CyberOptics to Present ‘100% Wafer Bump Metrology & Inspection’ Technical Paper at the SEMICON Taiwan SiP Global Summit 2...
02 September 2020 - 11:00PM
Business Wire
CyberOptics® Corporation (NASDAQ: CYBE), a leading global
developer and manufacturer of high-precision 3D sensing technology
solutions, will present at the SEMICON Taiwan Global SiP Summit on
September 24th at 4:20pm.
Tim Skunes, VP of R&D at CyberOptics, will share the
technical presentation ‘Fast, 100% 3D Wafer Bump Metrology and
Inspection to Improve Yields and 3D System Integration’ at the
SEMICON Taiwan Global SiP Summit.
Advanced Packaging (AP) and wafer level packaging (WLP) continue
to be among the most dynamic and rapidly evolving areas of
semiconductor development and manufacturing. Most of these new
processes take advantage of the third dimension, going vertical to
continue packing more computing power into less space while
circumventing the difficulties posed by further reductions in
two-dimensional size. Packaging stacks include various
configurations of single or multiple chips, interposers, flip chips
and substrates, but in almost all cases, they rely on some form of
bump to make the vertical connections between these components. The
bumps may be solder balls, copper pillars or microbumps.
As the processes and features they create have become smaller
and more complex, manufacturers face an increasing need for
high-precision inspection and measurement to detect defects and
improve process control. This need is amplified by the fact that
these processes use expensive known good die, making the cost of
failure extremely high. Bump metrology is fundamentally
three-dimensional and bump height is just as important as size and
location. Controlling bump height, both absolute and relative to
neighboring bumps (coplanarity), is critical to ensuring good,
reliable connections between stacked components.
Multiple Reflection Suppression™ (MRS™) sensor technology
addresses this challenge by comparing data from multiple
perspectives and fringe frequencies to identify and reject these
spurious signals. The MRS sensor’s unique optical architecture and
the system’s proprietary image fusing and processing algorithms
provide accurate 3D characterization that is several times faster
than conventional PSP. The NanoResolution MRS sensor has been
developed for advanced packaging process control in what has been
called the “middle-end” of the manufacturing process, where
traditionally front-end and back-end processes overlap.
The MRS sensor integrated into CyberOptics’ WX3000™ system
provides sub-micrometer accuracy on features as small as 25µm.
While retaining its ability to reject spurious multiple
reflections, it adds the ability to capture and analyze specular
reflections from shiny surfaces of solder balls, bumps and pillars,
allowing accurate inspection and 3D metrology of these critical
packaging features.
The MRS sensor is 2-3X faster than alternative technologies.
With data processing speeds in excess of 75 million 3D points per
second, it delivers production-worthy throughput greater than 25
wafers (300mm) per hour. Complete 100% 3D/2D inspection can be
accomplished at high speed for bump metrology, vs. the current
practice of sampling approach. Both 3D/2D data is attained at the
same time vs. time-consuming alternate methods that require
separate scans for 3D and 2D.
For more information, visit www.cyberoptics.com or booth #L0310
at Semicon Taiwan from September 25-26.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading
global developer and manufacturer of high-precision 3D sensing
technology solutions. CyberOptics’ sensors are used for inspection
and metrology in the SMT and semiconductor markets to significantly
improve yields and productivity. By leveraging its leading edge
technologies, the Company has strategically established itself as a
global leader in high precision 3D sensors, allowing CyberOptics to
further increase its penetration of key vertical markets.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts
worldwide operations through its facilities in North America, Asia
and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: a possible world-wide recession or
depression resulting from the economic consequences of the Covid-19
pandemic; the negative effect on our revenue and operating results
of the COVID-19 crises on our customers and suppliers and the
global supply chain; market conditions in the global SMT and
semiconductor capital equipment industries; trade relations between
the United States and China and other countries; the timing of
orders and shipments of our products, particularly our 3D
MRS-enabled SQ3000 Multi-Function systems and MX systems for memory
module inspection; increasing price competition and price pressure
on our product sales, particularly our SMT systems; the level of
orders from our OEM customers; the availability of parts required
to meet customer orders; unanticipated product development
challenges; the effect of world events on our sales, the majority
of which are from foreign customers; rapid changes in technology in
the electronics and semiconductor markets; product introductions
and pricing by our competitors; the success of our 3D technology
initiatives; the market acceptance of our SQ3000 Multi-Function
inspection and measurement systems and products for semiconductor
advanced packaging inspection and metrology; costly and time
consuming litigation with third parties related to intellectual
property infringement; the negative impact on our customers and
suppliers due to past and future terrorist threats and attacks and
any acts of war; and other factors set forth in the Company’s
filings with the Securities and Exchange Commission.
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version on businesswire.com: https://www.businesswire.com/news/home/20200902005547/en/
Carla Furanna Head of Global Marketing, CyberOptics
952-820-5837, cfuranna@cyberoptics.com
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