SAN JOSE, Calif., Sept. 9, 2020 /PRNewswire/ -- Rambus
Inc. (NASDAQ: RMBS), a premier silicon IP and chip
provider making data faster and
safer, today announced it has achieved a record 4 Gbps
performance with the Rambus HBM2E memory interface
solution consisting of a fully-integrated PHY and controller.
Paired with the industry's fastest HBM2E DRAM from SK hynix
operating at 3.6 Gbps, the solution can deliver 460 GB/s of
bandwidth from a single HBM2E device. This performance meets the
terabyte-scale bandwidth needs of accelerators targeting the most
demanding AI/ML training and high-performance computing (HPC)
applications.
"With this achievement by Rambus, designers of AI and HPC
systems can now implement systems using the world's fastest HBM2E
DRAM running at 3.6 Gbps from SK hynix," said Uksong Kang, vice
president of product planning at SK hynix. "In July, we announced
full-scale mass-production of HBM2E for state-of-the-art computing
applications demanding the highest bandwidth available."
The fully-integrated, production-ready Rambus HBM2E memory
subsystem runs at 4 Gbps without PHY voltage overdrive. Rambus
teamed with SK hynix and Alchip to implement the HBM2E 2.5D system
to validate in silicon the
Rambus HBM2E PHY and Memory Controller IP using TSMC's N7 process
and CoWoS® (Chip-on-Wafer-on-Substrate) advanced
packaging technologies. Co-designing with the engineering team from
Rambus, Alchip led the interposer and package substrate design.
"This advancement of Rambus and its partners, using TSMC's
advanced process and packaging technologies, is another important
achievement of our ongoing collaboration with Rambus," said
Suk Lee, senior director of the
Design Infrastructure Management Division at TSMC. "We look forward
to a continued partnership with Rambus to enable the highest
performance in AI/ML and HPC applications."
"Alchip brought a demonstrated track record of success in 7nm
and 2.5D package design to this initiative," said Johnny Shen, CEO of Alchip Technologies. "We're
extremely proud of our contributions to Rambus' breakthrough
achievement."
Rambus has 30 years of high-speed memory design applied to the
most demanding computing applications. Its renowned signal
integrity expertise was key to achieving an HBM2E memory interface
capable of 4 Gbps operation. This raises a new benchmark for
meeting the insatiable bandwidth requirements of AI/ML
training.
"With silicon operation up to 4 Gbps, designers can future-proof
their HBM2E implementations and can be confident of ample margin
for 3.6 Gbps designs," said Matthew
Jones, senior director and general manager of IP cores at
Rambus. "As part of every customer engagement, Rambus provides
reference designs for the 2.5D package and interposer to ensure
first-time right implementations for mission-critical AI/ML
designs."
Benefits of the Rambus HBM2E Memory Interface (PHY and
Controller):
- Achieves the industry's highest speed of 4 Gbps per pin,
delivering a system bandwidth of 460 GB from a single 3.6 Gbps
HBM2E DRAM 3D device.
- Fully-integrated and verified HBM2E PHY and Controller reduces
ASIC design complexity and speeds time to market
- Includes 2.5D package and interposer reference design as part
of IP license
- Provides access to Rambus system and SI/PI experts helping ASIC
designers to ensure maximum signal and power integrity for devices
and systems
- Features LabStation™ development environment that enables quick
system bring-up, characterization and debug
- Supports high-performance applications including
state-of-the-art AI/ML training and high-performance computing
(HPC) systems
For more information on the Rambus Interface IP, including our
PHYs and Controllers, please
visit rambus.com/interface-ip.
Follow Rambus:
Company
website: rambus.com
Rambus blog: rambus.com/blog
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc
About Rambus Inc.
Rambus is a premier silicon IP and
chip provider that makes data faster and safer. With 30 years of
innovation, we continue to develop the foundational technology for
all modern computing systems. Leveraging our semiconductor
expertise, Rambus solutions speed performance, expand capacity and
improve security for today's most demanding applications. From data
center and edge to artificial intelligence and automotive, our
interface and security IP, and memory interface chips enable SoC
and system designers to deliver their vision of the future. For
more information, visit rambus.com.
Press Contact:
Cori
Pasinetti
Rambus Corporate Communications
t: (650) 309-6226
cpasinetti@rambus.com
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SOURCE Rambus Inc.