Tower Semiconductor to Present at SPI Forum Hosted by Semicon Portal Showcasing its Broad Range of Market-Leading Analog Tech...
28 October 2020 - 8:00PM
NEWS ANNOUNCEMENT
FOR
IMMEDIATE RELEASE
Addressing the needs of domestic and
worldwide semiconductor companies with innovative analog
technological solutions and manufacturing excellence
MIGDAL HAEMEK, Israel, October 28,
2020 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leader
in high-value analog semiconductor foundry solutions, today
announced its participation at the upcoming SPI Forum, hosted by
Semicon Portal, presenting the Company’s broad range of market
leading analog technologies and process offerings, addressing the
unique needs of semiconductor companies in Japan and worldwide.
As part of its global spread, the Company
operates three manufacturing facilities in Japan. As the sole
domestic pure play analog foundry, Tower drives highly successful
collaborations with a variety of local semiconductor companies,
providing state-of-the-art, innovative solutions bringing to market
new and break-through products.
During the online conference, Tower will hold a
presentation on: Market leading analog foundry solutions for
advanced semiconductor market needs. The session will be presented
by Kenji Tateiwa, General Manager of R&D Strategic Planning,
Process Technology Center at TPSCo, and will be held on Wednesday,
November 4, 2020 at 14:55-15:30 Japan local time.
For additional information, agenda, and
registration, please visit the event page here.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE:
TSEM), the leader in high-value analog semiconductor foundry
solutions, provides technology and manufacturing platforms for
integrated circuits (ICs) in growing markets such as consumer,
industrial, automotive, mobile, infrastructure, medical and
aerospace and defense. Tower Semiconductor’s focuses on creating
positive and sustainable impact on the world through long term
partnerships and its advanced and innovative analog technology
offering, comprised of a broad range of customizable process
platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS
image sensor, non-imaging sensors, integrated power management (BCD
and 700V), and MEMS. Tower Semiconductor also provides world-class
design enablement for a quick and accurate design cycle as well as
Transfer Optimization and development Process Services (TOPS) to
IDMs and fabless companies. To provide multi-fab sourcing and
extended capacity for its customers, Tower Semiconductor operates
two manufacturing facilities in Israel (150mm and 200mm), two in
the U.S. (200mm) and three facilities in Japan (two 200mm and one
300mm) through TPSCo. For more information, please visit
www.towersemi.com.
Safe Harbor Regarding Forward-Looking
StatementsThis press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect Tower’s business is included under the heading “Risk
Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and
6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority. Tower does not intend
to update, and expressly disclaim any obligation to update, the
information contained in this release.
###
Tower Semiconductor Company
Contact: Orit Shahar | +972-74-7377440 |
oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact:
Noit Levy | +972-4-604-7066 | noitle@towersemi.com
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