Turnkey integrated hardware and software
platform IP combines fully featured Bluetooth dual mode with next
generation High Data Throughput, alongside IEEE 802.15.4 for
Thread/Zigbee/Matter, and includes Ceva's state-of-the-art radio
implemented on TSMC 12nm technology
ROCKVILLE, Md., Jan. 2, 2025
/PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading
licensor of silicon and software IP that enables Smart Edge devices
to connect, sense and infer data more reliably and efficiently,
today unveiled the Ceva-Waves Links200, the first turnkey
multi-protocol platform IP to support next generation Bluetooth
High Data Throughput (HDT) technology, alongside IEEE 802.15.4 for
Zigbee, Thread and Matter. Integrating a new Ceva-developed radio
designed for TSMC's low power 12nm process, the comprehensive
Links200 solution provides a significant time-to market advantage
by removing technology barriers and risk when developing
compute-intensive smart edge SoCs that require multi-protocol
wireless connectivity based on the latest standards for hearables,
wearables and other wireless consumer electronics.
Addressing the rising market demand for faster, more efficient
Bluetooth connectivity, particularly for low-power audio and
latency-sensitive IoT applications, the breakthrough High Data
Throughput mode more than doubles the speed of traditional
Bluetooth, delivering a data rate of up to 7.5 Mbps. For this
higher speed, Links200 employs innovative HDT modulation schemes in
conjunction with Ceva's state-of-the-art radio on TSMC's 12nm
FinFET process to satisfy the stringent performance demands in a
low power solution. This leap forward in Bluetooth enables
lossless, multi-channel, low-latency audio streaming for a broad
range of devices, including TWS earbuds, headsets, smartwatches,
smart speakers, TV wireless speakers, gaming peripherals, and car
audio systems. For example, 5.1 or 7.1 surround sound systems will
be able to provide superior home entertainment audio experiences,
thanks to the high-quality, multi-channel support enabled by
Bluetooth HDT.
As part of the expanding multi-protocol Ceva-Waves Links family,
Links200 seamlessly combines Bluetooth HDT with IEEE 802.15.4
support for Zigbee, Thread, and Matter, enabling concurrent
multi-link communication through advanced coexistence schemes. The
Ceva-Waves Links family offers further integration possibilities
with Wi-Fi and Ultra-Wideband (UWB) to expand the scalability and
flexibility of the industry's most comprehensive wireless
portfolio. Strengthening Ceva's overall leadership in smart edge AI
SoCs, Links200 can be further augmented with Ceva-NeuPro-Nano NPUs,
leveraging the advanced 12nm process for efficient premium compute
intelligence.
"The introduction of the Ceva-Waves Links200 multi-protocol
platform with integrated RF technology underscores our commitment
to breaking new ground in wireless connectivity and providing our
customers with scalability and design efficiency to develop
differentiated products that meet a range of market requirements,"
said Tal Shalev, vice president and
general manager of the Wireless IoT business unit at Ceva.
"Developing Smart Edge SoCs is increasingly complex and expensive.
By providing a 'drop-in' turnkey solution to support and combine
multiple and the latest wireless protocols, our Links200 gives our
customers the flexibility to customize their solutions and focus on
innovation."
Key Features of the Ceva-Waves Links200:
- Full Bluetooth dual mode (Classic and LE) support, including
next generation High Data Throughput up to 7.5Mbps for lossless
multichannel low latency audio streaming.
- IEEE 802.15.4 support, for Zigbee, Thread and Matter
- Comprehensive Integration: Includes RF, modem, controller,
software stacks, and profiles.
- Advanced Audio Support: Supports Classic Audio, LE Audio, and
Auracast Broadcast Audio.
- Accurate and Secure Ranging: Supports Bluetooth Channel
Sounding for precise and secure ranging.
- Optimized Process: Utilizes TSMC 12nm FFC+ process, ideal for
advanced smart audio and Smart Edge AI SoCs.
- Superior Performance: Fully featured with best-in-class power
consumption, die size, and performance, with state-of-the-art RF
architecture requiring minimal external components for low bill of
materials.
- Ease of Integration: Designed for fast time to market.
- Customizable for further product differentiation, via tight
integration with Ceva's sensing and inference IPs, including
Ceva-NeuPro-Nano NPU, and Ceva-RealSpace Spatial Audio.
For more information, visit
https://www.ceva-ip.com/product/ceva-waves-links/
About Ceva, Inc.
At Ceva, we are passionate about
bringing new levels of innovation to the smart edge. Our wireless
communications, sensing and Edge AI technologies are at the heart
of some of today's most advanced smart edge products. From
Bluetooth, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust
communications, to scalable Edge AI NPU
IPs, sensor fusion processors and embedded application
software that make devices smarter, we have the broadest portfolio
of IP to connect, sense and infer data more reliably and
efficiently. We deliver differentiated solutions that combine
outstanding performance at ultra-low power within a very small
silicon footprint. Our goal is simple – to deliver the silicon and
software IP to enable a smarter, safer, and more interconnected
world. This philosophy is in practice today, with Ceva powering
more than 17 billion of the world's most innovative smart edge
products from AI-infused smartwatches, IoT devices and wearables to
autonomous vehicles and 5G mobile networks.
Our headquarters are in Rockville,
Maryland with a global customer base supported by operations
worldwide. Our employees are among the leading experts in their
areas of specialty, consistently solving the most complex design
challenges, enabling our customers to bring innovative smart edge
products to market.
Ceva: Powering the Smart Edge™
Visit us at www.ceva-ip.com and follow us on LinkedIn, X,
YouTube, Facebook, and Instagram.
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SOURCE Ceva, Inc.
