Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
18 September 2023 - 11:00PM
Business Wire
Glass substrates help overcome limitations
of organic materials by enabling an order of magnitude improvement
in design rules needed for future data centers and AI
products.
What’s New: Intel today announced one of the industry’s
first glass substrates for next-generation advanced packaging,
planned for the latter part of this decade. This breakthrough
achievement will enable the continued scaling of transistors in a
package and advance Moore’s Law to deliver data-centric
applications.
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Hamid Azimi, corporate vice president and
director of substrate technology development at Intel Corporation,
holds an Intel assembled glass substrate test chip at Intel's
Assembly and Test Technology Development factories in Chandler,
Arizona, in July 2023. Intel’s advanced packaging technologies come
to life at the company's Assembly and Test Technology Development
factories. (Credit: Intel Corporation)
“After a decade of research, Intel has
achieved industry-leading glass substrates for advanced packaging.
We look forward to delivering these cutting-edge technologies that
will benefit our key players and foundry customers for decades to
come.” –Babak Sabi, Intel senior vice president and general manager
of Assembly and Test Development
Why It Matters: Compared to today’s organic substrates,
glass offers distinctive properties such as ultra-low flatness and
better thermal and mechanical stability, resulting in much higher
interconnect density in a substrate. These benefits will allow chip
architects to create high-density, high-performance chip packages
for data-intensive workloads such as artificial intelligence (AI).
Intel is on track to deliver complete glass substrate solutions to
the market in the second half of this decade, allowing the industry
to continue advancing Moore’s Law beyond 2030.
By the end of the decade, the semiconductor industry will likely
reach its limits on being able to scale transistors on a silicon
package using organic materials, which use more power and include
limitations like shrinkage and warping. Scaling is crucial to the
progress and evolution of the semiconductor industry, and glass
substrates are a viable and essential next step for the next
generation of semiconductors.
How It Works: As the demand for more powerful computing
increases and the semiconductor industry moves into the
heterogeneous era that uses multiple “chiplets” in a package,
improvements in signaling speed, power delivery, design rules and
stability of package substrates will be essential. Glass substrates
possess superior mechanical, physical and optical properties that
allow for more transistors to be connected in a package, providing
better scaling and enabling assembly of larger chiplet complexes
(called “system-in-package”) compared to organic substrates in use
today. Chip architects will have the ability to pack more tiles –
also called chiplets – in a smaller footprint on one package, while
achieving performance and density gains with greater flexibility
and lower overall cost and power usage.
About the Use Cases: Glass substrates will initially be
introduced into the market where they can be leveraged the most:
applications and workloads requiring larger form factor packages
(i.e., data centers, AI, graphics) and higher speed
capabilities.
Glass substrates can tolerate higher temperatures, offer 50%
less pattern distortion, and have ultra-low flatness for improved
depth of focus for lithography, and have the dimensional stability
needed for extremely tight layer-to-layer interconnect overlay. As
a result of these distinctive properties, a 10x increase in
interconnect density is possible on glass substrates. Further,
improved mechanical properties of glass enable ultra-large
form-factor packages with very high assembly yields.
Glass substrates’ tolerance to higher temperatures also offers
chip architects flexibility on how to set the design rules for
power delivery and signal routing because it gives them the ability
to seamlessly integrate optical interconnects, as well as embed
inductors and capacitors into the glass at higher temperature
processing. This allows for better power delivery solutions while
achieving high-speed signaling that is needed at much lower power.
These many benefits bring the industry closer to being able to
scale 1 trillion transistors on a package by 2030.
How We Do It: Intel has been researching and evaluating
the reliability of glass substrates as a replacement for organic
substrates for more than a decade. The company has a long history
of enabling next-generation packaging, having led the industry in
the transition from ceramic package to organic package in the
1990s, being the first to enable halogen and lead-free packages,
and being the inventor of advanced embedded die packaging
technologies, the industry’s first active 3D stacking technologies.
As a result, Intel has been able to unlock an entire ecosystem
around these technologies from equipment, chemical and materials
suppliers to substrate manufacturers.
What’s Next: Building on the momentum of recent PowerVia
and RibbonFET breakthroughs, these industry-leading glass
substrates for advanced packaging demonstrate Intel’s forward focus
and vision for the next era of compute beyond the Intel 18A process
node. Intel is on the path to delivering 1 trillion transistors on
a package by 2030 and its ongoing innovation in advanced packaging
including glass substrates will help achieve this goal.
More Context: Glass Substrates Explained in 60 Seconds
(Video) | Intel Leads the Way with Advanced Packaging (News) |
Advanced Packaging with Glass Substrates (Video B-Roll)
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
© Intel Corporation. Intel, the Intel logo and other Intel marks
are trademarks of Intel Corporation or its subsidiaries. Other
names and brands may be claimed as the property of others.
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Robin Holt 1-503-616-1532 robin.holt@intel.com
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