Leading semiconductor foundry ready to
manufacture Invensas wafer bonding and 3D interconnect technology
for image sensor solutions
Semiconductor Manufacturing International Corporation (“SMIC”)
(NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries
in the world and the largest and most advanced foundry in mainland
China, and Invensas, a wholly owned subsidiary of Xperi Corporation
(“Xperi”) (NASDAQ: XPER), today announced the establishment of
Invensas’ Direct Bond Interconnect (DBI®) technology at SMIC’s
Avezzano facility. This capability enables SMIC to support the
growing demand for high performance, hybrid stacked backside
illuminated (BSI) image sensors, as well as other semiconductor
devices, in a wide range of end applications including smartphones
and automobiles. SMIC and Invensas previously signed a Development
License in March 2017.
“By working closely with the Invensas team, we have been able to
quickly bring in the DBI manufacturing process and are now prepared
to offer DBI for image sensors, MEMS sensor hubs, Power Management
IC, and beyond to our customers at 200mm,” said Roberto Bez, vice
president of technology development at LFoundry, SMIC’s subsidiary
in Avezzano, Italy.
“Invensas’ DBI technology enables SMIC to manufacture the high
performance image sensors required in mobile, automotive, and
consumer electronics applications,” said Sunny Hui, senior vice
president of marketing at SMIC. “With this technology in place,
SMIC is prepared to further expand this capability into volume
manufacturing around the globe, both at 200mm and 300mm.”
“SMIC’s talented manufacturing team has done an excellent job
integrating our DBI process into their high-volume manufacturing
environment,” said Craig Mitchell, president of Invensas. “We are
thrilled to announce that SMIC is ready to engage commercial
customers and support the demand for high volume production of BSI
image sensors with DBI. We look forward to continuing to work
together to expand this technology platform into other products and
applications.”
DBI technology is a low temperature hybrid wafer bonding
solution that allows wafers to be bonded with scalable fine pitch
3D electrical interconnect without requiring bond pressure. DBI 3D
interconnect can eliminate the need for through-silicon vias (TSVs)
and reduce die size and cost while enabling pixel level
interconnect for future generations of image sensors.
About Xperi Corporation
Xperi Corporation (Nasdaq: XPER) and its brands, DTS,
FotoNation, HD Radio, Invensas and Tessera, are dedicated to
creating innovative technology solutions that enable extraordinary
experiences for people around the world. Xperi’s solutions are
licensed by hundreds of leading global partners and have shipped in
billions of products in areas including premium audio,
broadcast, automotive, computational imaging, computer
vision, mobile computing and communications, memory, data
storage, and 3D semiconductor interconnect and
packaging. For more information, please call 408-321-6000 or
visit www.xperi.com.
DTS, Xperi and their respective logos are trademarks or
registered trademarks of affiliated companies of Xperi Corporation
in the United States and other countries. All other company, brand
and product names may be trademarks or registered trademarks of
their respective companies.
Xperi Safe Harbor Statement
This press release contains forward-looking statements, which
are made pursuant to the safe harbor provisions of the Private
Securities Litigation Reform Act of 1995. Forward-looking
statements involve risks and uncertainties that could cause actual
results to differ significantly from those projected, particularly
with respect to the features, benefits, characteristics and
availability of Invensas’ Direct Bond Interconnect technology.
Material factors that may cause results to differ from the
statements made include the plans or operations relating to the
businesses of Xperi; market or industry conditions; changes in
patent laws, regulation or enforcement, or other factors that might
affect Xperi's ability to protect or realize the value of its
intellectual property; the expiration of license agreements and the
cessation of related royalty income; the failure, inability or
refusal of licensees to pay royalties; initiation, delays, setbacks
or losses relating to Xperi's intellectual property or intellectual
property litigations, or invalidation or limitation of key patents;
fluctuations in operating results due to the timing of new license
agreements and royalties, or due to legal costs; the risk of a
decline in demand for semiconductors and products utilizing our
audio and imaging technologies; failure by the industry to use
technologies covered by Xperi's patents; the expiration of Xperi's
patents; Xperi's ability to successfully complete and integrate
acquisitions of businesses; the risk of loss of, or decreases in
production orders from, customers of acquired businesses; financial
and regulatory risks associated with the international nature of 's
businesses; failure of Xperi's products to achieve technological
feasibility or profitability; failure to successfully commercialize
Xperi's products; changes in demand for the products of Xperi's
customers; limited opportunities to license technologies due to
high concentration in applicable markets for such technologies; the
impact of competing technologies on the demand for Xperi's
technologies; failure to realize the anticipated benefits of
Xperi's recent acquisition of DTS, Inc., including as a result of
integrating the business of DTS; pricing trends, including Xperi's
ability to achieve economies of scale; the expected amount and
timing of cost savings and operating synergies; and other
developments in the markets in which Xperi operates, as well as
management's response to any of the aforementioned factors. You are
cautioned not to place undue reliance on the forward-looking
statements, which speak only as of the date of this release.
The foregoing review of important factors should not be
construed as exhaustive and should be read in conjunction with the
other cautionary statements that are included herein and elsewhere,
including the Risk Factors included in Xperi's recent reports on
Form 10-K and Form 10-Q and other documents of Xperi on file with
the Securities and Exchange Commission (the "SEC"). Xperi's SEC
filings are available publicly on the SEC's website at www.sec.gov.
Any forward-looking statements made or incorporated by reference
herein are qualified in their entirety by these cautionary
statements, and there can be no assurance that the actual results
or developments anticipated by Xperi will be realized or, even if
substantially realized, that they will have the expected
consequences to, or effects on, Xperi or its business or
operations. Except to the extent required by applicable law, Xperi
undertakes no obligation to update publicly or revise any
forward-looking statement, whether as a result of new information,
future developments or otherwise.
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC";
NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries
in the world and the largest and most advanced foundry in mainland
China. SMIC provides integrated circuit (IC) foundry and technology
services on process nodes from 0.35 micron to 28 nanometer.
Headquartered in Shanghai, China, SMIC has an international
manufacturing and service base. In China, SMIC has a 300mm wafer
fabrication facility (fab) and a 200mm fab in Shanghai; a 300mm fab
and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm
fabs in Tianjin and Shenzhen; and a majority-owned joint-venture
300mm bumping facility in Jiangyin; additionally, in Italy SMIC has
a majority-owned 200mm fab. SMIC also has marketing and customer
service offices in the U.S., Europe, Japan, and Taiwan, and a
representative office in Hong Kong.
For more information, please visit www.smics.com.
SMIC Safe Harbor Statement
(Under the Private Securities Litigation Reform Act of 1995)
This press release contains, in addition to historical
information, "forward-looking statements" within the meaning of the
"safe harbor" provisions of the U.S. Private Securities Litigation
Reform Act of 1995. These forward-looking statements are based on
SMIC's current assumptions, expectations and projections about
future events. SMIC uses words like "believe," "anticipate,"
"intend," "estimate," "expect," "project," "target" and similar
expressions to identify forward looking statements, although not
all forward-looking statements contain these words. These
forward-looking statements are necessarily estimates reflecting the
best judgment of SMIC's senior management and involve significant
risks, both known and unknown, uncertainties and other factors that
may cause SMIC's actual performance, financial condition or results
of operations to be materially different from those suggested by
the forward-looking statements including, among others, risks
associated with cyclicality and market conditions in the
semiconductor industry, intense competition in the semiconductor
industry, SMIC's reliance on a small number of customers, timely
wafer acceptance by SMIC's customers, timely introduction of new
technologies, SMIC's ability to ramp new products into volume,
supply and demand for semiconductor foundry services, industry
overcapacity, shortages in equipment, components and raw materials,
availability of manufacturing capacity, financial stability in end
markets, orders or judgments from pending litigation, intensive
intellectual property litigation in semiconductor industry, general
economic conditions and fluctuations in currency exchange
rates.
In addition to the information contained in this press release,
you should also consider the information contained in our other
filings with the SEC, including our annual report on Form 20-F
filed with the SEC on April 27, 2017, especially in the "Risk
Factors" section and such other documents that we may file with the
SEC or The Hong Kong Stock Exchange Limited ("SEHK") from time to
time, including current reports on Form 6-K. Other unknown or
unpredictable factors also could have material adverse effects on
our future results, performance or achievements. In light of these
risks, uncertainties, assumptions and factors, the forward-looking
events discussed in this press release may not occur. You are
cautioned not to place undue reliance on these forward-looking
statements, which speak only as of the date stated or, if no date
is stated, as of the date of this press release. Except as may be
required by law, SMIC undertakes no obligation and does not intend
to update any forward-looking statement, whether as a result of new
information, future events or otherwise.
SOURCE: XPERI CORPORATION
XPER-I
View source
version on businesswire.com: http://www.businesswire.com/news/home/20171108005383/en/
SMIC Media ContactTerry Ding+86-21-3861-0000
x16812Terry_Ding@smics.comorXperi PR Agency Contact:The
Brand AmpNicole Fait, +1
949-438-1104nicolef@thebrandamp.comorXperi PR Contact:Jordan
Miller, +1 818-436-1082jordan.miller@xperi.comorXperi Investor
Relations Contact:Geri Weinfeld, +1
818-436-1231geri.weinfeld@xperi.com
Semiconductor Manufacturing (NYSE:SMI)
Historical Stock Chart
From Apr 2024 to May 2024
Semiconductor Manufacturing (NYSE:SMI)
Historical Stock Chart
From May 2023 to May 2024