Ansys electro-thermal analysis tools address novel physics
requirements for signoff verification of multi-chip HPC, graphics,
and AI applications
/ Key Highlights
- Ansys collaboration to expand from single-die system-on-chip
(SoC) to include Intel's embedded multi-die interconnect bridge
(EMIB) assembly technology
- Ansys multiphysics analyses provide signoff verification of
thermal integrity, power integrity, and mechanical reliability
PITTSBURGH, Feb. 22,
2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) and
Intel Foundry collaborated to provide multiphysics signoff
solutions for Intel's innovative 2.5D chip assembly technology,
which uses EMIB technology to connect the die flexibly and without
the need for through-silicon vias (TSVs). Ansys' accurate
simulation engines deliver higher speeds, lower power consumption,
and greater reliability in advanced silicon systems for artificial
intelligence (AI), high-performance computing, autonomous driving,
and graphic processing.
Ansys RedHawk-SC Electrothermal™ is an electronic design
automation (EDA) platform that enables multiphysics analysis of
2.5D and 3D-ICs with multiple dies. It can perform thermal analysis
with anisotropic thermal conduction, which is essential for Intel's
new backside power distribution technology. Thermal gradients also
lead to mechanical stresses and warpage that can impact product
reliability over time. Power integrity verification is done through
chip/package co-simulation, which gives the 3D system-level context
needed for maximum accuracy.
"Intel's enablement of Intel 18A and EMIB technology is a
differentiated approach to multi-die assembly that has a number of
significant advantages over traditional stacking techniques," said
Rahul Goyal, vice president &
general manager, product and design ecosystem enablement at Intel.
"We will collaborate closely with Ansys to make the full benefit of
this innovation easily accessible to our joint customers so they
can create more competitive products."
"Ansys has collaborated with Intel Foundry at the leading edge
of 3D manufacturing technology to solve complex multiphysics
challenges and meet stringent thermal, mechanical, performance, and
reliability requirements," said John
Lee, vice president and general manager of the electronics,
semiconductor, and optics business unit at Ansys. "Ansys'
multiphysics signoff platform gives our mutual customers the
flexibility to adopt EMIB technology for their system architecture
and assemble the best-of-breed solutions for higher performance
products and a smooth user experience."
/ About Ansys
Our Mission: Powering Innovation that Drives Human
Advancement™
When visionary companies need to know how their world-changing
ideas will perform, they close the gap between design and reality
with Ansys simulation. For more than 50 years, Ansys software has
enabled innovators across industries to push boundaries by using
the predictive power of simulation. From sustainable transportation
to advanced semiconductors, from satellite systems to life-saving
medical devices, the next great leaps in human advancement will be
powered by Ansys.
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ANSS–T
/ Contacts
Media
|
Mary Kate
Joyce
|
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724.820.4368
|
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marykate.joyce@ansys.com
|
|
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Investors
|
Kelsey DeBriyn
|
|
724.820.3927
|
|
kelsey.debriyn@ansys.com
|
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SOURCE Ansys