Cadence Presented With Four 2019 TSMC Partner of the Year Awards
31 October 2019 - 1:45AM
Business Wire
Cadence achieves recognition for joint
development of N6 design infrastructure, SoIC design solution,
cloud-based productivity solution and DSP IP
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that
it was presented with four TSMC Partner of the Year awards at the
TSMC 2019 Open Innovation Platform® (OIP) Ecosystem Forum. Cadence
achieved recognition for the joint development of the N6 design
infrastructure, SoIC design solution, cloud-based productivity
solution and DSP IP.
These awards were given to Cadence based on the following work
that has been delivered:
- N6 design infrastructure: Cadence participated in an
in-depth collaboration with TSMC on the design infrastructure
development of this advanced process technology and has been
working with customers on N6 design starts both on production
designs and test chips.
- SoIC Design Solution: Cadence collaborated with TSMC on
the development of a design solution and delivered a reference flow
that includes a full suite of Cadence® digital and signoff,
custom/analog, and IC package and PCB analysis tools.
- Cloud-based TSMC OIP Virtual Design Environment (VDE):
Cadence collaborated with TSMC to add the CloudBurst™ Platform to
Cadence-managed OIP VDE environments, elevating ease of use and
enabling mutual customers to tape out advanced process designs
using digital, custom and verification flows delivered via the
cloud to improve overall productivity and meet compressed
schedules.
- DSP IP: Cadence worked with TSMC to enable customers to
complete successful projects using the Cadence Tensilica® DSP IP, a
widely-used DSP IP in the TSMC portfolio.
“Our continued collaboration with Cadence is enabling our
customers to utilize our advanced technologies to design with
confidence and meet design goals,” said Suk Lee, TSMC senior
director of the Design Infrastructure Marketing Division. “We look
forward to seeing our customers unleash their silicon innovations
in their respective markets using our advanced N6, TSMC-SoIC®,
cloud, and DSP IP solutions.”
“Through our close collaboration with TSMC, we’re enabling
mutual customers to consistently deliver successful innovations
using our latest technologies,” said Dr. Chin-Chi Teng, senior vice
president and general manager of the Digital & Signoff Group at
Cadence. “These awards from TSMC exemplify Cadence’s commitment to
delivering upon its Intelligent System Design strategy, which
enables customers to achieve SoC design excellence.”
About Cadence
Cadence enables electronic systems and semiconductor companies
to create the innovative end products that are transforming the way
people live, work and play. Cadence software, hardware and
semiconductor IP are used by customers to deliver products to
market faster. The company’s Intelligent System Design™ strategy
helps customers develop differentiated products—from chips to
boards to intelligent systems—in mobile, consumer, cloud, data
center, automotive, aerospace, IoT, industrial and other market
segments. Cadence is listed as one of Fortune Magazine's 100 Best
Companies to Work For. Learn more at cadence.com.
© 2019 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
View source
version on businesswire.com: https://www.businesswire.com/news/home/20191030005309/en/
Cadence Newsroom 408-944-7039 newsroom@cadence.com
Cadence Design Systems (NASDAQ:CDNS)
Historical Stock Chart
From Apr 2024 to May 2024
Cadence Design Systems (NASDAQ:CDNS)
Historical Stock Chart
From May 2023 to May 2024