Measurement Specialties Opens New Greenfield Facility in Chengdu
24 July 2014 - 10:15PM
Measurement Specialties, Inc. (Nasdaq:MEAS), (the "Company"), a
global designer and manufacturer of sensors and sensor-based
systems, held the grand opening of their new West China R&D and
Manufacturing Center in Chengdu today. The company hosted various
dignitaries at the ceremony, including Mr. Peter Haymond, Consul
General for the US Consulate in Chengdu.
In comments made at the opening ceremonies at the Chengdu
Industrial Park, MEAS CEO, Frank Guidone, stated that the 130,000
square foot facility is expected to grow from 550 employees
currently to ~2,000 employees within the next 5 years, supporting
the Company's growth in China and worldwide. The Chengdu
operation boasts a 98% on-time delivery record which Mr. Guidone
attributes, in large part, to the talented and dedicated Chengdu
workforce.
Mr. Guidone commented, "The establishment of our West China
R&D/Manufacturing Center in Chengdu marks a major expansion of
our presence in China. The facility will provide capacity to
support our operational and development growth requirements for the
next several years."
MEAS began operations in China in 1995 when it established its
facility in Shenzhen, which today supports 1800 employees. The
Company entered Chengdu in 2009 through the acquisition of ATEXIS
which established operations in Chengdu in 2005. Since the
acquisition, the Chengdu facility has grown revenue
six-fold. MEAS China holds High-Tech Enterprise status at both
the Shenzhen city and China state levels, confirming its position
as a leading innovation company in China's technology-based
manufacturing sector.
About Measurement Specialties: Measurement
Specialties, Inc. (MEAS) designs and manufactures sensors and
sensor-based systems to measure precise ranges of physical
characteristics such as pressure, temperature, position, force,
vibration, humidity and photo optics. MEAS uses multiple
advanced technologies – piezo-resistive silicon sensors,
application-specific integrated circuits, micro-electromechanical
systems ("MEMS"), piezoelectric polymers, foil strain gauges, force
balance systems, fluid capacitive devices, linear and rotational
variable differential transformers, electromagnetic displacement
sensors, hygroscopic capacitive sensors, ultrasonic sensors,
optical sensors, negative thermal coefficient ("NTC") ceramic
sensors, mechanical resonators and submersible hydrostatic level
sensors – to engineer sensors that operate precisely and cost
effectively.
CONTACT: Mark Thomson, CFO
(757) 766-4224
(MM) (NASDAQ:MEAS)
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