- New portfolio drives chip performance with panel-based
interconnect innovation
- KLA is extending the capability of the proven Corus™ direct
imaging platform and introducing the Serena™ direct imaging
platform to support mainstream and advanced IC substrate
lithography requirements
- New Lumina™ inspection and metrology systems further equip IC
substrate (including glass core) and panel-based interposer makers
to efficiently build advanced products with high quality and
yield
MILPITAS, Calif., Oct. 15,
2024 /PRNewswire/ -- Today KLA
Corporation (NASDAQ: KLAC) introduced the industry's widest
breadth of process control and process-enabling solutions for IC
substrate (ICS) manufacturing. KLA's combined expertise in
front-end semiconductors, packaging and IC substrates will help
customers achieve breakthroughs in packaging interconnect density
for chips targeting high-performance applications.
Advanced packaging continues to adopt heterogeneous integration
methods to bring together multiple semiconductor components for
performance, power and cost benefits. To meet evolving interconnect
requirements, innovation is accelerating for panel-based
intermediate packaging levels like IC substrates and interposers.
These technologies are used to efficiently connect chips and
printed circuit boards (PCBs). As package dimensions increase,
feature sizes decrease and novel materials such as glass are
introduced, manufacturers can leverage KLA's solution portfolio to
achieve higher yield, accelerate delivery cycles and improve
overall profitability.
KLA's comprehensive portfolio of direct imaging (DI),
defect inspection, shaping, metrology, chemistry process control
and intelligent software solutions optimizes the advanced packaging
manufacturing workflow.
KLA's portfolio includes multiple direct imaging solutions
supporting a range of customer lithography requirements. Market
adoption of the Corus™ direct imaging platform demonstrates its
proven capability at providing a highly flexible and efficient
imaging solution. To meet evolving needs for applications like IC
substrates and next-gen high-density interconnect (HDI), the
capability is being extended with next-generation optics and lasers
to optimize dynamic imaging and layer-to-layer accuracy at speed,
even for varying panel topographies.
For advanced IC substrate applications, direct imaging
represents a new category beyond steppers for lithography. KLA is
introducing the new Serena™ direct imaging platform for quality,
finer line patterning of large-sized, high layer count organic
substrates for increased accuracy and yield with the efficiency of
a flexible digital solution.
Lumina™, KLA's new inspection and metrology system for advanced
IC substrates (including glass core) and panel-based interposers,
enables high-sensitivity detection and scanning metrology at
optimized cost of ownership. The system delivers monitoring paired
with AI-based review and classification for an actionable
defect Pareto chart without the need for operator input, as
well as a seamless integration with KLA's copper shaping
solutions.
The portfolio is strengthened with proven KLA process control
solutions featuring the Orbotech Ultra PerFix™, EcoNet™, Zeta™-6xx,
ICOS™ T890, Quali-Fill® Libra® and
QualiLab® Elite product lines. KLA's Frontline software
solutions span engineering, computer-aided manufacturing (CAM) and
production data analytics to centralize and apply intelligence
throughout IC substrate manufacturing, building on KLA's longtime
leadership in yield management.
"With today's portfolio news, KLA is affirming our leadership in
semiconductor ecosystem innovation," said Oreste Donzella, executive vice president and
chief strategy officer, KLA Corporation. "IC substrates and other
panel-level packaging technologies are essential to advancing
connectivity within tomorrow's high-performance chips, and KLA is
collaboratively engaged with customers in solving complex
production challenges to maximize their yield and business
success."
For more information about KLA's comprehensive portfolio of
IC substrate solutions, join us at the upcoming TPCA tradeshow.
About KLA
KLA Corporation ("KLA") develops
industry-leading equipment and services that enable innovation
throughout the electronics industry. We provide advanced process
control and process-enabling solutions for manufacturing wafers and
reticles, integrated circuits, packaging and printed circuit
boards. In close collaboration with leading customers across the
globe, our expert teams of physicists, engineers, data scientists
and problem-solvers design solutions that move the world forward.
Investors and others should note that KLA announces material
financial information including SEC filings, press releases, public
earnings calls and conference webcasts using an investor relations
website (ir.kla.com). Additional information may be found at:
www.kla.com.
Forward-Looking Statements
Statements in this press
release other than historical facts, such as statements regarding
the expected performance of the IC substrate product portfolio are
forward-looking statements, and are subject to the Safe Harbor
provisions created by the Private Securities Litigation Reform Act
of 1995. These forward-looking statements are based on current
information and expectations and involve risks and uncertainties.
Actual results may differ materially from those projected in such
statements due to various factors, including delays in the adoption
of new technologies (whether due to cost or performance issues or
otherwise), the introduction of competing products by other
companies or unanticipated technology challenges or limitations
that affect the implementation, performance or use of KLA's
products, and other risk factors included in KLA's annual report on
Form 10-K for the year ended June 30,
2024 and other filings by KLA with the Securities and
Exchange Commission (including, without limitation, the risk
factors described therein). KLA assumes no obligation to, and do
not currently intend to, update these forward-looking
statements.
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SOURCE KLA Corporation
