FREMONT, Calif., July 2, 2024 /PRNewswire/ -- YES, a leading
manufacturer of process equipment for semiconductor advanced
packaging, life sciences and AR/VR applications, today announced
that Its TersOnus TGV tool was released for panel-level
manufacturing. This system will be used to support the growth of
advanced heterogeneous packaging for artificial intelligence chips
that enable large language models. The TersOnus TGV system provides
superior quality and total cost of ownership for manufacturing of
panel-level products. YES has developed the equipment and process
technologies required for high aspect ratio through glass vias for
a variety of glass types, as well as for manufacturing a diversity
of glass via configurations—such as hourglass, straight, and
tapered vias—by leveraging different chemistries. Furthermore,
these sub-50 µm vias can be created with various aspect ratios
while meeting customers specifications. The TersOnus TGV system is
being used for production of advanced 2.5D and 3D packages by the
world's leading semiconductor manufacturers.
"To accommodate performance requirements of new emerging
applications, semiconductor solutions are moving to a chiplet based
architecture that has higher interface bandwidth, larger memory and
more heat dissipation. It also requires larger substrate sizes at
the same time," said Michael Daly,
SVP of Wet BU at YES. "These large substrate sizes are not
economically possible with traditional organics materials. The
semiconductor industry is moving to Glass based substrates for
these leading-edge applications. Our Wet process tools for creating
TGVs for glass panels are fully automated and can handle multiple
panels simultaneously. In addition, our tools offer integrated
in-line metrology for process control and maintaining consistent
etch performance," Daly added.
"YES has maintained its leadership position in the advanced
packaging market segment by enabling customer roadmaps through the
delivery of superior products with low cost-of-ownership and high
reliability. The TersOnus TGV delivers on this commitment by
providing excellent etch rates and aspect ratios for the most
challenging through glass vias all the while reducing manufacturing
cycle times. The TersOnus TGV is just one of many products that YES
has introduced and will be introducing to the burgeoning glass
panel market to support AI advancement," Rezwan Lateef, President of YES concluded.
About YES
YES (Yield Engineering Systems, Inc.) is a leading manufacturer
of high-tech, cost-effective equipment for transforming surfaces,
materials and interfaces. The company's product lines include
vacuum cure ovens, chemical vapor deposition systems, and plasma
etching tools used for precise surface modification and thin-film
coating of semiconductor wafers, semiconductor and MEMS devices,
and biodevices. With YES, customers ranging from startups to
Fortune 100 companies can create and volume-produce products in a
wide range of markets, including Advanced Packaging, MEMS,
Augmented Reality/Virtual Reality and Life Sciences. YES is
headquartered in Fremont,
California, with a growing global presence. For more
information, please visit www.yieldengineering.com.
Media Contact
Alex Chow
SVP Business Development & Mktg / Asia
President
YES (Yield Engineering Systems, Inc.)
+886-926136155 direct
achow@yieldengineering.com
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