AMD (NASDAQ: AMD) held the virtual Accelerated Data Center
Premiere, launching the new AMD Instinct™ MI200 series
accelerators, the world’s fastest accelerator for high performance
computing (HPC) and artificial intelligence (AI) workloadsi, and
provided a preview of the innovative 3rd Gen AMD EPYC™ processors
with AMD 3D V-Cache. AMD also revealed new information about its
next generation “Zen 4” processor core and announced the new “Zen
4c” processor core, both of which will power future AMD server
processors and are designed to extend the company’s leadership
products for the data center.
“We are in a high-performance computing megacycle that is
driving demand for more compute to power the services and devices
that impact every aspect of our daily lives,” said Dr. Lisa Su,
president and CEO, AMD. “We are building significant momentum in
the data center with our leadership product portfolio, including
Meta’s adoption of AMD EPYC to power their infrastructure and the
buildout of Frontier, the first U.S. exascale supercomputer which
will be powered by EPYC and AMD Instinct processors. In addition,
today we announced a breadth of new products that build on that
momentum in next-generation EPYC processors with new innovations in
design, leadership, 3D packaging technology, and 5 nm
high-performance manufacturing to further extend our leadership for
cloud, enterprise and HPC customers.”
Meta Adopts EPYC CPUs [03:09 –
05:29]AMD announced Meta is the latest major
hyperscale cloud company that has adopted AMD EPYC CPUs to power
its data centers. AMD and Meta worked together to define an open,
cloud-scale, single-socket server designed for performance and
power efficiency, based on the 3rd Gen EPYC processor. Further
details will be discussed at the Open Compute Global Summit later
this week.
Advanced Packaging Driving Data Center Performance
[05:35 – 18:00]AMD previewed the use of innovative 3D
chiplet packaging technology in the data center with the first
server CPU using high-performance 3D die stacking. The 3rd Gen AMD
EPYC processors with AMD 3D V-Cache, codenamed “Milan-X,”
represents an innovative step forward in CPU design and packaging,
and will offer a 50% average performance uplift across targeted
technical computing workloadsii.
- 3rd Gen EPYC with AMD 3D V-Cache will offer the same
capabilities and features as the 3rd Gen EPYC processors and they
will be drop-in compatible with a BIOS upgrade, delivering easy
adoption and performance enhancements.
- Microsoft Azure HPC virtual machines featuring 3rd Gen EPYC
with AMD 3D V-Cache are available today in Private Preview, with
broad rollout in the coming weeks. More information on performance
and availability is available here.
- 3rd Gen EPYC CPUs with AMD 3D V-Cache will launch in Q1 2022.
Partners including Cisco, Dell Technologies, Lenovo, HPE and
Supermicro are planning to offer server solutions with these
processors.
Delivering Exascale Class Performance for Accelerated
Computing [18:02 – 31:50] AMD launched the AMD Instinct
MI200 series accelerators. Based on the AMD CDNA™ 2 architecture,
the MI200 series accelerators are the most advanced accelerators in
the worldiii and provide up to 4.9x higher peak performance for HPC
workloadsiv and 1.2X higher peak flops of mixed precision
performance for leadership AI training, helping to fuel the
convergence of HPC and AI.
- Utilized in the Frontier supercomputer at Oak Ridge National
Laboratory, the HPC and AI performance capabilities in AMD Instinct
MI200 series accelerators will be key in enabling researchers and
scientists to accelerate their time to science and discovery.
“Zen 4” Powered Data Center, Designed for Leadership
Performance [31:52 – 36:22]AMD provided new details on the
expanded next generation AMD EPYC processors codenamed “Genoa” and
“Bergamo.”
- “Genoa” is expected to be the world’s highest performance
processor for general purpose computing. It will have up to 96
high-performance “Zen 4” cores produced on optimized 5nm
technology, and will support the next generation of memory and I/O
technologies with DDR5 and PCIe® 5. “Genoa” will also include
support for CXL, enabling significant memory expansion capabilities
for data center applications. “Genoa” is on track for production
and launch in 2022.
- “Bergamo” is a high-core count CPU, tailor made for cloud
native applications, featuring 128 high performance “Zen 4c” cores.
AMD optimized the new “Zen 4c” core for cloud-native computing,
tuning the core design for density and increased power efficiency
to enable higher core count processors with breakthrough
performance per-socket. “Bergamo” comes with all the same software
and security features and is socket compatible with “Genoa.”
“Bergamo” is on track to ship in the first half of 2023.
You can watch the full video here and learn more about all of
the products discussed during the event here.
Supporting Resources
- Learn more about the AMD Instinct™ accelerators
- Learn more about AMD EPYC™ processors
- Learn more about the Oak Ridge National Laboratory’s Frontier
supercomputer
- Become a fan of AMD on Facebook
- Follow AMD on Twitter
- Connect with AMD On LinkedIn
About AMD For more than 50 years AMD has driven
innovation in high-performance computing, graphics and
visualization technologies ― the building blocks for gaming,
immersive platforms and the datacenter. Hundreds of millions of
consumers, leading Fortune 500 businesses and cutting-edge
scientific research facilities around the world rely on AMD
technology daily to improve how they live, work and play. AMD
employees around the world are focused on building great products
that push the boundaries of what is possible. For more information
about how AMD is enabling today and inspiring tomorrow, visit the
AMD (NASDAQ: AMD)
website, blog, Facebook, LinkedIn
and Twitter pages.
AMD, the AMD Arrow logo, EPYC, AMD Instinct, Infinity
Fabric and combinations thereof are trademarks of Advanced Micro
Devices, Inc. PCIe is a registered trademark of PCI-SIG
Corporation. Other names are for informational purposes only and
may be trademarks of their respective owners.
This press release contains forward-looking statements
concerning Advanced Micro Devices, Inc. (AMD) such as the features,
functionality, performance, availability, timing and expected
benefits of AMD products including the 3rd Gen AMD EPYC™ processors
with AMD 3D V-Cache and AMD Instinct™ MI200 series accelerators as
well as the “Zen 4” data center roadmap, which are made pursuant to
the Safe Harbor provisions of the Private Securities Litigation
Reform Act of 1995. Forward-looking statements are commonly
identified by words such as "would," "may," "expects," "believes,"
"plans," "intends," "projects" and other terms with similar
meaning. Investors are cautioned that the forward-looking
statements in this press release are based on current beliefs,
assumptions and expectations, speak only as of the date of this
press release and involve risks and uncertainties that could cause
actual results to differ materially from current expectations. Such
statements are subject to certain known and unknown risks and
uncertainties, many of which are difficult to predict and generally
beyond AMD's control, that could cause actual results and other
future events to differ materially from those expressed in, or
implied or projected by, the forward-looking information and
statements. Material factors that could cause actual results to
differ materially from current expectations include, without
limitation, the following: Intel Corporation’s dominance of the
microprocessor market and its aggressive business practices; global
economic uncertainty; loss of a significant customer; impact of the
COVID-19 pandemic on AMD’s business, financial condition and
results of operations; competitive markets in which AMD’s products
are sold; market conditions of the industries in which AMD products
are sold; cyclical nature of the semiconductor industry; quarterly
and seasonal sales patterns; AMD's ability to adequately protect
its technology or other intellectual property; unfavorable currency
exchange rate fluctuations; ability of third party manufacturers to
manufacture AMD's products on a timely basis in sufficient
quantities and using competitive technologies; availability of
essential equipment, materials, substrates or manufacturing
processes; ability to achieve expected manufacturing yields for
AMD’s products; AMD's ability to introduce products on a timely
basis with expected features and performance levels; AMD's ability
to generate revenue from its semi-custom SoC products; potential
security vulnerabilities; potential security incidents including IT
outages, data loss, data breaches and cyber-attacks; uncertainties
involving the ordering and shipment of AMD’s products; AMD’s
reliance on third-party intellectual property to design and
introduce new products in a timely manner; AMD's reliance on
third-party companies for design, manufacture and supply of
motherboards, software and other computer platform components;
AMD's reliance on Microsoft and other software vendors' support to
design and develop software to run on AMD’s products; AMD’s
reliance on third-party distributors and add-in-board partners;
impact of modification or interruption of AMD’s internal business
processes and information systems; compatibility of AMD’s products
with some or all industry-standard software and hardware; costs
related to defective products; efficiency of AMD's supply chain;
AMD's ability to rely on third party supply-chain logistics
functions; AMD’s ability to effectively control sales of its
products on the gray market; impact of government actions and
regulations such as export administration regulations, tariffs and
trade protection measures; AMD’s ability to realize its deferred
tax assets; potential tax liabilities; current and future claims
and litigation; impact of environmental laws, conflict
minerals-related provisions and other laws or regulations; impact
of acquisitions, joint ventures and/or investments on AMD's
business, including the announced acquisition of Xilinx, and
ability to integrate acquired businesses; AMD’s ability to complete
the Xilinx merger; impact of the announcement and pendency of the
Xilinx merger on AMD’s business; impact of any impairment of the
combined company’s assets on the combined company’s financial
position and results of operation; restrictions imposed by
agreements governing AMD’s notes and the revolving credit facility;
AMD's indebtedness; AMD's ability to generate sufficient cash to
meet its working capital requirements or generate sufficient
revenue and operating cash flow to make all of its planned R&D
or strategic investments; political, legal, economic risks and
natural disasters; future impairments of goodwill and technology
license purchases; AMD’s ability to attract and retain qualified
personnel; AMD’s stock price volatility; and worldwide political
conditions. Investors are urged to review in detail the risks and
uncertainties in AMD’s Securities and Exchange Commission filings,
including but not limited to AMD’s most recent reports on Forms
10-K and 10-Q.
i MI200-01: World’s fastest data center GPU is the AMD Instinct™
MI250X. Calculations conducted by AMD Performance Labs as of Sep
15, 2021, for the AMD Instinct™ MI250X (128GB HBM2e OAM module)
accelerator at 1,700 MHz peak boost engine clock resulted in 95.7
TFLOPS peak theoretical double precision (FP64 Matrix), 47.9 TFLOPS
peak theoretical double precision (FP64), 95.7 TFLOPS peak
theoretical single precision matrix (FP32 Matrix), 47.9 TFLOPS peak
theoretical single precision (FP32), 383.0 TFLOPS peak theoretical
half precision (FP16), and 383.0 TFLOPS peak theoretical Bfloat16
format precision (BF16) floating-point performance. Calculations
conducted by AMD Performance Labs as of Sep 18, 2020 for the AMD
Instinct™ MI100 (32GB HBM2 PCIe® card) accelerator at 1,502 MHz
peak boost engine clock resulted in 11.54 TFLOPS peak theoretical
double precision (FP64), 46.1 TFLOPS peak theoretical single
precision matrix (FP32), 23.1 TFLOPS peak theoretical single
precision (FP32), 184.6 TFLOPS peak theoretical half precision
(FP16) floating-point performance. Published results on the NVidia
Ampere A100 (80GB) GPU accelerator, boost engine clock of 1410 MHz,
resulted in 19.5 TFLOPS peak double precision tensor cores (FP64
Tensor Core), 9.7 TFLOPS peak double precision (FP64). 19.5 TFLOPS
peak single precision (FP32), 78 TFLOPS peak half precision (FP16),
312 TFLOPS peak half precision (FP16 Tensor Flow), 39 TFLOPS peak
Bfloat 16 (BF16), 312 TFLOPS peak Bfloat16 format precision (BF16
Tensor Flow), theoretical floating-point performance. The TF32 data
format is not IEEE compliant and not included in this comparison.
https://www.nvidia.com/content/dam/en-zz/Solutions/Data-Center/nvidia-ampere-architecture-whitepaper.pdf,
page 15, Table 1.ii MLNX-021R: AMD internal testing as of
09/27/2021 on 2x 64C 3rd Gen EPYC with AMD 3D V-Cache (Milan-X)
compared to 2x 64C AMD 3rd Gen EPYC 7763 CPUs using cumulative
average of each of the following benchmark’s maximum test result
score: ANSYS® Fluent® 2021.1, ANSYS® CFX® 2021.R2, and Altair
Radioss 2021. Results may vary.iii MI200-31: As of October 20th,
2021, the AMD Instinct™ MI200 series accelerators are the “Most
advanced server accelerators (GPUs) for data center,” defined as
the only server accelerators to use the advanced 6nm manufacturing
technology on a server. AMD on 6nm for AMD Instinct MI200 series
server accelerators. Nvidia on 7nm for Nvidia Ampere A100 GPU.
https://developer.nvidia.com/blog/nvidia-ampere-architecture-in-depth/iv
MI200-02: Calculations conducted by AMD Performance Labs as of Sep
15, 2021, for the AMD Instinct™ MI250X accelerator (128GB HBM2e OAM
module) at 1,700 MHz peak boost engine clock resulted in 95.7
TFLOPS peak double precision matrix (FP64 Matrix) theoretical,
floating-point performance. Published results on the NVidia Ampere
A100 (80GB) GPU accelerator resulted in 19.5 TFLOPS peak double
precision (FP64 Tensor Core) theoretical, floating-point
performance. Results found at:
https://www.nvidia.com/content/dam/en-zz/Solutions/Data-Center/nvidia-ampere-architecture-whitepaper.pdf,
page 15, Table 1.
Contact:
Aaron Grabein
AMD Communications
(512) 602-8950
aaron.grabein@amd.com
Laura Graves
AMD Investor Relations
(408) 749-5467
laura.graves@amd.com
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