ACM Research Receives Orders from Major US-based Global Semiconductor Manufacturer for SAPS Single-Wafer-Cleaning Tools
02 December 2021 - 8:05AM
ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of
wafer processing solutions for semiconductor and advanced
wafer-level packaging (WLP) applications, today announced the
receipt of two orders for ACM’s Ultra C SAPS V 12-chamber cleaning
tools from a major U.S.-based global semiconductor manufacturer.
Both tools are expected to be installed in the prospective
customer’s U.S. facilities for use in its advanced processes. The
first order, scheduled for delivery in the first quarter of 2022,
is an evaluation tool to further confirm the tool’s cleaning
performance and finalize specific features. The second order,
scheduled for delivery in the second quarter of 2022, is a
production tool intended for a high-volume manufacturing line.
“These orders mark a significant milestone in ACM’s
globalization strategy and build upon recently- announced successes
from three major semiconductor manufacturers with fabs in China.
Today’s announcement demonstrates further success of ACM’s strategy
to prove our proprietary and differentiated technologies with key
customers in Asia and then expand to top-tier global players,” said
Dr. David Wang, President and Chief Executive Officer of ACM. “This
manufacturer chose ACM’s solution based in part on ACM’s ability to
meet its advanced performance specifications. We believe the
successful evaluation and deployment of these SAPS megasonic tools
can lead to larger business opportunities with this prospective
customer and other major customers in the region.”
ACM’s proprietary Space Alternated Phase Shift
(SAPS) advanced wafer-cleaning technology employs alternating
phases of megasonic waves in the gap between a megasonic transducer
and the wafer. Unlike the stationary megasonic transducers used in
previous generations of megasonic wafer-cleaning systems, SAPS
technology moves or tilts the transducer while the wafer rotates,
enabling megasonic energy to be
delivered uniformly across all points on the wafer, even
if the wafer is warped. SAPS is a faster process than conventional
megasonic cleaning and does not experience material loss or create
a rough wafer surface. SAPS achieves more thorough, comprehensive
cleaning and has been demonstrated to 1xnm DRAM devices and
beyond.
About ACM Research, Inc.ACM
develops, manufactures, and sells semiconductor process equipment
for single-wafer or batch wet cleaning, electroplating, stress-free
polishing, and thermal processes, which are critical to advanced
semiconductor device manufacturing and wafer-level packaging. The
company is committed to delivering customized, high-performance,
cost-effective process solutions that semiconductor manufacturers
can use in numerous manufacturing steps to improve productivity and
product yield. For more information, visit www.acmrcsh.com.
Forward Looking
StatementsStatements in the first and second paragraphs of
this press release with respect to the expected delivery of two
Ultra C SAPS V 12-chamber cleaning tools, and the potential for
additional sales of SAPS megasonic tools to the same customer in
the future, are not historical facts and constitute forward-looking
statements within the meaning of the Private Securities Litigation
Reform Act of 1995. These statements, which are, in the case of the
two identified tools, only expectations and, in the case of
potential future sales, only projected goals, reflect management's
current views and projections, are based on certain assumptions,
and involve risks and uncertainties. ACM may not be able to deliver
the two identified tools within its expected time frames for
reasons outside of, or unknown to, ACM, and there can be no
assurance that ACM will succeed in selling additional tools to the
customer at any time in the future. Moreover, even if ACM succeeds
in delivering the two identified tools on a timely basis, the tools
will be subject to evaluation and acceptance by the customer and
therefore there can be no assurance that the deployments will
result in revenue to ACM. ACM undertakes no obligation to publicly
update forward-looking statements to reflect events or
circumstances that occur after the date hereof or to reflect any
change in its expectations regarding these forward-looking
statements or the occurrence of unanticipated events.
SAPS, Ultra C SAPS and the ACM logo are trademarks
of ACM Research, Inc. All rights reserved.
Media
Contact:Jillian CarapellaKiterocket+1
646.402.2408jcarapella@kiterocket.com |
Company Contacts:USARobert MetterACM Research,
Inc.+1 503.367.9753 |
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ChinaXi WangACM Research (Shanghai), Inc.+86 21 50808868 |
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KoreaYY KimACM Research (Korea), Inc.+821041415171 |
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TaiwanDavid Chang+886 921999884 |
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SingaporeAdrian Ong+65 8813-1107 |
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