Corpay to Participate in Upcoming Investor Conferences
26 February 2025 - 8:05AM
Business Wire
Corpay, Inc., (NYSE: CPAY) a global S&P 500 corporate
payments company, today announced that the Company will participate
in the following investor conferences:
- On Monday, March 3, 2025, the Company will be attending the
Raymond James Institutional Investors Conference in Orlando, FL.
They will be participating in investor meetings.
- On Wednesday, March 5, 2025, the Company will be attending the
Morgan Stanley TMT Conference in San Francisco, CA. They will be
participating in investor meetings.
- On Wednesday, March 12, 2025, the Company will be attending the
Wolfe FinTech Forum in New York, NY. They will participate in a
fireside chat beginning at 2:30 PM ET.
Investors and interested parties can access the Wolfe
presentation by visiting the Company’s investor relations website
at https://investor.corpay.com/.
About Corpay
Corpay (NYSE: CPAY), the Corporate Payments Company, is a global
S&P 500 provider of commercial cards (e.g, business cards,
fleet cards, virtual cards) and AP automation solutions (e.g.,
invoice digitization, payments automation, cross border payments)
to businesses worldwide. Our solutions result in our customers
saving time, mitigating fraud, and ultimately spending less. For
more information, please visit www.corpay.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20250225039679/en/
Investor Relations Jim Eglseder, 770-417-4697
james.eglseder@corpay.com
Corpay (NYSE:CPAY)
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