New DSFP (Dual Small Form-Factor Pluggable) Transceiver Specification Released
19 September 2018 - 10:00PM
The DSFP (Dual Small Form-Factor Pluggable) MSA (Multi-Source
Agreement) Group has developed Rev. 1.0 Hardware Specification for
the DSFP form factor module. The founding companies have addressed
the technical challenges of doubling the SFP module density in the
same footprint, while ensuring mechanical and electrical
interoperability for optical transceivers produced by different
manufacturers. DSFP networking equipment will also interoperate
with existing SFP modules and cables.
The DSFP Hardware Specification Rev. 1.0 has been published on
September 12, 2018 on the DSFP MSA web site
(www.dsfpmsa.org). It includes complete electrical,
mechanical and thermal specifications for module and host card,
including connector, cage, power, and hardware I/O. Also included
are operating parameters, data rates, protocols, and supported
applications.
The DSFP MSA Group is now developing the DSFP MIS (Management
Interface Specification), which is an abridged version of the CMIS
(Common MIS) being developed by the QSFP-DD, OSFP and COBO Advisors
Group.
To address the growing port density and scalability requirements
of Wireless and 5G Mobile infrastructure, the DSFP specification
doubles the data rate and port density of SFP modules. SFP has a
single electrical lane pair operating at bit and data rates up to
28 Gbps using NRZ and 56 Gbps using PAM4. DSFP has two electrical
lane pairs, each operating at bit rates up to 26 Gbps using NRZ and
56 Gbps using PAM4, supporting aggregate date rates up to 56 Gbps
and 112 Gbps, respectively. DSFP will potentially scale to a per
lane bit rate of 112 Gbps using PAM4, supporting aggregate data
rate up to 224 Gbps. SFP modules can be plugged into DSFP ports for
backwards compatibility.
“We are very excited about the introduction of a highly
competitive new form factor by the DSFP MSA, which will double
interface bandwidth and port density while maintaining
compatibility with the existing SFP family of optics,” said
Zhoujian Li, President of Research and Development, Wireless
Networks, Huawei. “The DSFP form factor is low cost, has excellent
high-speed signal integrity, reduces PCB area and is easy to design
and manufacture. It is a great platform that enables 5G
deployment and evolution, while fully protecting our customers’
investment.”
“Publication of the DSFP Hardware Specification is part of an
industry trend of quickly developing solutions optimized for
specific applications. Stringent cost, power and size constraints
in demanding market segments, like Mobile infrastructure, leads to
solutions focused strictly on required functionality,” commented
Chris Cole, Chair of the DSFP MSA Group, and Vice President of
Advanced Development, Finisar.
“TE works closely with our customers and end equipment operators
to understand their requirements and meet the market needs”,
according to Nathan Tracy, Technologist at TE Connectivity and
Manager of Industry Standards. “The new DSFP form factor
provides a method to double data rate and channel density using the
well-established SFP mechanical geometry as a starting point.
We are pleased to be a member of the DSFP MSA and to have
contributed to the released specification.”
“There is tremendous industry pull for higher speeds and
densities on switches and servers, while maintaining backwards
compatibility. The DSFP form factor achieves this by doubling the
number of high-speed lanes in the same size package as SFP,” said
Greg McSorley, Technical Business Development Manager,
Amphenol. “The DSFP MSA did a great job in getting the
specification out quickly and efficiently. “
“As technology demands continue to evolve, Molex is delighted to
be a part of the DSFP MSA and contribute to the development of the
new form factor,” said Scott Sommers, Group Product Manager at
Molex. “With its ability to serve specific markets like Mobile base
stations, DSFP addresses this demanding segment.”
“DSFP form factor doubles bandwidth density by doubling the
number of channels in SFP size module, to support future demands of
5G network traffic,” commented Toshiyasu Ito, Senior Engineer,
Yamaichi. “We are proud to have made key contributions to turn the
DSFP concept into reality, through close cooperation with key
customers and the DSFP MSA.”
The DSFP MSA founding members are Amphenol, Finisar, Huawei,
Lumentum, Molex, NEC, TE Connectivity, and Yamaichi. Participation
of these industry leaders will enable quick adoption and ease of
use of the new form factor.
Please visit www.dsfpmsa.org for more information about the DSFP
MSA.
Caution Concerning Forward-Looking Statements
We are disclosing forward-looking information so that investors,
potential investors, and other owners can better understand the
mentioned Companies’ prospects and make informed investment
decisions. The information in this press release contains
“forward-looking statements” within the meaning of the Private
Securities Litigation Reform Act of 1995. These statements can be
identified by the fact that they do not relate strictly to
historical or current facts. Any forward-looking statement made by
the Companies speak only as of the date on which it is made. The
Companies are under no obligation to, and expressly disclaim any
obligation to, update or alter their forward-looking statements,
whether because of new information, subsequent events or
otherwise.
Media Contact Chris Cole
chris.cole@finisar.com
Finisar (NASDAQ:FNSR)
Historical Stock Chart
From Apr 2024 to May 2024
Finisar (NASDAQ:FNSR)
Historical Stock Chart
From May 2023 to May 2024