Inspire Semiconductor Holdings Inc. (TSXV: INSP)
(“
InspireSemi” or the “
Company”),
a chip design company that has built a technology foundation to
deliver revolutionary performance, today announced that it has
entered into a short-term unsecured loan agreement (the
“
Loan Agreement”) with a consortium of lenders led
by James J. Hickman, the chair of the Company’s board of directors
(collectively, the “
Lenders”), providing for up to
US$1,000,000, maturing on March 6, 2024 (the
“
Loan”). The Company may take drawdowns under the
Loan Agreement at any time during the term of the Loan Agreement at
its discretion. Borrowings under the Loan Agreement shall bear no
interest for the first 6 months from the date execution of the Loan
Agreement, and shall bear interest at a rate of 9%, per annum
thereafter. Interest and principal under the Loan Agreement shall
be repayable at maturity, and the Company shall have the right to
repay all or any portion of the Loan at any time prior to maturity
with no penalty upon notice to the Lenders. The proceeds from the
Loan will be used to support the Company’s go-forward strategy and
general working capital needs.
Pursuant to Multilateral Instrument 61-101 –
Protection of Minority Security Holders in Special Transactions
(“MI 61-101”), as one or more of the Lenders is a
related party of the Company, the Loan to InspireSemi is considered
a “related party transaction”. The Company is relying on the formal
valuation exemption in section 5.5(a) of MI 61-101 and upon the
minority approval exemption in section 5.7(1)(a) of MI 61-101 on
the basis that, at the time the Loan Agreement is entered into,
neither the fair market value of the fair market value of the Loan,
nor the fair market value of the consideration therefor, insofar as
it involves related parties will exceed 25% of the Company's market
capitalization as determined in accordance with MI 61-101.
A material change report will be filed less than
21 days before the execution of the Loan Agreement. This shorter
period is reasonable and necessary in the circumstances to allow
the Company to enter into the Loan Agreement in a timely
manner.
Shares for Debt
In addition to the Loan Agreement, the Company
has negotiated a shares for debt settlement whereby it shall
convert C$47,000 of debt owing in connection with the termination
of a banking firm advisory agreement entered into on or about
October 17, 2022, into 335,714 subordinate voting shares of the
Company (the “SVS”) at a price of C$0.14 per SVS
(the “Debt Settlement”). The SVS issued pursuant
to the Debt Settlement are subject to a minimum hold period of four
months and one day from the date of issuance. The Debt Settlement
remains subject to the approval of the TSX Venture Exchange.
About InspireSemi
InspireSemi is an Austin-based chip design
company that has built a technology foundation that delivers
revolutionary performance, energy efficiency, versatility, and a
thriving open software ecosystem. This enables us to address
multiple diversified, uncorrelated markets of High-Performance
Computing (HPC), AI, and blockchain. Led by an accomplished team
with a proven track record, it has a unique and strongly
differentiated accelerated computing solution compared to existing
approaches for these markets
For more information, visit
https://inspiresemi.com/
Follow InspireSemi on LinkedIn
Investor Relations ContactPhil
Carlson/Scott EcksteinKCSA Strategic
Communicationinspiresemi@kcsa.com
Company ContactJohn B. Kennedy,
CFO(737) 471-3230jkennedy@inspiresemi.com
Cautionary Statement on Forward-Looking
Information
This press release contains certain statements
that constitute forward-looking information within the meaning of
applicable securities laws (“forward-looking statements”).
Statements concerning InspireSemi’s objectives, goals, strategies,
priorities, intentions, plans, beliefs, expectations and estimates,
and the business, operations, financial performance and condition
of InspireSemi are forward-looking statements. Often, but not
always, forward-looking information can be identified by the use of
words such as “plans”, “expects”, “is expected”, “budget”,
“scheduled”, “estimates”, “forecasts”, “intends”, “anticipates”, or
“believes” or variations (including negative variations) of such
words and phrases, or statements formed in the future tense or
indicating that certain actions, events or results “may”, “could”,
“would”, “might” or “will” (or other variations of the forgoing) be
taken, occur, be achieved, or come to pass.
Forward-looking information includes, but is not
limited to, information regarding: (i) the Company’s ability to
issue SVS pursuant to the Debt Settlement; (ii) the ability of the
Company to repay principal and interest under the Loan; and (iii)
expectations for other economic, business, and/or competitive
factors. Forward-looking information is based on currently
available competitive, financial and economic data and operating
plans, strategies or beliefs as of the date of this press release,
but involve known and unknown risks, uncertainties, assumptions and
other factors that may cause the actual results, performance or
achievements of InspireSemi, to be materially different from any
future results, performance or achievements expressed or implied by
the forward-looking information. Such factors may be based on
information currently available to the Company including
information obtained from third-party industry analysts and other
third-party sources and are based on management’s current
expectations or beliefs. Any and all forward-looking information
contained in this press release is expressly qualified by this
cautionary statement.
Investors are cautioned that forward-looking
information is not based on historical facts but instead reflects
management’s expectations, estimates or projections concerning
future results or events based on the opinions, assumptions and
estimates of management considered reasonable at the date the
statements are made. Forward-looking information reflects
management’s current beliefs and is based on information currently
available to them and on assumptions they believe to be not
unreasonable in light of all of the circumstances. In some
instances, material factors or assumptions are discussed in this
press release in connection with statements containing
forward-looking information. Such material factors and assumptions
include, but are not limited to: (i) statements relating to the
business and future activities of, and developments related to, the
Company after the date of this press release; (ii) expected
satisfaction of all conditions in connection with the Debt
Settlement, including receipt of final approval from the TSX
Venture Exchange; (iii) expectations for other economic, business,
regulatory and/or competitive factors related to the Company or the
technology industry generally; (iv) the risk factors referenced in
this press release and as described from time to time in documents
filed by the Company with Canadian securities regulatory
authorities on SEDAR at www.sedar.com; and (v) other events or
conditions that may occur in the future. Although the Company has
attempted to identify important factors that could cause actual
actions, events or results to differ materially from those
described in forward-looking information, there may be other
factors that cause actions, events or results to differ from those
anticipated, estimated or intended. Forward-looking information
contained herein is made as of the date of this press release and,
other than as required by law, the Company disclaims any obligation
to update any forward-looking information, whether as a result of
new information, future events or results or otherwise. There can
be no assurance that forward-looking information will prove to be
accurate, as actual results and future events could differ
materially from those anticipated in such statements. Accordingly,
readers should not place undue reliance on forward-looking
information.
Neither the TSX Venture Exchange nor its
Regulation Services Provider (as that term is defined in policies
of the TSX Venture Exchange) accepts responsibility for the
adequacy or accuracy of this release.
Inspire Semiconductor (TSXV:INSP)
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