Aehr Test Systems to Participate at Craig-Hallum Alpha Select Virtual Conference on November 17, 2020
12 November 2020 - 11:30PM
Aehr Test Systems (
NASDAQ: AEHR),
a worldwide supplier of semiconductor test and reliability
qualification equipment, today announced that it will participate
at the Craig-Hallum 11th Annual Alpha Select Virtual Conference on
Tuesday, November 17, 2020. Aehr Test President and CEO Gayn
Erickson and CFO Ken Spink will be hosting virtual meetings with
investors throughout the day.
“We look forward to discussing our semiconductor wafer level and
singulated die test and burn-in solutions and the markets they
serve with investors,” said Mr. Erickson. “Aehr Test provides
complete production solutions for improving yield and reliability
of semiconductors, and devices such as silicon carbide
semiconductors used in electric and hybrid electric vehicles,
silicon photonics devices used in data centers and 5G
infrastructure, and 2D/3D and other sensors used in mobile and
wearable applications, which are expected to be significant revenue
drivers for our products this fiscal year and next.”
For additional information, or to schedule a virtual meeting
with Aehr management, please contact your Craig-Hallum
representative, or Aehr’s investor relations firm, MKR Investor
Relations, at aehr@mkr-group.com.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has installed over 2,500 systems worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPakTM Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP and FOX-NP systems are full wafer contact and singulated
die/module test and burn-in systems used for burn-in and functional
test of complex devices, such as leading-edge memories, digital
signal processors, microprocessors, microcontrollers,
systems-on-a-chip, and integrated optical devices. The FOX-CP
system is a new low-cost single-wafer compact test and reliability
verification solution for logic, memory and photonic devices and
the newest addition to the FOX-P product family. The WaferPak
contactor contains a unique full wafer probe card capable of
testing wafers up to 300mm that enables IC manufacturers to perform
test and burn-in of full wafers on Aehr Test FOX systems. The
DiePak Carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of
both bare die and modules. For more information, please visit Aehr
Test Systems’ website at www.aehr.com.
Contacts: |
|
|
|
Aehr Test Systems |
MKR Investor Relations Inc. |
Ken Spink |
Todd Kehrli or Jim Byers |
Chief Financial Officer |
Analyst/Investor Contact |
(510) 623-9400 x309 |
(323) 468-2300 |
|
aehr@mkr-group.com |
Aehr Test Systems (NASDAQ:AEHR)
Historical Stock Chart
From Apr 2024 to May 2024
Aehr Test Systems (NASDAQ:AEHR)
Historical Stock Chart
From May 2023 to May 2024