PITTSBURGH, Oct. 6, 2015 /PRNewswire/ -- TSMC has
honored ANSYS (NASDAQ: ANSS) with its 2015 Open Innovation
Platform® (OIP) Partner of the Year award for joint
development of the 10nm FinFET design infrastructure to address the
power integrity and reliability requirements for chip
applications.
The award is given to TSMC OIP partners that have made
significant contributions toward the development of design
infrastructure for their latest process technologies. ANSYS was
recognized for advanced power noise, electromigration (EM) and
thermal reliability solutions that helped enable TSMC's 10
nanometer FinFET technology deployment. This technology enables
users to innovate the next generation of system on a chip (SoC)
designs for use in emerging mobile, computing and networking
applications.
"TSMC is an industry visionary – and ANSYS is proud and humbled
to partner with this remarkable organization," said John Lee, general manager, ANSYS. "Together we
continue to help the semiconductor industry push the boundaries of
innovation and to have a positive impact on our lives."
"ANSYS has been a long-term partner to TSMC, collaborating with
us to jointly bring deep technical experience to address the new
power, EM and thermal reliability challenges associated with
next-generation products," said Suk
Lee, TSMC senior director, design infrastructure marketing
division. "This award is well deserved, and we look forward to
extending our collaboration so our customers can continue to
produce the most cutting-edge products on the planet."
About ANSYS, Inc.
ANSYS brings clarity and insight to
customers' most complex design challenges through fast, accurate
and reliable engineering simulation. Our technology enables
organizations ― no matter their industry ― to predict with
confidence that their products will thrive in the real world.
Customers trust our software to help ensure product integrity and
drive business success through innovation. Founded in 1970, ANSYS
employs over 2750 professionals, many of them expert in engineering
fields such as finite element analysis, computational fluid
dynamics, electronics and electromagnetics, embedded software,
system simulation and design optimization. Headquartered south of
Pittsburgh, U.S.A., ANSYS has more than 75 strategic sales
locations throughout the world with a network of channel partners
in 40+ countries. Visit www.ansys.com for more information.
ANSYS also has a strong presence on the major social channels.
To join the simulation conversation, please visit:
www.ansys.com/Social@ANSYS
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other
countries. All other brand, product, service and
feature names or trademarks are the property of their respective
owners.
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Contact
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Media
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Amy
Pietzak
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724.820.4367
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amy.pietzak@ansys.com
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Investors
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Annette Arribas,
CTP
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724.820.3700
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annette.arribas@ansys.com
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SOURCE ANSYS, Inc.