Mindspeed & Radisys to Demonstrate Integrated Hardware & Software Platform for LTE Small Cell Base Stations at Mobile World C...
27 February 2012 - 7:00PM
Business Wire
Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading
supplier of semiconductor solutions for network infrastructure
applications, and Radisys® Corporation (NASDAQ: RSYS), a leading
provider of embedded wireless infrastructure solutions, today
announced that the companies will showcase long-term evolution
(LTE) base station advances at Mobile World Congress 2012 at
Mindspeed's booth (1E.57) at the Fira Montjuïc in Barcelona, Spain
from February 27 to March 1, 2012.
The companies will demonstrate a commercially-available eNodeB
small cell reference design based on a single SoC. The design
utilizes Mindspeed®’s carrier-class L1 PHY software and
production-grade Transcede® 4000-series SoC. Radisys will highlight
its fully integrated Trillium LTE TOTALeNodeB software with the
Mindspeed Transcede SoC processors to support the demonstration.
The Trillium LTE wireless software provides TEMs with a complete,
integrated LTE eNodeB and meets the unique requirements of the
network equipment provider. It includes the Trillium LTE eNodeB
application, radio resource management (RRM), radio environment
monitoring (REM), self-organizing network (SON), schedulers and all
of the Trillium protocol layers and stretches from all variations
of small cells up to macro cells.
“Mindspeed's Transcede families of processors are a strong
solution for small cell access stations. We are working jointly to
support multiple customer deployments and have joint engagements
that will achieve deployment in the near future. We are also
excited about the opportunity to collaborate with Mindspeed in the
Picochip integration to deliver a dual mode solution,” said Todd
Mersch, product line management director at Radisys.
Mindspeed’s Transcede family of processors are complete NodeB
and eNodeB SoC solutions that support concurrent 3G and LTE
processing in a single device, including time division synchronous
code division multiple access (TD-SCDMA), wideband code division
multiple access (WCDMA)/ evolved high-speed packet access (HSPA+)
and both frequency division duplexing LTE (FDD-LTE) and time
division duplexing LTE (TDD-LTE), with a roadmap to LTE-Advanced
(LTE-A). Combining 3G and LTE processing capabilities into a single
chip is more cost effective for original equipment manufacturers
(OEMs), and the inclusion of a carrier-class physical-layer (PHY)
software solution for both 3G and LTE will accelerate time to
market, while simplifying development and reducing risk.
“The Transcede family of processors deliver advanced processing
performance, design flexibility and optimal power consumption for
the architects of next-generation small cell base stations,” said
Alan Taylor, director of marketing for the communications
convergence processing (CCP) business unit at Mindspeed. “In
Barcelona, we will show how a complete, pre-integrated eNodeB
software suite communicating via RF to a commercial 4G/LTE USB
modem at full throughput can power the next wave of base station
development.”
About Mindspeed Technologies
Mindspeed Technologies (NASDAQ: MSPD) is a leading provider of
network infrastructure semiconductor solutions to the
communications industry. The company's low-power system-on-chip
(SoC) products are helping to drive video, voice and data
applications in worldwide fiber-optic networks and enable advanced
processing for 3G and long-term evolution (LTE) mobile networks.
The company's high-performance analog products are used in a
variety of optical, enterprise, industrial and video transport
systems. Mindspeed's products are sold to original equipment
manufacturers (OEMs) around the globe.
To learn more, please visit www.mindspeed.com. Company news
and updates are also posted at www.twitter.com/mindspeed.
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