BARCELONA, Spain, Feb. 24, 2014 /PRNewswire/ -- MOBILE WORLD
CONGRESS -- Texas Instruments (TI) (NASDAQ: TXN) and
Airspan Networks Inc., a global provider of 4G broadband wireless
systems and solutions, announced a new collaboration –
Airspan's Small Cell LTE solution, AirSynergy.
With TI's KeyStoneTM-based wireless infrastructure
System-on-Chips (SoCs), Airspan is able to leverage their software
investment and enhance functionality and performance of their LTE
small cell with a range of integrated wireless backhaul options
including support for both LTE relay and hybrid non-line-of-sight
(NLOS) connectivity. TI's KeyStone technology enables Airspan to
deliver a small cell product which is significantly differentiated
from their competition.
"We are confident that adopting TI's wireless infrastructure
solutions is a game changer for Small Cell LTE deployments," said
Paul Senior, CTO, Airspan. "The
integration of wireless backhaul with the outdoor pico eNB
dramatically reduces overall small cell TCO. By leveraging the
advanced features that the platform can support ensures consistent
quality of experience as a user moves between macro and pico RAN
layers."
Leveraging TI's platform for its next generation of small cell
backhaul products, Airspan offers a highly flexible Software
Defined Radio (SDR) platform enabling multi-mode operation
including LTE relay and complementary alternative wireless backhaul
options. Starting with 3GPP Release 10, Airspan's AirSynergy
solution has a roadmap to LTE-Advanced with capacity enhancing
features such as carrier aggregation. With options for tight
integration with outdoor pico cell eNB, TI's KeyStone-based
solution forms the heart of Airspan's Software Defined Networking
(SDN) solution for small cell backhaul over multiple wireless and
wireline technologies.
TI's wireless infrastructure SoCs leverage the fastest dual
ARM® Cortex® -A15 RISC processors and TI's fixed- and
floating-point TMS320C66x digital signal processor (DSP) generation
cores as part of TI's highly efficient KeyStone SoC
architecture. Additionally TI's broad resources bring the most
comprehensive portfolio of processing, software and complementary
support devices to Airspan. TI also offers a complimentary
portfolio of analog components, including the AFE7500 analog front
end (AFE) transceiver, clock and timer, and Power over Ethernet
(PoE+) solutions for both ends of the cable. This places TI in a
unique position in the industry to meet small cell backhaul
challenges at a system level.
"We are excited to be collaborating with Airspan on their
next-generation AirSynergy small cell solution," said Ruwanga
Dassanayake, worldwide business manager, communications
infrastructure, TI. "Airspan is generating buzz in this fast
growing market with their integrated outdoor pico small cell and
backhaul approach, and we look forward to seeing their small cell
solution deployed in the field quickly."
Visit TI @ Mobile World Congress
While at MWC, visit
TI at 2A4MR and 2B3MR to learn more about the latest
communications infrastructure news, and to check out a broad range
of TI-based demos. For more information please contact: Ruwanga
Dassanayake, WW Business Manager at Ruwanga@ti.com.
For more information:
- Read the TCI6631K2L product bulletin and wireless backhaul
white paper
- Watch the TCI6631K2L product video and Ask The Experts
video
- Read the TCI6636 product bulletin
- Visit TI's new small cell website
- Keep up with the latest happenings on the Multicore Mix
blog
- Engage with engineers and TI experts on the TI E2E™
Community
- Follow TI on Twitter
- Become a fan of TI on Facebook
About TI's KeyStone multicore architecture
Texas
Instruments' KeyStone multicore architecture is the platform for
true multicore innovation, offering developers a robust portfolio
of high performance, low-power multicore devices. Unleashing
breakthrough performance, the KeyStone architecture is the
foundation upon which TI's new TMS320C66x DSP generation was
developed. KeyStone differs from any other multicore architecture
as it has the capacity to provide full processing capability
to every core in a multicore device. KeyStone-based devices are
optimized for high performance markets including wireless base
stations, mission critical, test and automation, medical imaging
and high performance computing. Learn more at
www.ti.com/multicore.
About Airspan Networks Inc.
Airspan (OTC Markets:
AIRO) is a leading 4G LTE Small Cell solution provider, with over
1000 customers in over 100 countries. Airspan is regularly
recognized as a leader and pioneer in 4G LTE and Small Cell
technologies. Airspan has an expansive product portfolio, which
includes indoor and outdoor Pico cells, and all-outdoor, compact
Micro and Macro base stations, a wide variety of user devices,
and advanced core network products. These connectivity solutions
operate in bands from 400 MHz up to 6.4 GHz. For more information
see www.airspan.com.
About Texas Instruments
Texas Instruments Incorporated
(TI) is a global semiconductor design and manufacturing company
that develops analog ICs and embedded processors. By employing the
world's brightest minds, TI creates innovations that shape the
future of technology. TI is helping more than 100,000
customers transform the future, today. Learn more at
www.ti.com.
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SOURCE Texas Instruments