SAN FRANCISCO, April 18, 2017 /PRNewswire/ -- DesignCon,
the premier conference for chip, board and systems design engineers
in the high-speed communications and semiconductor communities,
announces the recipients of its Best Paper Awards following a
successful DesignCon 2017 in Santa Clara,
CA, on January 19-21. The
winners are recognized for their outstanding contribution to the
diverse educational goals of DesignCon. To view the full list of
winners,
visit: http://ubm.io/2pvrEHk
The 2017 DesignCon Best Paper Award winners have been selected
through a two-step review process. First, the DesignCon Technical
Program Committee, which is comprised of leading experts in the
electronic design space, reviewed all papers for impact, relevance,
quality, and originality. The first-round finalists were then
judged based on attendee feedback, collected at DesignCon 2017, on
the impact of their presentation.
"Congratulations to all finalists and winners of this year's
Best Paper Awards. UBM is pleased to recognize these outstanding
papers as the best of the excellent content that DesignCon offers
its attendees," said Naomi Price,
DesignCon Conference Content Director. "Each year, this awards
program inspires engineers to strive to produce ground-breaking,
top-tier content for the technical sessions at DesignCon."
Winning papers cover four categories of design: Chip-Level
Design, Board/System-Level Design, Serial Link Design, and Power
& RF Design. A list of the winners is below:
Chip-Level
Design
|
•
|
Characterizing and
Selecting the VRM
|
|
Steve Sandler,
Picotest
|
|
|
Board/System-Level Design
|
•
|
FastBER: A Novel
Statistical Method for Arbitrary Transmitter Jitter
|
|
Yunhui Chu, Intel
Corporation
|
|
Alaeddin Aydiner,
Intel Corporation
|
|
Kai Xiao, Intel
Corporation
|
|
Beomtaek Lee, Intel
Corporation
|
|
Dan Oh, Samsung
Electronics
|
|
Oleg Mikulchenko,
Intel Corporation
|
|
Adam Norman, Intel
Corporation Rob Friar, Intel Corporation
|
|
Charles Phares, Intel
Corporation
|
|
|
•
|
Non-Destructive
Analysis and EM Model Tuning of PCB Signal Traces using the Beatty
Standard
|
|
Heidi Barnes,
Keysight Technologies
|
|
José Moreira,
Advantest
|
|
Manuel Walz,
Advantest
|
|
|
•
|
RX IBIS-AMI Model
Silicon Correlation Metrics and Model Development
Methodology
|
|
Masashi Shimanouchi,
Intel Corporation
|
|
Hsinho Wu, Intel
Corporation
|
|
Mike Peng Li, Intel
Corporation
|
|
|
Serial Link
Design
|
•
|
Exploring
Efficient Variability-Aware Analysis Method for High-Speed Digital
Link Design Using PCE
|
|
Jan B. Preibisch,
Technische Universität Hamburg-Harburg
|
|
Torsten Reuschel,
Technische Universität Hamburg-Harburg
|
|
Katharina Scharff,
Technische Universität Hamburg-Harburg
|
|
Jayaprakash
Balachandran, Cisco Systems Inc.
|
|
Bidyut Sen, Cisco
Systems Inc.
|
|
Christian Schuster,
Technische Universität Hamburg-Harburg
|
|
|
•
|
Investigation of
Mueller-Muller CDR Algorithms in PAM4 High speed Serial
Links
|
|
Yuhan Yao, Oracle
Corporation
|
|
Xun Zhang, Oracle
Corporation
|
|
Dawei Huang, Oracle
Corporation
|
|
Jianghui Su, Oracle
Corporation
|
|
Muthukumar Vairavan,
Oracle Corporation
|
|
Chai Palusa, Oracle
Corporation
|
|
|
•
|
PCIe Gen4
Standards Margin Assisted Outer Layer Equalization for Cross Lane
Optimization in a 16GT/s PCIe Link
|
|
Mohammad S. Mobin,
Broadcom Ltd
|
|
Haitao Xia, Broadcom
Ltd
|
|
Aravind Nayak,
Broadcom Ltd
|
|
Gene Saghi, Broadcom
Ltd
|
|
Christopher Abel,
Broadcom Ltd
|
|
Lane Smith, Broadcom
Ltd
|
|
Jun Yao, Broadcom
Ltd
|
|
|
Power & RF
Design
|
•
|
Cost-effective PCB
Material Characterization for High-volume Production
Monitoring
|
|
Yongjin Choi,
Hewlett-Packard Enterprise
|
|
Christopher Cheng,
Hewlett-Packard Enterprise
|
|
Yasin Damgaci,
Hewlett-Packard Enterprise
|
|
Nagaraj Godishala,
Hewlett-Packard Enterprise
|
|
Yuriy Shlepnev,
Simberian
|
|
|
•
|
Overview and
Comparison of Power Converter Stability Metrics
|
|
Joseph 'Abe' Hartman,
Oracle
|
|
Alejandro 'Alex'
Miranda, Oracle
|
|
Kavitha Narayandass,
Oracle
|
|
Alexander Nosovitski,
Oracle
|
|
Istvan Novak,
Oracle
|
|
|
•
|
RFI and Receiver
Sensitivity Analysis in Mobile Electronic Devices
|
|
Antonio Ciccomancini
Scogna, Samsung Electronics Mobile Division, HE Group
|
|
Hwanwoo Shim, Samsung
Electronics Mobile Division, HE Group
|
|
Jiheon Yu, Samsung
Electronics Mobile Division, HE Group
|
|
Chang-Yong Oh,
Samsung Electronics Mobile Division, HE Group
|
|
Seyoon Cheon, Samsung
Electronics Mobile Division, HE Group
|
|
NamSeok Oh, Samsung
Electronics Mobile Division, HE Group
|
|
Dong Sub Kim, Samsung
Electronics Mobile Division, HE Group
|
|
|
To view the entire list of recipients, including
individual researchers, please visit:
http://designcon.com/santaclara/conference/paper-award-winners
DesignCon 2018 Call for Papers
DesignCon returns to
the Santa Clara Convention Center
on January 30- February 1, 2018. Call
for Papers will begin in mid-May with submissions due by the
mid-July, 2017 deadline. To stay updated on next year's event,
visit: designcon.com
Follow DesignCon online: facebook.com/DesignCon,
@UBMDesignCon, flickr.com/photos/designcon
About DesignCon
DesignCon is the world's premier
conference for chip, board and systems design engineers in the
high-speed communications and semiconductor
communities. DesignCon, created by engineers for
engineers, takes place annually in Silicon Valley and remains the
largest gathering of chip, board and systems designers in the
country. This three-day technical conference and expo
combines technical paper sessions, tutorials, industry panels,
product demos and exhibits from the industry's leading experts and
solutions providers. More information is available at:
designcon.com/santaclara. DesignCon is organized by UBM Americas, a
part of UBM plc (UBM.L), an Events First marketing and
communications services business. For more information, visit
ubmamericas.com.
About UBM Americas
UBM Americas, a part of UBM
plc, is the largest business-to-business events and trade show
organizer in the U.S. Through a range of aligned interactive
physical and digital environments, UBM Americas increases business
effectiveness for both customers and audiences by cultivating
meaningful experiences, knowledge and connections. UBM Americas has
offices spanning North and South
America, and serves a variety of specialist industries with
dedicated events and marketing services covering everything from
fashion, tech and life sciences to advanced manufacturing, cruise
shipping, specialty chemicals, powersports and automotive,
concrete, hospitality, cargo transportation and more. For more
information, visit: www.ubmamericas.com.
To view the original version on PR Newswire,
visit:http://www.prnewswire.com/news-releases/designcon-celebrates-more-than-40-professionals-with-2017-awards-for-best-papers-300440651.html
SOURCE UBM Americas