19 September 2024
EnSilica plc
("EnSilica", the
"Company" or the "Group")
EnSilica joins TSMC Design Center
Alliance
EnSilica, a leading chip maker of
mixed signal ASICs (Application Specific Integrated Circuits), is
pleased to announce that it has joined the
Design Center Alliance ("DCA") of the
Taiwan Semiconductor Manufacturing Company's ("TSMC") Open
Innovation Platform® ("OIP").
TSMC's DCA programme focuses on chip
implementation service and system level design solution enablement
to lower the design barriers for customers adopting TSMC
technology.
EnSilica's partnership with TSMC through the
DCA programme strengthens EnSilica's value in enabling the
next-generation of system-on-chips (SoCs), ranging from mixed
signal devices for industrial and automotive applications to
communications and edge artificial intelligence (AI) chips using
TSMC's most advanced process technologies.
The TSMC Open
Innovation Platform initiative is the industry's
most comprehensive design ecosystem that includes all critical
integrated circuit implementation areas to reduce design barriers
and improve first-time silicon success. The OIP actively promotes
the speedy implementation of innovation amongst the semiconductor
design community, enabling semiconductor designers to harness
TSMC's leading process and 3DFabric technologies to reach an
entirely new level of performance and power efficiency for the
next-generation artificial intelligence (AI), high-performance
computing (HPC), and mobile applications.
Ian Lankshear,
Chief Executive Officer of EnSilica, commented:
"Joining the TSMC DCA programme marks a significant achievement
for EnSilica. Our deep expertise in mixed signal and RF design,
combined with TSMC's advanced technology, positions us to deliver
unparalleled solutions to our mutual customers."
Dan
Kochpatcharin, Head of Ecosystem and Alliance Management Division
at TSMC, commented:
"We
are pleased to welcome EnSilica to the TSMC OIP Design Center
Alliance, providing value-added service and solutions in enabling
semiconductor design using TSMC's advanced process technologies.
TSMC is committed to collaborating with our OIP ecosystem partners,
including EnSilica, to empower customers in achieving their design
goals and quickly bringing their innovation to
market."
For further
information please contact:
|
EnSilica
plc
Ian Lankshear, Chief Executive
Officer
Kristoff Rademan, Chief Financial
Officer
www.ensilica.com
|
via Vigo Consulting
+44 (0)20 7390 0233
|
|
Allenby
Capital Limited, Nominated Adviser & Joint
Broker
Jeremy Porter / Vivek Bhardwaj (Corporate
Finance)
Joscelin Pinnington / Tony Quirke (Sales &
Corporate Broking)
|
+44 (0)20 3328 5656
info@allenbycapital.com
|
|
Singer Capital
Markets, Joint Broker
Rick Thompson / Asha Chotai
|
+44 (0)20 7496 3000
|
|
Vigo
Consulting (Investor & Financial Public
Relations)
Jeremy Garcia / Kendall Hill
|
+44 (0)20 7390 0233
ensilica@vigoconsulting.com
|
About
EnSilica
EnSilica is a leading fabless design house
focused on custom ASIC design and supply for OEMs and system
houses, as well as IC design services for companies with their own
design teams. The company has world-class expertise in supplying
custom RF, mmWave, mixed signal and digital ICs to its
international customers in the automotive, industrial, healthcare
and communications markets. The company also offers a broad
portfolio of core IP covering cryptography, radar, and
communications systems. EnSilica has a track record in delivering
high quality solutions to demanding industry standards. The company
is headquartered near Oxford, UK and has design centres across
the UK and in Bangalore, India and Porto Alegre, Brazil.