SAN JOSE, Sept. 18, 2018
/PRNewswire/ -- Integrated Device Technology, Inc. (IDT) (NASDAQ:
IDTI) today introduces the industry's first integrated CMOS chipset
for 56GB/ch applications, ideal for 200G/400G SR Ethernet Datacom
modules.
The new IDT® developed the new HXT14450/HXR14450 chipset
addresses the rapid migration from 100G to 400G that mega data
centers are undergoing to meeting the continuing rise in cloud
computing. The chipset is primarily designed for 200G/400G SR
Ethernet optical transceivers and active optical cables (AOCs) that
are largely used in the short distance between servers and
top-of-rack (TOR) switches. The integrated CMOS chipset
combines low power requirements and a compact form factor that
meets all 200G/400G QSFP-DD module application requirements.
The HXT14450 is a power efficient, four channel, fully
integrated transmitter with a CDR and a VCSEL driver. Each channel
incorporates a powerful equalizer with both CTLE and 10 taps DFE to
compensate MR channel up to more than 20dB loss. Analog-approach
DFE has been used to reduce power consumption. The HXT14450 has
rich digital features such as PRBS generator/checker, EYE monitor
and integrated CPU can run user-defined firmware. The transmitter
uses a cleanup PLL providing excellent random jitter of 200fs and
Tj (total jitter with BER=10-12) of 7ps. The transmitter
uses a 7-bit DAC enabling several digital powerful
performance-enhancing features such as nonlinear compensation and
rise/fall time correction and a 3-tap FIR de-emphasis equalizer in
digital domain. Optical performance measured is less than 1dB
TDECQ.
The HXR14450 is a best-in-class, four-channel fully integrated
receiver, with TIA and CDR. Each channel can operate with just
380mW of power at full speed of 56 Gb/s, the lowest power
consumption in its class. TIA with low noise, wide dynamic range,
and the CDR with adaptive CTLE, and DFE give the ability of tuning
the circuits to achieve very low bit error rate for a wide range of
optical channels.
"The CMOS process is ideal for integration of all functions
needed for transmit and receive chips for 200G/400G SR modules and
IDT is well versed in all design features," said Emad Afifi, senior director of engineering for
CMOS products at IDT. "We are first to be sampling such a
chipset to customers and excited to be providing solid support to
show the excellent performance of our chipset."
Please visit IDT at ECOC 2018, booth 448, September 24-26 in Rome, Italy. To schedule a meeting with IDT
representatives at the show, please complete this form.
About IDT
Integrated Device Technology, Inc. develops system-level
solutions that optimize its customers' applications. IDT's
market-leading products in RF, high performance timing, memory
interface, real-time interconnect, optical interconnect, wireless
power, and smart sensors are among the company's broad array of
complete mixed-signal solutions for the communications, computing,
consumer, automotive and industrial segments. Headquartered in San
Jose, Calif., IDT has design, manufacturing, sales
facilities and distribution partners throughout the
world. IDT stock is traded on the NASDAQ Global
Select Stock Market® under the symbol "IDTI." Additional
information about IDT can be found at idt.com.
Follow IDT on Facebook, LinkedIn, Twitter, and YouTube.
© 2018, Integrated Device Technology, Inc. IDT and the IDT
logo are trademarks or registered trademarks of Integrated Device
Technology, Inc., and its worldwide subsidiaries. All other brands,
product names and marks are or may be trademarks or registered
trademarks used to identify products or services of their
respective owners.
IDT Press Contact:
Krista Pavlakos
Director, Demand Creation & Communications
Phone: (408) 574-6640
E-mail: krista.pavlakos@idt.com
View original content to download
multimedia:http://www.prnewswire.com/news-releases/idt-releases-industrys-first-integrated-cmos-chipset-for-200g400g-sr-datacom-modules-300714205.html
SOURCE Integrated Device Technology, Inc.