Micron MRDIMM Innovations Deliver Highest Performance and Lowest Latency Main Memory to Accelerate Data Center Workloads
16 July 2024 - 11:02PM
Micron Technology, Inc. (Nasdaq: MU), today announced it is now
sampling its multiplexed rank dual inline memory module (MRDIMMs).
The MRDIMMs will enable Micron customers to run increasingly
demanding workloads and obtain maximum value out of their compute
infrastructure. For applications requiring more than 128GB of
memory per DIMM slot, Micron MRDIMMs outperform current TSV RDIMMs
by enabling the highest bandwidth, largest capacity with the lowest
latency and improved performance per watt to accelerate
memory-intensive virtualized multi-tenant, HPC and AI data center
workloads.1 The new memory offering is the first generation in the
Micron MRDIMM family and will be compatible with Intel® Xeon® 6
processors.
“Micron’s latest innovative main memory solution, MRDIMM,
delivers the much-needed bandwidth and capacity at lower latency to
scale AI inference and HPC applications on next-generation server
platforms,” said Praveen Vaidyanathan, vice president and general
manager of Micron’s Compute Products Group. “MRDIMMs significantly
lower the amount of energy used per task while offering the same
reliability, availability and serviceability capabilities and
interface as RDIMMs, thus providing customers a flexible solution
that scales performance. Micron’s close industry collaborations
ensure seamless integration into existing server infrastructures
and smooth transitions to future compute platforms.”
By implementing DDR5 physical and electrical standards, MRDIMM
technology delivers a memory advancement that allows scaling of
both bandwidth and capacity per core to future-proof compute
systems and meets the expanding demands of data center workloads.
MRDIMMs provide the following advantages over RDIMMs: 2
- Up to 39% increase in effective memory bandwidth2
- Greater than 15% better bus efficiency2
- Up to 40% latency improvements compared to RDIMMs3
MRDIMMs support a wide capacity range from 32GB to 256GB in
standard and tall form factors (TFF), which are suitable for
high-performance 1U and 2U servers. The improved thermal design of
TFF modules reduces DRAM temperatures by up to 20 degrees Celsius
at the same power and airflow,4 enabling more efficient cooling
capabilities in data centers and optimizing total system task
energy for memory-intensive workloads. Micron’s industry-leading
memory design and process technology using 32Gb DRAM die enables
256GB TFF MRDIMMs to have the same power envelope as 128GB TFF
MRDIMMs using 16Gb die. A 256GB TFF MRDIMM provides a 35%
improvement in performance over similar-capacity TSV RDIMMs at the
maximum data rate.5 With 256GB TFF MRDIMMs, data centers can drive
unprecedented TCO benefits over TSV RDIMMs.
“By leveraging DDR5 interfaces and technology, MRDIMMs provide
seamless compatibility with existing Xeon 6 CPU platforms, giving
customers flexibility and choice,” said Matt Langman, vice
president and general manager of Datacenter Product Management,
Intel Xeon 6 at Intel. “MRDIMMs provide customers a full choice of
higher bandwidth, lower latencies and capacity points for HPC, AI
and a plethora of workloads, all on the same Xeon 6 CPU platforms
that also support standard DIMMs. Our customers will benefit from
Micron’s broad portfolio of MRDIMMs ranging from 32GB to 256GB
densities and in standard and tall form factors that will be
validated with Intel Xeon 6 platforms.”
"As processor and GPU vendors have given us exponentially more
cores, the memory bandwidth required to deliver balanced system
performance has lagged. Micron MRDIMMs will help close the
bandwidth gap for memory-intensive workloads like AI inference, AI
retraining and countless high-performance computing workloads,"
said Scott Tease, vice president and general manager of AI and
High-Performance Computing at Lenovo. "Our collaboration with
Micron is stronger than ever, and laser-focused on delivering
balanced, high-performance, sustainable technology solutions to our
mutual customers."
Micron MRDIMMs are available now and will be shipping in volume
in the second half of calendar year 2024. Subsequent generations of
MRDIMMs will continue to deliver up to 45% better memory bandwidth
per channel over similar-generation RDIMMs.6 For more information
on Micron MRDIMM innovations, visit: Micron MRDIMM memory.
Additional resources:
- Product webpage
- Product brief
- Micron image gallery
About Micron Technology, Inc.We are an industry
leader in innovative memory and storage solutions transforming how
the world uses information to enrich life for all. With a
relentless focus on our customers, technology leadership, and
manufacturing and operational excellence, Micron delivers a rich
portfolio of high-performance DRAM, NAND and NOR memory and storage
products through our Micron® and Crucial® brands. Every day, the
innovations that our people create fuel the data economy, enabling
advances in artificial intelligence (AI) and compute-intensive
applications that unleash opportunities — from the data center to
the intelligent edge and across the client and mobile user
experience. To learn more about Micron Technology, Inc. (Nasdaq:
MU), visit micron.com.
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products, and/or specifications are subject to change without
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1 Read-only bandwidth data based on GNR-AP platform at different
memory clocks for MRDIMM (empirical at 8800MT/s) and TSV RDIMM
(projected at 6400MT/s) using the Intel Memory Latency Checker
(MLC) tool.
2 Empirical data comparing 128GB MRDIMM 8800MT/s against 128GB
RDIMM 6400MT/s using the Intel Memory Latency Checker (MLC)
tool.
3 Empirical Stream Triad data comparing 128GB MRDIMM 8800MT/s
against 128GB RDIMM 6400MT/s.
4 Maximum DRAM temperature simulations comparing standard form
factor (SFF) DIMMs in a 1U server chassis compared to tall form
factor (TFF) MRDIMMs in a 2U server chassis.
5 Read-only bandwidth data based on GNR-AP platform at different
memory clocks for MRDIMMs (empirical data at 8800MT/s) and TSV
RDIMMs (projected data at 6400MT/s for current generation) using
the Intel Memory Latency Checker (MLC) tool.
6 Increase in data rate based on expected future speeds of
MRDIMMs over RDIMMs.
Micron Media Relations Contact
Kelly Sasso
Micron Technology, Inc.
+1 (208) 340-2410
ksasso@micron.com
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