SAN JOSE, Calif., March 10, 2020 /PRNewswire/ -- Lumentum Holdings
Inc. ("Lumentum") today announced it has introduced three new
breakthrough high-speed datacom laser chips, broadening its
portfolio to enable the growth of future hyperscale data centers
and 5G wireless applications.
The expected strong growth of data in hyperscale data
centers and 5G wireless networks is driving increasing
requirements for volume, reliability, cost, and
speed in datacom laser chips. Lumentum addresses
these requirements by leveraging decades of experience in the
industry developing advanced photonic solutions.
"To sustain the expected growth in these markets, customers
critically need an experienced supplier that
can provide high performance, high quality, and
scalability," said Senior Vice President and General Manager,
Datacom, Walter Jankovic. "At
Lumentum, we leverage our high-volume
manufacturing capability, unmatched materials, and laser
device expertise in Indium Phosphide (InP) and Gallium Arsenide
(GaAs), to meet our customer expectations for chip
innovation at scale."
Lumentum is a first-to-market and first-to-scale provider of
high-performance externally modulated
lasers (EMLs) for 100G PAM4 applications, enabling
data centers to increase their bit rate and lower their overall
power consumption. Lumentum's 50G PAM4 vertical-cavity
surface-emitting lasers (VCSELs) provide high performance
with breakthrough customer value and production
capacity. Additionally, Lumentum's newly developed
50G PAM4 directly modulated
lasers (DMLs) enable customers to lower their overall
cost by offering the equivalent performance of an EML for 50G
and 200G applications in a simpler and lower cost DML format.
About the Products
100G PAM4 Uncooled EMLs for Next-Generation
Data Centers
Lumentum PAM4-optimized 53 Gbaud EMLs enable full C-temp
transceiver designs without using a TE cooler. As a long-standing
leader with expertise in complex EML technology, Lumentum
has developed an industry-first uncooled, self-hermetic
EML. Available to sample in Q3 2020, this laser chip will lead
the transition in data center infrastructure from 100G to 400G by
enabling a wide-temperature range and high-performance 2 km PAM4
modules.
50G PAM4 VCSELs for High-Speed Short Reach Optical
Networks
Enabled by its advanced 6-inch GaAs
wafer foundry and its experience
producing high-reliability 3D sensing VCSELs at
high-volume, the Lumentum 50G (28 Gbaud) VCSEL
provides unprecedented uniformity at scale. In
addition, the VCSEL is suitable for non-hermetic applications
from 0ºC to 80ºC, delivers extremely high yields, and is
RoHS10 and Telcordia GR-468 compliant. This solution will be
available to customers in Q2 2020.
50G PAM4 DMLs for 5G Mid-haul, Backhaul, and Hyperscale Data
Centers
Lumentum DMLs use a sophisticated cavity design to operate over
wide and demanding temperature ranges. Offering
higher-bandwidth, the 50G PAM4 (28 Gbaud) DMLs provide
the equivalent performance of an EML, but in a smaller and
more cost-effective footprint. This product is now
available for sampling.
About Lumentum
Lumentum (NASDAQ: LITE) is a market-leading designer and
manufacturer of innovative optical and photonic products enabling
optical networking and laser applications worldwide. Lumentum
optical components and subsystems are part of virtually every type
of telecom, enterprise, and data center network. Lumentum lasers
enable advanced manufacturing techniques and diverse applications
including next-generation 3D sensing capabilities. Lumentum is
headquartered in San Jose,
California with R&D, manufacturing, and sales offices
worldwide. For more information, visit www.lumentum.com.
Contact
Information:
|
Investors:
|
Jim Fanucchi,
408-404-5400; investor.relations@lumentum.com
|
Media:
|
Sean Ogarrio,
408-546-5405; media@lumentum.com
|
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SOURCE Lumentum