Artificial intelligence gives rise to the
‘Siliconomy,’ a new era of global expansion driven by the magic of
silicon and software. NEWS HIGHLIGHTS
- Intel confirmed its five-nodes-in-four-years process technology
plan remains on track, and it demonstrated the world’s first
multi-chiplet package using Universal Chiplet Interconnect Express
(UCIe) interconnects.
- The company revealed new details on next-generation Intel®
Xeon® processors, including major advances in power efficiency and
performance, and an E-core processor with 288 cores. 5th Gen Intel®
Xeon® processors will launch Dec. 14
- The AI PC arrives with the launch of Intel® Core™ Ultra
processors on Dec. 14. With Intel’s first integrated neural
processing unit, Core Ultra will deliver power-efficient AI
acceleration and local inference on the PC.
- A large AI supercomputer will be built on Intel Xeon processors
and Intel® Gaudi®2 AI hardware accelerators, with Stability AI as
the anchor customer.
- General availability announced for the Intel® Developer Cloud
for building and testing high-performance applications like AI,
including details that it is already in use by customers.
- New and forthcoming Intel software solutions, including the
2023.1 release of the Intel® Distribution of OpenVINO™ toolkit,
will help developers unlock new AI capabilities.
At its third annual Intel Innovation event, Intel unveiled an
array of technologies to bring artificial intelligence everywhere
and make it more accessible across all workloads, from client and
edge to network and cloud.
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A photo shows a tray of Intel Core Ultra
processors being assembled at Intel’s advanced packaging facilities
in Penang, Malaysia. The Intel Core Ultra processor, code-named
Meteor Lake, is the first client processor manufactured on the new
Intel 4 process node using its 3D high-performance hybrid
architecture, and the first client tile-based design enabled by
Foveros packaging technology and features CPU, GPU and NPU.
(Credit: Intel Corporation)
“AI represents a generational shift, giving rise to a new era of
global expansion where computing is even more foundational to a
better future for all,” said Intel CEO Pat Gelsinger. “For
developers, this creates massive societal and business
opportunities to push the boundaries of what’s possible, to create
solutions to the world’s biggest challenges and to improve the life
of every person on the planet.”
More: Intel Innovation 2023 (Press Kit) | Innovation
2023: Bringing AI Everywhere (More News)
In a keynote presentation to open the event targeting
developers, Gelsinger showed how Intel is bringing AI capabilities
across its hardware products and making it accessible through open,
multi-architecture software solutions. He also highlighted how AI
is helping to drive the “Siliconomy,” a “growing economy enabled by
the magic of silicon and software.” Today, silicon feeds a $574
billion industry that in turn powers a global tech economy worth
almost $8 trillion.
New Advances in Silicon, Packaging and Multi-Chiplet
Solutions
The work begins with silicon innovation. Intel’s
five-nodes-in-four-years process development program is progressing
well, Gelsinger said, with Intel 7 already in high-volume
manufacturing, Intel 4 manufacturing-ready and Intel 3 on track for
the end of this year.
Gelsinger also showed an Intel 20A wafer with the first test
chips for Intel’s Arrow Lake processor, which is destined for the
client computing market in 2024. Intel 20A will be the first
process node to include PowerVia, Intel’s backside power delivery
technology, and the new gate-all-around transistor design called
RibbonFET. Intel 18A, which also leverages PowerVia and RibbonFET,
remains on track to be manufacturing-ready in the second half of
2024.
Another way Intel presses Moore’s Law forward is with new
materials and new packaging technologies, like glass substrates – a
breakthrough Intel announced this week. When introduced later this
decade, glass substrates will allow for continued scaling of
transistors on a package to help meet the need for data-intensive,
high-performance workloads like AI and will keep Moore’s Law going
well beyond 2030.
Intel also displayed a test chip package built with Universal
Chiplet Interconnect Express (UCIe). The next wave of Moore’s Law
will arrive with multi-chiplet packages, Gelsinger said, coming
sooner if open standards can reduce the friction of integrating IP.
Formed last year, the UCIe standard will allow chiplets from
different vendors to work together, enabling new designs for the
expansion of diverse AI workloads. The open specification is
supported by more than 120 companies.
The test chip combined an Intel UCIe IP chiplet fabricated on
Intel 3 and a Synopsys UCIe IP chiplet fabricated on TSMC N3E
process node. The chiplets are connected using embedded multi-die
interconnect bridge (EMIB) advanced packaging technology. The
demonstration highlights the commitment of TSMC, Synopsys and Intel
Foundry Services to support an open standard-based chiplet
ecosystem with UCIe.
Increasing Performance and Expanding AI Everywhere
Gelsinger spotlighted the range of AI technology available to
developers across Intel platforms today – and how that range will
dramatically increase over the coming year.
Recent MLPerf AI inference performance results further reinforce
Intel’s commitment to addressing every phase of the AI continuum,
including the largest, most challenging generative AI and large
language models. The results also spotlight the Intel Gaudi2
accelerator as the only viable alternative on the market for AI
compute needs. Gelsinger announced a large AI supercomputer will be
built entirely on Intel Xeon processors and 4,000 Intel Gaudi2 AI
hardware accelerators, with Stability AI as the anchor
customer.
Zhou Jingren, chief technology officer of Alibaba Cloud,
explained how Alibaba applies 4th Gen Intel® Xeon® processors with
built-in AI acceleration to “our generative AI and large language
model, Alibaba Cloud’s Tongyi Foundation Models.” Intel’s
technology, he said, results in “remarkable improvements in
response times, averaging a 3x acceleration.”1
Intel also previewed the next generation of Intel Xeon
processors, revealing that 5th Gen Intel® Xeon® processors will
bring a combination of performance improvements and faster memory,
while using the same amount of power, to the world’s data centers
when they launch Dec. 14. Sierra Forest, with E-core efficiency and
arriving in the first half of 2024, will deliver 2.5x better rack
density and 2.4x higher performance per watt over 4th Gen Xeon and
will include a version with 288 cores2. And Granite Rapids, with
P-core performance, will closely follow the launch of Sierra
Forest, offering 2x to 3x better AI performance compared to 4th Gen
Xeon2.
Looking ahead to 2025, the next-gen E-core Xeon, code-named
Clearwater Forest, will arrive on the Intel 18A process node.
Introducing the AI PC with Intel Core Ultra
processors
AI is about to get more personal, too. “AI will fundamentally
transform, reshape and restructure the PC experience – unleashing
personal productivity and creativity through the power of the cloud
and PC working together,” Gelsinger said. “We are ushering in a new
age of the AI PC.”
This new PC experience arrives with the upcoming Intel Core
Ultra processors, code-named Meteor Lake, featuring Intel’s first
integrated neural processing unit, or NPU, for power-efficient AI
acceleration and local inference on the PC. Gelsinger confirmed
Core Ultra also will launch Dec. 14.
Core Ultra represents an inflection point in Intel’s client
processor roadmap: It’s the first client chiplet design enabled by
Foveros packaging technology. In addition to the NPU and major
advances in power-efficient performance thanks to Intel 4 process
technology, the new processor brings discrete-level graphics
performance with onboard Intel® Arc™ graphics.
On stage, Gelsinger showed an array of new AI PC use cases, and
Jerry Kao, chief operating officer of Acer, gave a sneak peek at an
upcoming Acer laptop powered by Core Ultra. “We’ve been
co-developing with Intel teams a suite of Acer AI applications to
take advantage of the Intel Core Ultra platform,” Kao said,
“developing with the OpenVINO toolkit and co-developed AI libraries
to bring the hardware to life.”
Putting Developers in the Siliconomy Driver’s Seat
“AI going forward must deliver more access, scalability,
visibility, transparency and trust to the whole ecosystem,”
Gelsinger said.
To help developers unlock this future, Intel announced:
- General availability of the Intel Developer
Cloud: The Intel Developer Cloud helps developers accelerate AI
using the latest Intel hardware and software innovations –
including Intel Gaudi2 processors for deep learning – and provides
access to the latest Intel hardware platforms, such as the 5th Gen
Intel® Xeon® Scalable processors and Intel® Data Center GPU Max
Series 1100 and 1550. When using the Intel Developer Cloud,
developers can build, test and optimize AI and HPC applications.
They can also run small- to large-scale AI training, model
optimization and inference workloads that deploy with performance
and efficiency. Intel Developer Cloud is based on an open software
foundation with oneAPI – an open multiarchitecture, multivendor
programming model – to provide hardware choice and freedom from
proprietary programming models to support accelerated computing and
code reuse and portability.
- The 2023.1 release of the Intel Distribution of
OpenVINO toolkit: OpenVINO is Intel’s AI inferencing and
deployment runtime of choice for developers on client and edge
platforms. The release includes pre-trained models optimized for
integration across operating systems and different cloud solutions,
including many generative AI models, such as the Llama 2 model from
Meta. On stage, companies including ai.io and Fit:match
demonstrated how they use OpenVINO to accelerate their
applications: ai.io to evaluate the performance of any potential
athlete; Fit:match to revolutionize the retail and wellness
industries to help consumers find the best-fitting garments.
- Project Strata, and the development of an edge-native
software platform: The platform launches in 2024 with modular
building blocks, premium service and support offerings. It is a
horizontal approach to scaling the needed infrastructure for the
intelligent edge and hybrid AI and will bring together an ecosystem
of Intel and third-party vertical applications. The solution will
enable developers to build, deploy, run, manage, connect and secure
distributed edge infrastructure and applications.
This is just the beginning of the news from Intel Innovation.
Tune in on the Intel Newsroom at 9:30 a.m. PDT Wednesday to hear
from Intel Chief Technology Officer Greg Lavender on more ways
Intel is opening opportunities in AI for developers and
accelerating the convergence of AI and security.
Forward-Looking Statements
This release contains forward-looking statements, including with
respect to Intel’s business plans and strategy, process and product
roadmaps, and current and future technologies, as well as the
anticipated benefits therefrom. Such statements involve many risks
and uncertainties that could cause our actual results to differ
materially from those expressed or implied, including: changes in
demand for our products; changes in product mix; the complexity and
fixed cost nature of our manufacturing operations; the high level
of competition and rapid technological change in our industry; the
significant upfront investments in R&D and our business,
products, technologies, and manufacturing capabilities;
vulnerability to new product development and manufacturing-related
risks, including product defects or errata, particularly as we
develop next generation products and implement next generation
process technologies; risks associated with a highly complex global
supply chain, including from disruptions, delays, trade tensions,
or shortages; sales-related risks, including customer concentration
and the use of distributors and other third parties; potential
security vulnerabilities in our products; cybersecurity and privacy
risks; investment and transaction risk; intellectual property risks
and risks associated with litigation and regulatory proceedings;
evolving regulatory and legal requirements across many
jurisdictions; geopolitical and international trade conditions; our
debt obligations; risks of large scale global operations;
macroeconomic conditions; impacts of the COVID 19 or similar such
pandemic; and other risks and uncertainties described in our
earnings release dated July 27, 2023, our most recent Annual Report
on Form 10-K and our other filings with the U.S. Securities and
Exchange Commission. All information in this press release reflects
Intel management views as of the date hereof unless an earlier date
is specified. Intel does not undertake, and expressly disclaims any
duty, to update such statements, whether as a result of new
information, new developments, or otherwise, except to the extent
that disclosure may be required by law.
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
1 Intel does not control or audit third-party data. You should
consult other sources to evaluate accuracy. 2 Based on
architectural projections as of August 21, 2023 relative to 4th Gen
Intel Xeon processors. Your results may vary.
© Intel Corporation. Intel, the Intel logo and other Intel marks
are trademarks of Intel Corporation or its subsidiaries. Other
names and brands may be claimed as the property of others.
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Kristie Taylor 1-512-924-0460 kristie.taylor@intel.com
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