MILPITAS, Calif., Feb. 22, 2017 /PRNewswire/ -- KLA-Tencor
Corporation (NASDAQ: KLAC) today introduced four innovative
metrology systems that enable development and high-volume
manufacturing of sub-10nm integrated circuit (IC) devices: the
Archer™ 600 overlay metrology system, the WaferSight™ PWG2
patterned wafer geometry measurement system, the SpectraShape™ 10K
optical critical dimension (CD) metrology system and the SensArray®
HighTemp 4mm in-situ temperature measurement system. These four new
systems expand the capability of KLA-Tencor's unique 5D Patterning
Control Solution™ to support advanced patterning techniques, such
as self-aligned quadruple patterning (SAQP) and extreme ultraviolet
(EUV) lithography.
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"Leading-edge device manufacturers are facing extremely tight
patterning specifications," said Oreste
Donzella, chief marketing officer at KLA-Tencor. "To
understand patterning errors, chipmakers need to quantify process
variations, isolate their sources and fix the underlying issues.
The new metrology systems announced today generate critical data
that engineers can use to specify detailed scanner corrections in
the lithography module and process improvements in etch, films and
other modules. Our new overlay, patterned wafer geometry, optical
critical dimension and in-situ temperature measurement systems
serve key roles in driving 193i multi-patterning performance and
baselining early EUV lithography results."
The Archer 600 extends imaging-based overlay metrology
technology with new optics and novel measurement targets, helping
chipmakers achieve sub-3nm overlay error for advanced logic and
memory devices. Innovative ProAIM™ targets deliver better
resilience to process variations and improved correlation between
target and device overlay errors, producing more accurate overlay
measurements. The Archer 600's new optical technologies, including
a higher brightness light source and polarization module, enable
tighter overlay error feedback and control across a range of
process layers—from thin resists to opaque hard mask materials.
With enhanced productivity, the Archer 600 supports increased
sampling of overlay error for improved scanner corrections or
identification of inline excursions. Multiple Archer 600 systems
are already measuring the most advanced devices at foundry, logic
and memory manufacturers worldwide.
The WaferSight PWG2 produces comprehensive wafer stress and
shape uniformity data, enabling process tool monitoring and
matching for film deposition, anneal, etch and other process
modules. With significant productivity improvements, the WaferSight
PWG2 promotes increased wafer sampling in production, helping
chipmakers identify and fix process-induced wafer stress variations
that can cause patterning and yield issues. The WaferSight PWG2's
wafer shape data can also be fed forward to the lithography scanner
to address overlay errors due to wafer stress, a particular concern
for 3D NAND devices, which utilize thick film stacks that can
distort wafers. With industry-unique vertical wafer hold, the
WaferSight PWG2 measures front and back wafer surfaces
simultaneously, generating wafer flatness and topography metrics
that can improve prediction and control of scanner focus. Several
WaferSight PWG2 systems are installed at advanced IC manufacturers,
where they are used in development for lithography control, and in
high volume manufacturing to optimize and monitor a wide range of
fab processes.
The SpectraShape 10K optical-based metrology system measures the
CDs and three-dimensional shapes of complex IC device structures
following etch, chemical mechanical planarization (CMP) and other
process steps. To comprehensively characterize device structures,
the SpectraShape 10K employs a diverse array of optical
technologies, including new polarization capability and multiple
incidence angles for the ellipsometer, and a new high brightness
light source with TruNI™ illumination for the reflectometer. These
technologies enable accurate measurement of the numerous critical
parameters associated with FinFET and 3D NAND devices—such as CD,
height, SiGe shape and channel hole bow profile. With higher
throughput than its predecessor, the SpectraShape 10K facilitates
the increased sampling required for tighter process control and the
growth in number of process layers due to multi-patterning
techniques. The SpectraShape 10K has been strongly adopted by
foundries for FinFET and multi-patterning integration, with
additional systems supporting advanced 3D NAND fabrication at all
the leading memory manufacturers.
Through in-situ measurements, the SensArray HighTemp 4mm
wireless wafer provides temporal and spatial temperature
information for advanced films processes. With a thinner wafer
profile than its predecessor, the SensArray HighTemp 4mm is
compatible with a wider range of process tool types, including
track, strip and physical vapor deposition (PVD) systems. With a
temperature range of 20 – 400°C, the SensArray HighTemp 4mm enables
process characterization and tool qualification by mapping thermal
variations that can affect process windows and patterning
performance. Multiple SensArray HighTemp 4mm wafers are in use at
microprocessor, DRAM and 3D NAND manufacturers for tuning and
routine process monitoring of films applications.
The Archer 600, WaferSight PWG2, SpectraShape 10K and SensArray
HighTemp 4mm are integrated with KLA-Tencor's 5D Analyzer® advanced
data analysis system, which supports real-time process control and
provides tools for engineering monitoring and analysis. To maintain
the high performance and productivity demanded by IC manufacturing,
the Archer 600, WaferSight PWG2, SpectraShape 10K and SensArray
HighTemp 4mm are backed by KLA-Tencor's global comprehensive
service network. More information on the four new systems can be
found on the 5D Patterning Control Solution web page.
About KLA-Tencor:
KLA-Tencor Corporation, a leading
provider of process control and yield management solutions,
partners with customers around the world to develop
state-of-the-art inspection and metrology technologies. These
technologies serve the semiconductor, LED and other related
nanoelectronics industries. With a portfolio of
industry-standard products and a team of world-class engineers and
scientists, the company has created superior solutions for its
customers for more than 40 years. Headquartered in Milpitas, Calif., KLA-Tencor has dedicated
customer operations and service centers around the world.
Additional information may be found at www.kla-tencor.com
(KLAC-P).
Forward Looking Statements:
Statements in this press
release other than historical facts, such as statements regarding
the expected performance of the Archer 600, WaferSight PWG2,
SpectraShape 10K and SensArray HighTemp 4mm systems; the
extendibility of the Archer 600, WaferSight PWG2, SpectraShape 10K
and SensArray HighTemp 4mm systems to future technology nodes;
expected uses of the Archer 600, WaferSight PWG2, SpectraShape 10K
and SensArray HighTemp 4mm systems by KLA-Tencor's customers; and
the anticipated cost, operational and other benefits realizable by
users of the Archer 600, WaferSight PWG2, SpectraShape 10K and
SensArray HighTemp 4mm systems, are forward-looking statements, and
are subject to the Safe Harbor provisions created by the Private
Securities Litigation Reform Act of 1995. These forward-looking
statements are based on current information and expectations, and
involve a number of risks and uncertainties. Actual results may
differ materially from those projected in such statements due to
various factors, including delays in the adoption of new
technologies (whether due to cost or performance issues or
otherwise), the introduction of competing products by other
companies or unanticipated technological challenges or limitations
that affect the implementation, performance or use of KLA-Tencor's
products.
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SOURCE KLA-Tencor Corporation