Keysight Joins TSMC Open Innovation Platform 3DFabric Alliance
05 May 2023 - 1:00AM
Business Wire
- Membership provides access to TSMC’s 3Dblox standard for
electronic design automation software and device testing solution
development
Keysight Technologies, Inc. (NYSE: KEYS) has joined the TSMC
Open Innovation Platform® (OIP) 3DFabric Alliance, which was formed
recently by TSMC to accelerate 3D integrated circuit (IC) ecosystem
innovation and readiness. The Alliance focuses on achieving rapid
implementation of silicon and system-level innovations that enable
next-generation compute and mobile applications using TSMC’s
3DFabric™ technologies.
3DFabric Alliance membership gives Keysight access to the TSMC
3Dblox™ standard, enabling the development of electronic design
automation (EDA) software and testing solutions. Keysight will have
access to 3DFabric technologies to optimize its design tools and
design workflows to accelerate 3D IC designs. In addition, Keysight
will collaborate with TSMC on test and measurement methodologies,
ensuring the quality and reliability of 3D IC designs.
Keysight will also participate in TSMC’s 3Dblox standardization
effort to address the rising complexity of 3D IC design. The 3Dblox
standard unifies the design ecosystem with qualified EDA tools and
workflows. This modularized standard models the key physical
stacking and the logical connectivity information in 3D IC designs
in a single format.
Dan Kochpatcharin, Head of the Design Infrastructure
Management Division at TSMC, said: “TSMC works closely with our
3DFabric Alliance partners to offer customers an easy and flexible
way to unlock the power of 3D IC in their designs. The addition of
Keysight to the 3DFabric Alliance will add unique design and test
expertise to our growing 3D semiconductor community. Through the
3DFabric Alliance, TSMC and Keysight will collaborate to deliver
high-quality design and test solutions and services to help
customers achieve speedy implementation of system-level innovations
and quickly launch their differentiated 3D IC products to
market.”
Nilesh Kamdar, Senior Director, Portfolio Manager at
Keysight, said: “TSMC is blazing the trail for 3D IC design
technologies and workflows. Becoming a member of 3DFabric Alliance
brings our expertise in high speed, high frequency design, and test
to the 3D semiconductor community. Keysight’s simulation and test
tools are well-suited to ensure first pass success of 3D ICs in
TSMC’s technologies for customers innovating future mobile
applications.”
About Keysight Technologies
At Keysight (NYSE: KEYS), we inspire and empower innovators to
bring world-changing technologies to life. As an S&P 500
company, we’re delivering market-leading design, emulation, and
test solutions to help engineers develop and deploy faster, with
less risk, throughout the entire product lifecycle. We’re a global
innovation partner enabling customers in communications, industrial
automation, aerospace and defense, automotive, semiconductor, and
general electronics markets to accelerate innovation to connect and
secure the world. Learn more at Keysight Newsroom and
www.keysight.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20230504005696/en/
Geri Lynne LaCombe Americas/Europe +1 303 662 4748
geri_lacombe@keysight.com
Fusako Dohi Asia +81 42 660-2162 fusako_dohi@keysight.com
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