ROCKVILLE, Md.,
March 1, 2022
/PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of
wireless connectivity and smart sensing technologies and integrated
IP solutions, today announced that more than 100 million
CEVA-powered cellular IoT chips have been shipped by CEVA licensees
since the beginning of 2020. This significant milestone comes on
the back of the rapid adoption of cellular connectivity in
wearables, smart meters, asset trackers and industrial devices
based on the LTE Cat-1, LTE-M and NB-IoT standards, all of which
CEVA addresses with its family of cellular IoT DSPs and platforms,
including the CEVA-Dragonfly NB2 NB-IoT solution.
The recent Ericsson Mobility Report forecasts that cellular IoT
connections will grow from 2.4 billion in 2022 to reach 5.5 billion
in 2027, a CAGR of 18%. Moreover, after a slow start, Massive IoT
connections (LTE-M, NB-IoT) are expected to grow at a CAGR of 37%
during the same period, comprising more than half of all cellular
IoT connections. CEVA has a large and diverse global cellular IoT
customer base, with more than a dozen licensees today developing
cellular IoT chips for modules, consumer, industrial and smart grid
use cases. As 5G networks continue to be rolled out around the
world and upcoming releases of the standard set to address 5G IoT
use cases, CEVA's cellular IoT DSPs and platforms lower the entry
barriers for semiconductor companies and OEMs to develop their own
cellular IoT SoCs and address this burgeoning market.
Tal Shalev, Vice President and
General Manager of the Wireless IoT Business Unit at CEVA,
commented: "We're proud to have reached this important milestone of
helping our customers ship more than 100 million cellular IoT chips
powered by CEVA IP. Connectivity is
a key technology driving the rapid digitization of everything and
CEVA together with our licensees, play a fundamental role in the
growing use of cellular networks to connect IoT devices. We are
excited to watch this market growth and look forward to seeing what
innovations the next 100 million CEVA-powered cellular IoT chips
bring to the smart and connected world."
The CEVA-Dragonfly NB2 platform is a pre-certified, complete
NB-IoT IP solution that can serve a wide range of applications. It
integrates a CEVA-BX1 processor, an optimized RF transceiver,
baseband, and a protocol stack, offering a Release 15 Cat-NB2
compliant modem solution that reduces time-to-market and lowers
entry barriers. The CEVA-Dragonfly NB2 is a fully
software-configurable solution designed for ultra-low power and
low-cost devices that can be extended with multi-constellation GNSS
and sensor fusion functionality. For other massive IoT and
broadband IoT use cases, the CEVA-BX1 and CEVA-BX2 multipurpose IoT
processors combine DSP and control processing in a single
instruction set architecture, eliminating the need for a separate
CPU core for upper layer stacks and system control. These
processors are ideal for cellular IoT baseband processing and
complementary workloads including voice, connectivity, positioning
and sensor fusion. For more information on CEVA's Wireless IoT
platforms, go to https://www.ceva-dsp.com/app/connectivity/.
About CEVA, Inc.
CEVA is the leading licensor of
wireless connectivity and smart sensing technologies and integrated
IP solutions for a smarter, safer, connected world. We provide
Digital Signal Processors, AI engines, wireless platforms,
cryptography cores and complementary software for sensor fusion,
image enhancement, computer vision, voice input and artificial
intelligence. These technologies are offered in combination with
our Intrinsix IP integration services, helping our customers
address their most complex and time-critical integrated circuit
design projects. Leveraging our technologies and chip design
skills, many of the world's leading semiconductors, system
companies and OEMs create power-efficient, intelligent, secure and
connected devices for a range of end markets, including mobile,
consumer, automotive, robotics, industrial, aerospace & defense
and IoT.
Our DSP-based solutions include platforms for 5G baseband
processing in mobile, IoT and infrastructure, advanced imaging and
computer vision for any camera-enabled device, audio/voice/speech
and ultra-low-power always-on/sensing applications for multiple IoT
markets. For sensor fusion, our Hillcrest
Labs sensor processing technologies provide a broad range of
sensor fusion software and inertial measurement unit ("IMU")
solutions for markets including hearables, wearables, AR/VR, PC,
robotics, remote controls and IoT. For wireless IoT, our platforms
for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6/6E
(802.11n/ac/ax), Ultra-wideband (UWB), NB-IoT and GNSS are the most
broadly licensed connectivity platforms in the industry.
Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube,
Facebook, LinkedIn and Instagram.
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SOURCE CEVA, Inc.