Laird appoints Mike Bell as Chief Technology Officer

Laird PLC is pleased to announce the appointment of Mike Bell to the role of Chief Technology Officer. He will take up this new role in London and join the Executive Committee with effect from February 2018.

Mike will report directly into CEO Tony Quinlan and will be responsible for charting all aspects of Laird's technology agenda. He will help deliver world class innovation and the development of new products and processes across all Laird divisions.

Mike joins Laird with more than 20 years of experience in business transformation, product and technology leadership in the automotive and utilities sectors. He most recently served as Executive Vice President of Devices & IoT at Canonical Ltd, the computer software company. Prior to this, he spent six years at Jaguar Land Rover as Chief Technology Officer and latterly as Connected Car Director. He obtained a BSc and PhD in Computer Science from the University of Liverpool.

Tony Quinlan, CEO at Laird commented: "Mike is another excellent hire for the Group, further strengthening our leadership team which has been a key focus of mine. He brings a deep knowledge and understanding of our target markets, particularly in the automotive sector, and his expertise will contribute to our strategy and technical execution to help further drive Laird's business growth."

Mike Bell, CTO at Laird commented: "I am delighted to be joining such a forward-thinking and innovative company, where engineering and technology are at the centre of everything it does. Laird products are integrated into the offerings of countless world class companies and it will be an exciting opportunity to further enhance this position."

ENDS

Enquiries:

Laird PLC

MHP Communications

Tony Quinlan, Chief Executive Officer

Peter Jenkins, Director of Communications

Reg Hoare

Tim Rowntree

Ollie Hoare

Tel: +44 (0)20 7468 4040

Tel: +44 (0)20 3128 8100

About Laird PLC:

Laird is a global technology company providing systems, components and solutions that protect electronics from electromagnetic interference and heat, and that enable connectivity in mission-critical wireless applications and antennae systems.

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