Aehr Test Systems to Participate at the Craig-Hallum Institutional Investor Conference in Minneapolis on May 31
25 May 2017 - 9:00PM
Aehr Test Systems (NASDAQ:AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
announced that Gayn Erickson, President and CEO, will participate
at the 14th Annual Craig-Hallum Institutional Investor Conference
taking place May 31, 2017 at The Depot Renaissance Minneapolis
Hotel in Minneapolis, MN.
Mr. Erickson will be hosting small group and one-on-one meetings
with institutional investors at the conference. A copy of the
investor presentation that he will use at the conference will be
posted in the Investor Relations section of Aehr Test’s website at
www.aehr.com.
About Aehr Test
SystemsHeadquartered in Fremont, California, Aehr Test
Systems is a worldwide provider of test systems for burning-in and
testing logic, optical and memory integrated circuits and has an
installed base of more than 2,500 systems worldwide. Increased
quality and reliability needs of the Automotive and Mobility
integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPak Aligner,
FOX-XP WaferPak Contactor, and FOX DiePak® Carrier. The ABTS system
is used in production and qualification testing of packaged parts
for lower power and higher power logic devices as well as all
common types of memory devices. The FOX-XP system is a full wafer
contact and singulated die/module test and burn-in system used for
burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test System’s website at
www.aehr.com.
Contacts:
Aehr Test Systems
Ken Spink
Chief Financial Officer
(510) 623-9400 x309
MKR Group Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com
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