Deal Enables Japan-Asian Support for Growing
IC-Substrates and Advanced Circuit Solutions
SANTA
CLARA, Calif., June 20,
2024 /PRNewswire/ -- LQDX <lik-Wid-ix>,
developer of high-performance materials and process IP for advanced
semiconductor manufacturing, today announced that it has signed a
multi-year sales and licensing agreement with Kansai Denshi
Industries (KDI), enabling manufacturing support for next
generation IC-substrates in semiconductor packaging and advanced
printed circuit boards.
Under the terms of the transaction, LQDX will supply its Liquid
Metal Ink (LMIx®) chemistries and Aluminum
Clad Laminate (ACL®) products via its partnership with
Toyal-Alconix, as well as a process license for Ultra High-Density
Interconnect technology to support the rapidly growing demand in
the Japan-Asia market. LQDX's technology enables Kansai
Denshi, who has been producing 30-micron trace/space circuits, to
leapfrog, via development, to 5-micron trace/space products today
with a path to 2-micron trace/space by 2025.
"We are delighted to complete this deal with Kansai Denshi, and
to support it through our partnerships with Toyal and Alconix,"
said Simon McElrea, LQDX CEO.
"Japan is a critical global hub
for the Heterogeneous Integration market infection, and we have
been building our supply chain eco-system partnerships in-region
with key material, equipment and manufacturing leaders. We look
forward to supporting the Asian market with advanced interconnect
prototyping and manufacturing in the second half of this year."
Zazunori Miyabe, Board Director of KDI inc. stated, "For a
long time, Kansai Denshi Industries has specialized in developing
and acquiring the latest technologies to provide our customers with
the most advanced circuit designs and manufacturing solutions. By
adding LQDX's Liquid Metal Ink (LMIx®)
technology to our portfolio, we are now able to provide the most
advanced IC-substrates and printed circuit boards for the highest
performing applications."
About Kansai Denshi Industries:
Since its founding in 1973, KDI has specialized in the planning,
design and manufacturing of advanced printed circuit boards. In
addition to the technology and know-how accumulated for nearly 50
years since, the company has always researched and acquired the
latest technologies and responded to customer needs by introducing
state-of-the-art equipment and material technologies. KDI produces
many advanced products in high-speed, high-reliability and
high-performance applications and delivers products within the
industrial, automotive, aerospace, and communications sectors. To
learn more about the company, or to enquire about building Ultra
High-Density Interconnect solutions enabled by LQDX™, please
contact: https://www.kansaidenshi.com/inquiry/.
About LQDX:
LQDX pioneers advanced materials for AI and high-performance
computing applications, unlocking new possibilities for the
semiconductor industry. Founded in collaboration with the Stanford
Research Institute (SRI), the company, based in Silicon Valley
California, has developed a suite of cutting-edge chemistries and
process technologies to revolutionize chip interconnect
architecture. As the demand for computing power skyrockets with the
rapid rise of AI and ML computing, new tools are needed in the
semiconductor packaging and Ultra High-Density Interconnect (UHDI)
toolbox. At the heart of LQDX' portfolio
lies LMIx® - or Liquid Metal Ink
technology - a novel metallization chemistry suite that enables the
production of circuits up to 250 times denser than
conventional Printed Circuit Boards (PCBs). These advanced
features, previously exclusive to silicon, are essential to meet
the exponential growth demand in signal density required by
advanced chips and Chiplets. As an alternative to highly expensive
wafer processing which uses Physical Vapor Deposition (PVD)
technology, LMIx® is simple PVD-in-a-Bottle™
substitute that integrates seamlessly into existing
infrastructure.
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SOURCE LQDX