Bruker Wins Over $7 Million in SP9900+ 3D Optical Microscope Orders
03 December 2012 - 11:00PM
Business Wire
Bruker announced today that it has already received more than $7
million in orders for its new Bruker SP9900+ high-throughput
high density interconnect (HDI) substrate metrology system, and has
begun shipping the product in volume. The SP9900+ Large Format
3D Optical Microscope is specially designed for the
semiconductor packaging industry and offers major advantages over
previous generations of optical microscope technology. Dramatic
improvements in inspection throughput are provided by the system’s
areal coverage of up to 600x600 millimeters and traverse speeds up
to 50 millimeters per second.
Bruker SP9900+ 3D Optical Microscope
(Photo: Business Wire)
“Manufacturers of multichip modules (MCM) and high pin count
semiconductor chips are continually increasing panel sizes,
reducing feature sizes and increasing the pin count of their
products, which creates new challenges in process control for
high-volume production,” said Mark R. Munch, President, Bruker MAT
Group and Bruker Nano Surfaces Division. “The most important areas
typically involve measurement of traces, vias, and interconnects,
as well as the surface roughness of copper and Ajinomoto build-up
film. Working closely with our customers, we’ve been able to reduce
the ‘time to measurement’ for these critical inspection challenges
to less than one half of previous generation systems.”
“The new SP9900+ provides radical improvements in
measurement speed due to its faster traverse speeds, faster
autofocusing, faster camera, revolutionary fixture-loading
mechanism and augmented auto intensity function,” added Rob
Loiterman, Executive Vice President and General Manager of Bruker’s
Stylus and Optical Metrology Business. “We’ve optimized the system
to maximize factory throughput while ensuring the most accurate
measurements which should help our customers improve yield and keep
lowering the cost of consumer electronics.”
About SP9900+ HDI Substrate Metrology System
The SP9900+ incorporates years of packaging and panel
measurement experience to provide unprecedented speed, metrology
capability, reliability, serviceability, and manufacturing
readiness for 3D critical dimension measurements in MCM and HDI
printed circuit board (PCB) applications. Bruker 3D Optical
microscopes feature Vision® operating and analysis software, and
the industry’s most intuitive, modular user interface to deliver
user-level-customization capabilities for the widest possible range
of surface profiling metrology applications. The SP9900+
utilizes a revolutionary gantry design to deliver results in a
600x600-millimeter measurement envelope. Moreover, the
SP9900+ delivers all these benefits within virtually the
same footprint as previous generation SP profilers.
About Bruker Corporation (NASDAQ: BRKR)
Bruker Corporation is a leading provider of high-performance
scientific instruments and solutions for molecular and materials
research, as well as for industrial and applied analysis. For more
information about Bruker Corporation, please visit
www.bruker.com.
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