Lam Research Unveils Technology Breakthrough for EUV Lithography
27 February 2020 - 1:30AM
Lam Research Corp. (Nasdaq: LRCX) today announced a dry resist
technology for extreme ultraviolet (EUV) patterning. By combining
Lam’s deposition and etch process leadership with strategic
partnerships with ASML and imec, Lam is developing a new dry resist
technology that will help to extend the resolution, productivity,
and yield of EUV lithography. Lam’s dry resist solutions offer
significant EUV sensitivity and resolution advantages and thus an
improved overall cost for each EUV wafer pass.
As EUV lithography systems are now being used in high volume
manufacturing by leading-edge chipmakers, further improvements to
productivity and resolution will help extend affordable scaling to
future process nodes. Lam’s new dry resist application and
development technologies will enable lower dose and increased
resolution, thereby increasing productivity and enlarging the
exposure process window. Additionally, by utilizing five to ten
times less raw materials, Lam’s dry resist approach provides
significant running cost savings to customers while also delivering
a more sustainable solution for environmental, social, and
governance (ESG) measures.
“After more than twenty years of sustained R&D by ASML and
its partners, EUV is now being used in high volume chip
manufacturing,” said Peter Wennink, president and CEO of ASML. “We
are committed to maturing and extending this technology further
through close collaboration with Lam Research and imec. This
strategic partnership on dry resist technology supports chipmakers
to innovate higher performance chips at lower cost, unlocking the
potential of technology for society.”
“This technology breakthrough is a perfect example of innovation
through collaboration and how our valued partnerships with ASML and
imec continue to bring new benefits to customers and the industry,”
said Tim Archer, president and CEO of Lam Research. “Lam continues
to lead in deposition and etch, and we are excited by this new
opportunity to expand our patterning solutions directly into
photosensitive lithographic materials. This new capability
demonstrates Lam’s comprehensive patterning strategy, first
enabling the industry to scale with multiple patterning solutions
and now by enhancing the productivity and performance of EUV.”
Lam is engaged with multiple chipmakers in solving key
challenges of EUV lithography using this dry resist technology. The
new dry resist technology enables continued scaling for advanced
logic and memory devices.
“Optimizing a patterning process requires a lot of diverse
skills, and for many years, imec has been pioneering the patterning
process development in collaboration with key industry partners,”
said Luc Van den hove, president and CEO of imec. “Dry resist can
be a key enabling technology for further adoption of EUV
lithography and acceleration of the technology roadmap. Together
with Lam and ASML, we aim to optimize the dry resist technology to
get the best possible performance.”
Lam will present its new technology development at the SPIE
Advanced Lithography conference in San Jose at 9:40 a.m. PST on
February 26, 2020.
About Lam ResearchLam Research
Corporation is a global supplier of innovative wafer
fabrication equipment and services to the semiconductor industry.
As a trusted, collaborative partner to the world’s leading
semiconductor companies, we combine superior systems engineering
capability, technology leadership, and unwavering commitment to
customer success to accelerate innovation through enhanced device
performance. In fact, today, nearly every advanced chip is built
with Lam technology. Lam Research (Nasdaq: LRCX) is a
FORTUNE 500® company headquartered in Fremont, Calif., with
operations around the globe. Learn more
at www.lamresearch.com. (LRCX-T)
Caution Regarding Forward-Looking
StatementsStatements made in this press release that are
not of historical fact are forward-looking statements and are
subject to the safe harbor provisions created by the Private
Securities Litigation Reform Act of 1995. Such forward-looking
statements relate to, but are not limited to: the performance of
Lam’s tools and processes and, specifically, the performance and
advantages obtained through the use of Lam’s new dry resist
technology; the effect of that new technology on the cost and
productivity of EUV lithography; the need for improvements to the
productivity and resolution of EUV lithography; the amount of raw
material saved by use of the new technology; and the benefits of
industry collaborations. These statements are based on current
expectations and are subject to risks, uncertainties, and changes
in condition, significance, value and effect including those risks
and uncertainties that are described in the documents filed or
furnished by us with the Securities and Exchange
Commission, including specifically our annual report on Form 10-K
for the fiscal year ended June 30, 2019 and our quarterly
reports on Form 10-Q for the fiscal
quarters ended December 29, 2019 and September 29, 2019.
These uncertainties and changes could materially affect the
forward-looking statements and cause actual results to vary from
expectations in a material way. The Company undertakes no
obligation to update the information or statements made in this
release.
Company Contacts: Libra White
Media Relations (510) 572-7725 publicrelations@lamresearch.com Ram
Ganesh Investor Relations (510) 572-1615
investor.relations@lamresearch.com
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