Tower Semiconductor to Present at 2020 ICCAD China Addressing Advanced Analog IC Technology Solutions for 5G Application
08 December 2020 - 7:00PM
Focusing on the growing needs of the
Chinese market with Company’s comprehensive analog technology
platforms
MIGDAL HAEMEK, Israel, December
8, 2020 – Tower Semiconductor
(NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor
foundry solutions, today announced its participation at the
upcoming ICCAD 2020 which will be held in Chongqing International
Expo Center, China on December 10-11, 2020. During the conference,
Mr. Lei Qin, Vice President of China Operations Tower Semiconductor
will present “Advanced Analog IC Solutions in 5G Applications”,
reviewing Tower’s world-class RF & HPA platform and its newly
developed innovative solutions designed to address the evolving 5G
market needs and specifications in China and worldwide.
Presentation is scheduled for December 11, 2020 from
8:40-9:00am.
The Company will showcase its comprehensive
analog technology advanced solutions serving the needs of its
growing China customer base for innovative IC design, development
and manufacturing, including market-leading RF & HPA, best in
class Power Management, state of the art CMOS Image Sensor and
Non-Imaging technology.
Tower Semiconductor’s exhibition will be in Hall S2, booths
061-062.
For more information about Tower Semiconductor’s process
technology offerings, please click here or inquire
at: info@towersemi.com
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE:
TSEM), the leader in high-value analog semiconductor foundry
solutions, provides technology and manufacturing platforms for
integrated circuits (ICs) in growing markets such as consumer,
industrial, automotive, mobile, infrastructure, medical and
aerospace and defense. Tower Semiconductor’s focuses on creating a
positive and sustainable impact on the world through long term
partnerships and its advanced and innovative analog technology
offering, comprised of a broad range of customizable process
platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS
image sensor, non-imaging sensors, integrated power management (BCD
and 700V), and MEMS. Tower Semiconductor also provides world-class
design enablement for a quick and accurate design cycle as well as
Transfer Optimization and development Process Services (TOPS) to
IDMs and fabless companies. To provide multi-fab sourcing and
extended capacity for its customers, Tower Semiconductor operates
two manufacturing facilities in Israel (150mm and 200mm), two in
the U.S. (200mm) and three facilities in Japan (two 200mm and one
300mm) through TPSCo. For more information, please visit
www.towersemi.com.
Safe Harbor Regarding Forward-Looking
StatementsThis press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect Tower’s business is included under the heading “Risk
Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and
6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority. Tower does not intend
to update, and expressly disclaim any obligation to update, the
information contained in this release.
Tower Semiconductor (NASDAQ:TSEM)
Historical Stock Chart
From Apr 2024 to May 2024
Tower Semiconductor (NASDAQ:TSEM)
Historical Stock Chart
From May 2023 to May 2024