MIPS Technologies and Tensilica Team to Accelerate SOC Design Activity on Android(TM) Platform; Plan Joint Demos at CES
18 December 2009 - 12:00AM
Marketwired
MIPS Technologies, Inc. (NASDAQ: MIPS) and Tensilica® Inc. today
announced they are working together to accelerate SOC
(system-on-chip) design activity on the popular Android™ platform.
Together, MIPS and Tensilica will help companies speed the design
of new home entertainment and mobile consumer products based on
Android. A joint demo of a MIPS32® processor core integrated with
Tensilica's HiFi 2 Audio DSP will be on display in suites that both
companies have at the Consumer Electronics Show (CES) in Las Vegas,
January 7-10, 2010.
"As we continue to push Android into a broad range of consumer
electronic products, we are building a complete partner
infrastructure to offer a total MIPS-Based Android solution to
designers of next-generation connected devices," stated Art Swift,
vice president of marketing for MIPS Technologies. "Tensilica's
HiFi 2 Audio DSP is an ideal audio processor because it is proven
in millions of consumer devices, has low power consumption, and
comes with a comprehensive library of over 60 audio codecs for just
about any standard from simple MP3 to Dolby® and DTS, plus a full
suite of partner solutions for audio post processing."
"We are impressed with the roadmap MIPS Technologies has put
together for Android and its vision that will enable a new
generation of connected multimedia devices," stated Mahesh
Venkatraman, vice president of marketing, vertical segments, for
Tensilica. "By working with MIPS, we can provide chip designers
with a proven high-quality audio solution that will span connected
devices ranging from mobile wireless phones to low-cost digital
picture frames, high-definition DTVs, set-top boxes, Blu-ray disc
players and more."
MIPS Technologies will display the jointly developed technology
at CES in its suite at the Las Vegas Hilton. To schedule an
appointment to see the demo, please contact info@mips.com.
Tensilica will display the jointly developed technology at CES
in its suite in the South Hall of the Las Vegas Convention Center,
suite South 4 35567MP. To schedule an appointment to see the demo,
please contact paula@tensilica.com.
About Android on MIPS
Leveraging its leadership position in the digital home, MIPS
Technologies is spearheading efforts to make Android a reality for
a wide range of consumer electronic devices. With Android and the
dynamic open source development community around it, developers can
easily and quickly create new applications, and OEMs can leverage a
fast-growing set of applications for their devices. The MIPS®
ecosystem around Android enables OEMs to quickly optimize Android
for their specific platforms and debug their solutions across the
entire software stack. For more information about the Android
platform and MIPS, or to access the full source code for MIPS
Technologies' port of Android to the MIPS32® architecture,
including a reference binary and documentation, please visit
www.mips.com/android or email android@mips.com.
About HiFi 2 Audio from Tensilica
Today's audio requirements range from low-power MP3 playback to
high-performance home-theater multi-channel playback of recorded
media. Tensilica's HiFi 2 Audio DSP is the only audio core that
covers the complete range. That's why five of the top 10
semiconductor companies have picked Tensilica's HiFi 2 Audio DSP
for their products. For more information, see
www.tensilica.com/products/audio.htm.
About MIPS Technologies, Inc.
MIPS Technologies, Inc. (NASDAQ: MIPS) is a leading provider of
industry-standard processor architectures and cores that power some
of the world's most popular products for the home entertainment,
communications, networking and portable multimedia markets. These
include broadband devices from Linksys, DTVs and digital consumer
devices from Sony, DVD recordable devices from Pioneer, digital
set-top boxes from Motorola, network routers from Cisco, 32-bit
microcontrollers from Microchip Technology and laser printers from
Hewlett-Packard. Founded in 1998, MIPS Technologies is
headquartered in Sunnyvale, California, with offices worldwide. For
more information, contact (408) 530-5000 or visit www.mips.com.
About Tensilica
Tensilica, Inc. -- the leader in customizable dataplane
processors -- is a semiconductor IP licensor recognized by the
Gartner Group as the fastest growing semiconductor IP supplier in
2008. Dataplane Processor Units (DPUs) combine the best
capabilities of CPUs and DSPs while delivering 10-to-100-times the
performance because they can be customized using Tensilica's
automated design tools to meet specific dataplane performance
targets. Tensilica's DPUs power SOC designs at system OEMs and five
out of the top 10 semiconductor companies for products including
mobile phones, consumer electronics devices (including digital TV,
Blu-ray Disc players, broadband set top boxes and portable media
players), computers, and storage, networking and communications
equipment. For more information on Tensilica's patented,
benchmark-proven DPUs visit www.tensilica.com.
Editors' Notes:
Tensilica and Xtensa are registered trademarks belonging to
Tensilica, Inc. MIPS, MIPS32, 1004K and MIPS-Based are trademarks
or registered trademarks in the United States and other countries
of MIPS Technologies, Inc. Dolby is a registered trademark of Dolby
Laboratories. Android is a trademark of Google, Inc. Use of this
trademark is subject to Google Permissions. All other company and
product names mentioned are trademarks and/or registered trademarks
of their respective owners.
Press Contacts: Paula Jones (408) 327-7343 Email Contact Erika
Powelson (831) 424-1811 Email Contact Jen Bernier (408) 530-5178
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