing 952-820-5837
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