Aehr Receives Order from New Customer for FOX™ Wafer Level Burn-in System for Silicon Carbide Semiconductors for Electric Vehicles
13 October 2022 - 10:30PM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor production test and reliability
qualification equipment, today announced it has received
purchase orders from a new customer for a FOX-NPTM multi-wafer test
and burn-in system, multiple WaferPakTM Contactors and a FOX
WaferPak Aligner to be used for qualification of their silicon
carbide devices for electric vehicles. The order for WaferPaks from
this customer was announced during Aehr’s earnings conference call
last week. This company is a multibillion-dollar annual revenue
global manufacturer of semiconductors that is currently supplying
silicon based MOSFETs for the automotive industry.
This FOX system is configured for High Temperature Gate Bias
(HTGB) and High Temperature Reverse Bias (HTRB) stress testing and
burning in of silicon carbide devices on 150mm and 200mm wafers
using Aehr’s proprietary WaferPak full wafer Contactors. The FOX
system, WaferPaks, and WaferPak Aligner are scheduled to ship
within the next six months.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “Our momentum in silicon carbide wafer level burn-in
continues to increase, and we are very excited that this new
customer has chosen Aehr’s FOX full wafer test and burn-in solution
in a very short period of time. The company already has experience
in power semiconductors and quickly understood the value
proposition of being able to test and burn-in 100% of their devices
at wafer level.
“Multiple forecasts are projecting tremendous growth in the
silicon carbide market, and we are excited to also be attracting
semiconductor companies who are relatively new to the silicon
carbide market and see them recognize how our unique and
cost-effective solutions can accelerate their time to market
as they compete for market share.
“The FOX-NP system is a dual-wafer system that is fully
compatible with the volume production FOX-XP, which can be
configured with up to nine or eighteen wafers depending on the
customer’s specific test requirements and power configuration. This
allows our customers to bring up initial production for customer
qualifications as well as maintain 100% compatibility of systems,
WaferPaks, test programs, and results between both new product
introduction systems and volume production systems at facilities
located around the world.
“Aehr is ramping our production capacity for both systems and
full wafer WaferPak Contactors to meet the anticipated demand we
see for several market applications, and particularly for the
enormous growth projected in silicon carbide power MOSFETs to meet
the needs of the traction power inverter that drives electric
vehicle engines as well as the on-board and off-board chargers for
electric vehicles. These applications require an extremely high
level of quality and reliability and, due to the higher than
acceptable extrinsic or early failure rates of silicon carbide
devices used in power conversion, the industry widely acknowledges
the need for 100% burn-in of these devices before they are used in
electric vehicles. Customers use Aehr’s FOX multi-wafer systems to
test and burn-in their devices at elevated temperatures and voltage
biases for up to 24 hours or more per wafer to remove weak devices
that otherwise would fail in the end use application. Failure of
the power inverters in an electric vehicle can create what we call
a ‘walk home event,’ which is where upon certain device failures,
the passengers and driver of the electric vehicle may be forced to
get out of the vehicle and walk home.
“The FOX family of compatible systems including the FOX-NP and
FOX-XP multi-wafer test and burn in systems and Aehr’s proprietary
WaferPak full wafer Contactors provide a uniquely cost-effective
solution for burning in multiple wafers of devices at a single time
to remove early life failures of silicon carbide devices, which is
critical to meeting the initial quality and long-term reliability
the automotive, industrial, and electrification infrastructure
industry needs.”
The FOX-XP and FOX-NP systems, available with multiple WaferPak
Contactors (full wafer test) or multiple DiePakTM Carriers
(singulated die/module test) configurations, are capable of
functional test and burn-in/cycling of devices such as silicon
carbide and gallium nitride power semiconductors, silicon photonics
as well as other optical devices, 2D and 3D sensors, flash
memories, magnetic sensors, microcontrollers, and other
leading-edge ICs in either wafer form factor, before they are
assembled into single or multi-die stacked packages, or in
singulated die or module form factor.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in semiconductor devices in wafer level,
singulated die, and package part form, and has installed over 2,500
systems worldwide. Increased quality and reliability needs of the
Automotive and Mobility integrated circuit markets are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products in package, wafer level, and
singulated die/module level test. Aehr Test has developed and
introduced several innovative products, including the ABTSTM and
FOX-PTM families of test and burn-in systems and FOX WaferPakTM
Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP and FOX-NP systems are full wafer contact and singulated
die/module test and burn-in systems used for burn-in and functional
test of complex devices, such as leading-edge silicon carbide-based
power semiconductors, memories, digital signal processors,
microprocessors, microcontrollers, systems-on-a-chip, and
integrated optical devices. The FOX-CP system is a new low-cost
single-wafer compact test and reliability verification solution for
logic, memory and photonic devices and the newest addition to the
FOX-P product family. The WaferPak Contactor contains a unique full
wafer probe card capable of testing wafers up to 300mm that enables
IC manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Safe Harbor StatementThis press release
contains certain forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934. Forward-looking statements
generally relate to future events or Aehr’s future financial or
operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
"may," "will," "should," "expects," "plans," "anticipates,” “going
to,” "could," "intends," "target," "projects," "contemplates,"
"believes," "estimates," "predicts," "potential," or "continue," or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. Forward-looking statements in this press release
include, but are not limited to, future requirements and orders of
Aehr’s new and existing customers; bookings forecasted for
proprietary WaferPakTM and DiePak consumables; and expectations
related to long-term demand for Aehr’s productions and the
attractiveness of key markets. The forward-looking statements
contained in this press release are also subject to other risks and
uncertainties, including those more fully described in Aehr’s
recent Form 10-K, 10-Q and other reports filed from time to time
with the Securities and Exchange Commission. Aehr disclaims any
obligation to update information contained in any forward-looking
statement to reflect events or circumstances occurring after the
date of this press release.
Contacts:
Aehr Test Systems |
MKR Investor Relations Inc. |
Vernon Rogers |
Todd Kehrli or Jim Byers |
EVP of Sales & Marketing |
Analyst/Investor Contact |
(510) 623-9400 x215 |
(213) 277-5550 |
vrogers@aehr.com |
aehr@mkr-group.com |
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