Invensas BVA® Technology Enables Low Cost, Low
Profile, Scalable Package-on-Package Solution for Future
Generations of Application Processors and SiP Solutions
Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that
its wholly owned subsidiary Invensas Corporation signed a new
technology license and development agreement with Advanced
Semiconductor Engineering, Inc. ("ASE") (TAIEX:2311, NYSE:ASX), the
world’s largest semiconductor assembly and test service provider,
to collaborate on the development and commercialization of Invensas
Bond Via Array™ (BVA®) technology. ASE will move to the final stage
of qualification of Invensas BVA® vertical interconnect technology
for Package-on-Package (PoP) applications and begin engaging
customers. With Invensas BVA technology, ASE will be able to meet
its customers’ desire for low profile and low cost PoP solutions
for current and future generations of application processors aimed
at smartphones and tablets.
Consumer demand for smaller and more advanced mobile electronics
creates ever more challenging requirements for chip packaging
technologies. Overall package height and assembly cost must be
maintained or reduced while accommodating larger and higher
performance application processors. Invensas BVA technology enables
device manufacturers to address these competing needs, delivering
better performance in smaller packages, all while using existing
wire bonding manufacturing infrastructure.
“Tessera is a valued partner for ASE, and we are pleased to
expand the technology and business relationship between our two
companies,” said Tien Wu, Chief Operating Officer of ASE. “The
Invensas BVA technology will enable us to deliver advanced
packaging solutions that will enable us to continue to satisfy our
customers’ requirements for integrated, low profile, cost-effective
advanced packaging solutions.”
Invensas BVA technology provides the industry with unmatched
tolerance to process variations, which translates into improved
yield and cost efficiencies. Further, this technology can be used
to provide a cost effective 3D interconnect solution, for
System-in-Package (SiP) and a range of other applications.
“We are excited to enter into this agreement with ASE and look
forward to continuing to work closely together to proliferate
Invensas BVA and future technologies into the market,” said Tom
Lacey, CEO, Tessera Technologies, Inc. “This agreement paves the
way for both companies to deliver next-generation packaging
solutions for a diverse range of end products, including
smartphones, tablets, and other mobile electronics.”
The companies anticipate that advanced packaging capabilities
featuring Invensas BVA technology will be available to ASE
customers in the second half of 2016. For more information on
Invensas BVA technology and other Invensas solutions, please visit
www.invensas.com or www.tessera.com.
About Tessera Technologies, Inc.
Tessera Technologies, Inc., including its Invensas and
FotoNation subsidiaries, licenses technologies and
intellectual property to customers for use in areas such as mobile
computing and communications, memory and data storage, and 3D-IC
technologies, among others. Our technologies include semiconductor
packaging and interconnect solutions, and products and solutions
for mobile and computational imaging, including our LifeFocusTM,
FaceToolsTM, FacePowerTM, FotoSavvyTM, DigitalApertureTM, face
beautification, red-eye removal, High Dynamic Range,
autofocus, panorama, and image stabilization intellectual property.
For more information call +1.408.321.6000 or
visit www.tessera.com or www.invensas.com.
Tessera, the Tessera logo, Invensas, the Invensas logo,
BVA, FotoNation, the FotoNation logo, FaceSavvy,
FaceTools, FacePower, DigitalAperture, and LifeFocus are trademarks
or registered trademarks of affiliated companies of Tessera
Technologies, Inc. in the United States and other
countries. All other company, brand and product names may be
trademarks or registered trademarks of their respective
companies.
About ASE Group
Advanced Semiconductor Engineering, Inc. (ASE Group) is the
world's largest provider of independent semiconductor manufacturing
services in assembly, test, materials and design manufacturing. As
a global leader geared toward meeting the industry’s ever-growing
needs for faster, smaller and higher performance chips, ASE
develops and offers a wide portfolio of technology and solutions
including IC test program design, front-end engineering test, wafer
probe, wafer bump, substrate design and supply, wafer level
package, flip chip, System in Package (SiP), final test and
electronic manufacturing services. ASE generated sales revenues of
US $8.64 billion in 2015 and employs over 65,000 people worldwide.
For more information about ASE Group,
visit www.aseglobal.com.
Safe Harbor Statement
This press release contains forward-looking statements, which
are made pursuant to the safe harbor provisions of the Private
Securities Litigation Reform Act of 1995. Forward-looking
statements involve risks and uncertainties that could cause actual
results to differ significantly from those projected, particularly
with respect to the characteristics, benefits, and features of BVA
technology and the use of such technologies by ASE. Material
factors that may cause results to differ from the statements made
include the plans or operations relating to the businesses
of Tessera Technologies, Inc. (the "Company"); market or
industry conditions; changes in patent laws, regulation or
enforcement, or other factors that might affect the Company's
ability to protect or realize the value of its intellectual
property; the expiration of license agreements and the cessation of
related royalty income; the failure, inability or refusal of
licensees to pay royalties; initiation, delays, setbacks or losses
relating to the Company's intellectual property or intellectual
property litigations, or invalidation or limitation of key patents;
fluctuations in operating results due to the timing of new license
agreements and royalties, or due to legal costs; the risk of a
decline in demand for semiconductors and products
utilizing FotoNation technologies; failure by the
industry to use technologies covered by the Company's patents; the
expiration of the Company's patents; the Company's ability to
successfully complete and integrate acquisitions of businesses; the
risk of loss of, or decreases in production orders from, customers
of acquired businesses; financial and regulatory risks associated
with the international nature of the Company's businesses; failure
of the Company's products to achieve technological feasibility or
profitability; failure to successfully commercialize the Company's
products; changes in demand for the products of the Company's
customers; limited opportunities to license technologies due to
high concentration in the markets for semiconductors and related
products and smartphone imaging; and the impact of competing
technologies on the demand for the Company's technologies. You are
cautioned not to place undue reliance on the forward-looking
statements, which speak only as of the date of this release. The
Company's filings with the Securities and Exchange Commission,
including its Annual Report on Form 10-K for the year
ended Dec. 31, 2015, include more information about factors
that could affect the Company's financial results. The Company
assumes no obligation to update information contained in this press
release. Although this release may remain available on the
Company's website or elsewhere, its continued availability does not
indicate that the Company is reaffirming or confirming any of the
information contained herein.
TSRA-I
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version on businesswire.com: http://www.businesswire.com/news/home/20160502005405/en/
Zeno GroupDan Sorensen, +1
650-801-0944dan.sorensen@zenogroup.com
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