Applied Materials Advances Ion Implant Technology for 3D Chip Architectures
30 June 2014 - 9:30PM
- New Applied Varian
VIISta® 900 3D system
delivers unsurpassed beamline precision
for doping complex FinFET and 3D memory
structures
- Unique beam shape control
coupled with SuperScan(TM) 3
technology reduces device variability, while superior particle
performance boosts production yields
SANTA CLARA, Calif., June 30, 2014 - Applied
Materials, Inc. today announced the Applied Varian VIISta® 900
3D system, the industry's state-of-the-art medium-current ion
implantation tool developed for manufacturing FinFET and 3D NAND
designs at sub-2x nanometer nodes. This system features innovations
in precision materials engineering that deliver unprecedented
levels of control needed to improve device performance, reduce
variability, and boost yields of increasingly complex
high-performance, high density 3D devices.
The VIISta 900 3D system offers enhanced beam
angle precision, breakthrough beam shape accuracy and superior dose
and uniformity control that enable customers to achieve process
repeatability and optimize device performance. The system's unique
hot implant technology and triple magnet architecture additionally
boost yield by minimizing defects. These combined capabilities
support the precision implants required for manufacturing complex
3D architectures.
"Consumer demand for enhanced mobility puts
tremendous pressure on chip makers to deliver higher performance,
lower power devices, which results in complex challenges," said
Gary Rosen, vice president and general manager of Applied's Varian
Semiconductor Equipment business unit. "Specifically developed for
3D designs, the VIISta 900 3D ion implantation tool helps solve our
customers' toughest device challenges by providing the purest, most
precise implants available for improved device performance and
yield."
A key innovation of the VIISta 900 3D system is
its SuperScan 3 technology that utilizes the tool's unique beam
shape control to support customized wafer dose patterning by
delivering accurate, precise dosing for virtually any desired
pattern. SuperScan 3 corrects for non-implant process variations to
improve device performance and yield for 3D devices. These
capabilities together with productivity improvements and the
system's high throughput provide customers significant
cost-of-ownership benefits.
Complementing its leading-edge capabilities for
FinFET and 3D NAND device fabrication, the precision and
low-contamination performance of the VIISta 900 3D tool also makes
it an optimal solution for doping the photodiode and logic layers
of CMOS image sensors.
Applied Materials, Inc. (Nasdaq:AMAT) is the
global leader in precision materials engineering solutions for the
semiconductor, flat panel display and solar photovoltaic
industries. Our technologies help make innovations like
smartphones, flat screen TVs and solar panels more affordable and
accessible to consumers and businesses around the world. Learn more
at www.appliedmaterials.com.
# # #
Contact:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977
PHOTO: Applied Varian VIISta® 900
3D system
This
announcement is distributed by NASDAQ OMX Corporate Solutions on
behalf of NASDAQ OMX Corporate Solutions clients.
The issuer of this announcement warrants that they are solely
responsible for the content, accuracy and originality of the
information contained therein.
Source: Applied Materials via Globenewswire
HUG#1806430
Applied Materials (NASDAQ:AMAT)
Historical Stock Chart
From Apr 2024 to May 2024
Applied Materials (NASDAQ:AMAT)
Historical Stock Chart
From May 2023 to May 2024