Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications
01 April 2015 - 9:30PM
Business Wire
NSX Series was selected due to its specialized
die boundary inspection and highly sensitive detection
capabilities
Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a
major semiconductor foundry and a top outsourced semiconductor
assembly and test (OSAT) facility have placed multi-million dollar
orders totaling approximately $17 million for several NSX® Series
and Wafer Scanner™ inspection systems. Several systems were shipped
in the first quarter and the remaining will ship in the second
quarter. The orders represent the increasing value of Rudolph’s
flexible hardware and software solutions to meet the demanding
wafer-level packaging applications semiconductor manufacturers are
facing today.
The foundry customer will use the NSX systems for a rigorous
application—high-volume inspection of the die boundary area on
identity sensor devices. The OSAT will use the NSX and Wafer
Scanner systems for 2D/3D defect and bump inspection and edge die
chipping detection in the ramp of new copper (Cu) pillar bumping
and wafer-level-chip-scale-packaging (WLCSP) lines for smartphone
and automobile applications.
“We are pleased customers recognize our unique value proposition
and selected Rudolph in a very competitive macro inspection
market,” stated Mike Plisinski, executive vice president and chief
operating officer of Rudolph. “By working closely with industry
leaders, we will continue to increase our capabilities leveraging
all of Rudolph’s core technologies to provide comprehensive and
cost-effective solutions to our customers.”
“Our foundry customer found the inspection of die boundaries on
identity sensor devices, specifically in the street/kerf region, to
be a novel challenge due to the varying test structures in the
street. New advanced process materials are susceptible to defects
in these areas, which were previously not of concern,” stated Mike
Goodrich, vice president and general manager of Rudolph’s
Inspection Business Unit. “This particular application involves
reconstructed wafers that have unique types of defects that are
difficult to distinguish from nuisance defects. Our NSX system
offers advanced detection algorithms that were able to control this
new region of yield concern at the high throughput levels required
by the customer.”
Goodrich added, “Our OSAT customer was looking to ramp their Cu
pillar bump line fast and has come to rely on Rudolph for
fully-automated inspection to reduce operation costs, enhance
bumping and sawing quality and improve yield. At the customer’s
request, we will also initiate an evaluation of our automatic
defect and classification (ADC) software to further demonstrate
process control yield improvement.”
The NSX family is the market leader for automated macro defect
inspection for advanced packaging. The NSX system’s unique image
processing technique was critical for the challenging kerf
inspection application, where a traditional die-to-die comparison
would not suffice. The Wafer Scanner Series provides
three-dimensional (3D) inspection and bump height metrology
required throughout post-fab processes for both standard and flip
chip wafers.
For more information about Rudolph’s NSX Series and Wafer
Scanner Inspection System, please visit www.rudolphtech.com.
About Rudolph TechnologiesRudolph Technologies, Inc. is a
leader in the design, development, manufacture and support of
defect inspection, advanced packaging lithography, process control
metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a
full-fab solution through its families of proprietary products that
provide critical yield-enhancing information, enabling
microelectronic device manufacturers to drive down the costs and
time to market of their products. The Company’s expanding portfolio
of equipment and software solutions is used in both the wafer
processing and final manufacturing of ICs, and in adjacent markets
such as FPD, LED and Solar. Headquartered in Flanders, New Jersey,
Rudolph supports its customers with a worldwide sales and service
organization. Additional information can be found on the Company’s
website at www.rudolphtech.com.
Safe Harbor StatementThis press release contains
forward-looking statements within the meaning of the Private
Securities Litigation Reform Act of 1995 (the “Act”) which include
the benefits to customers of Rudolph’s products, Rudolph’s business
momentum and future growth, Rudolph’s existing market position and
its ability to maintain and advance such position relative to its
competitors and Rudolph’s ability to meet the expectations and
needs of our customers as well as other matters that are not purely
historical data. Rudolph wishes to take advantage of the “safe
harbor” provided for by the Act and cautions that actual results
may differ materially from those projected as a result of various
factors, including risks and uncertainties, many of which are
beyond Rudolph’s control. Such factors include, but are not limited
to, delays in shipping products for technical performance,
component supply or other reasons, the company’s ability to
leverage its resources to improve its positions in its core markets
and fluctuations in customer capital spending. Additional
information and considerations regarding the risks faced by Rudolph
are available in Rudolph’s Form 10-K report for the year ended
December 31, 2014 and other filings with the Securities and
Exchange Commission. As the forward-looking statements are based on
Rudolph’s current expectations, the company cannot guarantee any
related future results, levels of activity, performance or
achievements. Rudolph does not assume any obligation to update the
forward-looking information contained in this press release.
Rudolph Contacts:Investors:Steven R. Roth,
973-448-4302steven.roth@rudolphtech.comorGuerrant AssociatesLaura
Guerrant-Oiye, 808-882-1467Principallguerrant@guerrantir.comorTrade
Press:Amy Shay, 952-259-1794amy.shay@rudolphtech.com
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