Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions
19 November 2020 - 1:00AM
Business Wire
Xilinx, Inc. (NASDAQ: XLNX) today announced a collaboration with
Texas Instruments (TI) to develop scalable and adaptable digital
front-end (DFE) solutions to increase energy efficiency of lower
antenna count radios. The solutions leverage Xilinx's adaptable IP
to enhance the RF performance and improve the power efficiency of
indoor and outdoor radio applications. By combining Xilinx's
industry-leading Zynq UltraScale+ MPSoC family and adaptable RF IP
with the AFE7769 quad-channel RF transceiver from TI, developers
can better address the OPEX and CAPEX concerns of large operators
and private networks.
The next generation of LTE and 5G small cells will need to
address many new and evolving requirements. This is driving the
need for new functionality in the radio due to the need to support
wider bandwidths and new use cases including: enhanced Mobile
Broadband, massive Machine Type Communication, and Ultra-Reliable
Low-Latency Communication. Having a radio platform that can adapt
and scale to support these new use cases is critical for
developers.
“Critical to the success of the radio platform is the efficiency
and performance of the RF power amplifier (PA). Even for low-power
small cell applications, the PA consumes over 50% of the power of a
typical next-generation radio and is therefore key to driving the
OPEX and CAPEX,” said Liam Madden, executive vice president and
general manager, Wired and Wireless Group at Xilinx. “A scalable
and adaptable DFE solution that can address current and future PA
efficiency needs is key for the advancement of 5G platforms.”
Xilinx's Adaptable Digital RF IP includes specialist
functionality of Crest Factor Reduction (CFR) and Digital
Pre-distortion (DPD). It is the only solution that can support a
wide range of radio bandwidths and carrier configurations. Also, by
being tightly integrated with the rest of the PHY processing
implemented in the Zynq UltraScale+ MPSoC device, it can handle the
increasingly complex signal dynamics of multi-RAT and 5G waveforms
which are challenging for standalone DPD implementations. The PA
technology is also evolving quickly to address these new radio
requirements with broader adoption of GaN and new architectures.
Adapting to these new technologies is key to maximizing the
efficiency of the PA.
“PA linearity for spectral efficiency and RF power delivery is
key to achieving the performance benefits of 5G New Radio systems.
Wide-bandwidth transceivers like the AFE7769 help to address
higher-order PA nonlinearities and enable more efficient power
delivery,” said Karthik Vasanth, vice president and business unit
manager, data converters, at TI. “With this implementation,
designers can address the market needs for higher instantaneous
bandwidth and antenna counts to support MIMO (multiple-input,
multiple-output) applications while also offering scalability to
meet system cost targets.”
To speed development and allow developers to evaluate these
solutions Xilinx provides a range of development platforms and
tools. To see a demonstration of a small cell 4T4R radio solution
that can cover bandwidth requirements up to 200MHz (for LTE and 5G
NR) follow the link below. The demonstration is based on the Xilinx
ZCU102 Zynq UltraScale+ MPSoC evaluation platform, the AFE7769
evaluation module (AFE7769EVM) from Texas Instruments, and 28dBm
SKY66318-21 PA from Skyworks.
More information about the collaboration can be found in the
blog here which also features a video demonstration.
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About Xilinx
Xilinx, Inc. develops highly flexible and adaptive processing
platforms that enable rapid innovation across a variety of
technologies - from the cloud, to the edge, to the endpoint. Xilinx
is the inventor of the FPGA and Adaptive SoCs (including our
Adaptive Compute Acceleration Platform, or ACAP), designed to
deliver the most dynamic computing technology in the industry. We
collaborate with our customers to create scalable, differentiated
and intelligent solutions that enable the adaptable, intelligent
and connected world of the future. For more information, visit
xilinx.com.
© Copyright 2020 Xilinx, Inc. Xilinx, the Xilinx logo and other
designated brands included herein are trademarks of Xilinx in the
United States and other countries. All other TI-related logos,
products, trademarks and registered trademarks are the property of
Texas Instruments.
Source: Xilinx Newsroom Category: Product Announcements
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