Vertiv Launches High-Density Prefabricated Modular Data Center Solution To Accelerate Global Deployment of AI Compute
25 July 2024 - 8:00PM
Business Wire
Vertiv™ MegaMod™ CoolChip solution
integrates best-in-class technologies, including high-density
liquid cooling, to deliver turnkey AI critical digital
infrastructure up to 50% faster than onsite build
With demand for AI-ready data center capacity outstripping
supply, developers and operators are focused on bringing new
capacity online as quickly as possible. To support this goal,
Vertiv (NYSE: VRT), a global provider of critical digital
infrastructure and continuity solutions, today launched the Vertiv™
MegaMod™ CoolChip, a liquid cooling-equipped prefabricated modular
(PFM) data center solution engineered to enable efficient and
reliable AI computing. The solution can be configured to support
the platforms of leading AI compute providers and scaled to
customer requirements. By bringing together the quality and process
efficiency enabled by offsite fabrication with best-in-class
AI-ready technologies, MegaMod™ CoolChip can reduce the time to
deploy AI critical digital infrastructure by up to 50%.
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Vertiv MegaMod CoolChip Solution (Photo:
Business Wire)
Building on Vertiv’s experience developing other prefabricated
modular data centers, MegaMod CoolChip is designed to address the
specific requirements of AI compute through a turnkey solution that
integrates Vertiv™ CoolChip technology to support direct-to-chip
liquid cooling, high-efficiency power protection and distribution,
and other critical digital infrastructure technologies. The
solution is available globally and can be used as a modular
retrofit of an existing facility or as a new freestanding data
center, supporting up to hundreds of kilowatts per row, up to
multiple megawatts with prefabricated units.
“MegaMod CoolChip is a fully equipped critical digital
infrastructure solution that customers can deploy quickly, and with
confidence,” said Viktor Petik, vice president of Vertiv
infrastructure solutions. “Factory assembly and testing in a
controlled environment help to accelerate the time to build, as
well as providing control over cost and schedules. The addition of
this solution to our portfolio provides more flexibility to
successfully accelerate AI.”
Designed for AI Compute
According to the latest research by Omdia, demand for
prefabricated modular and micro data center solutions has been
accelerated by AI, with Vertiv being cited as a global leader.
Vertiv engineers have applied successful learnings around
prefabricated solutions and the needs of AI deployments to the
development of Vertiv™ MegaMod™ CoolChip solutions, to support the
AI requirements of today – and tomorrow. Key features of the
solution include:
- High-density compute: MegaMod™ CoolChip supports IT
systems from the customer’s chosen AI compute provider, including
accelerated computing platforms, integrated into equipment racks
with integrated plumbing and high-density Vertiv™ rack power
distribution units (rPDUs). Customer selected integrated racks from
AI compute providers may also be consolidated into the
prefabricated units.
- High-density liquid cooling infrastructure: Vertiv™
chillers and cooling distribution units (CDUs) provide safe and
efficient management of cooling fluids to and from the rack.
MegaMod CoolChip uses direct-to-chip cooling for high-power CPUs
and GPUs by managing heat removal from components not serviced by
the direct-to-chip cold plates. The balance between liquid and air
cooling is tailored to the design of the AI compute platform to
optimize efficiency.
- High-efficiency power protection and distribution:
Vertiv™ power technologies provide power protection and
distribution from the utility to the rack, including busway,
switchgear, and compatibility with the high-efficiency Vertiv™
Trinergy™ uninterruptible power supply (UPS) and the Vertiv™
PowerNexus solution, which reduces the power system footprint
through close coupling of the UPS and switchgear.
- Modular assembly: MegaMod CoolChip arrives in
prefabricated units, including the building enclosure and all
building systems, that are assembled on site. It is also available
in skid-mounted units, providing flexibility options for new
builds, retrofits, and expansions. All of this is integrated in a
clean and controlled factory environment, mitigating risks through
assembly and testing processes.
- Single-source accountability: From initial consultation
through configuration, fabrication, installation, commissioning,
and lifecycle services, Vertiv manages all aspects of solution
development to streamline processes, reducing demands on customer
resources, and providing cost and schedule efficiencies.
The Vertiv MegaMod CoolChip solution can also enable the
sustainability goals of data center operators and developers. By
employing highly efficient advanced technologies, such as
direct-to-chip liquid cooling and the Vertiv™ power infrastructure,
MegaMod CoolChip data centers can improve Power Usage Effectiveness
(PUE) compared to data centers using traditional technologies,
resulting in a lower carbon footprint.
For more information on Vertiv™ MegaMod™ CoolChip and other
AI-ready solutions from Vertiv, visit Vertiv.com.
About Vertiv
Vertiv (NYSE: VRT) brings together hardware, software, analytics
and ongoing services to enable its customers’ vital applications to
run continuously, perform optimally and grow with their business
needs. Vertiv solves the most important challenges facing today’s
data centers, communication networks and commercial and industrial
facilities with a portfolio of power, cooling and IT infrastructure
solutions and services that extends from the cloud to the edge of
the network. Headquartered in Westerville, Ohio, USA, Vertiv does
business in more than 130 countries. For more information, and for
the latest news and content from Vertiv, visit Vertiv.com.
Forward-Looking Statements
This release contains forward-looking statements within the
meaning of the Private Securities Litigation Reform Act of 1995,
Section 27 of the Securities Act, and Section 21E of the Securities
Exchange Act. These statements are only a prediction. Actual events
or results may differ materially from those in the forward-looking
statements set forth herein. Readers are referred to Vertiv’s
filings with the Securities and Exchange Commission, including its
most recent Annual Report on Form 10-K and any subsequent Quarterly
Reports on Form 10-Q for a discussion of these and other important
risk factors concerning Vertiv and its operations. Vertiv is under
no obligation to, and expressly disclaims any obligation to, update
or alter its forward-looking statements, whether as a result of new
information, future events or otherwise.
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Sara Steindorf T +314-982-1725 E
sara.steindorf@fleishman.com
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